scholarly journals On the holistic validation of electronic materials compound for irradiation study - Experimental and calculated results

2020 ◽  
Vol 326 (1) ◽  
pp. 11-24
Author(s):  
Thomas Frosio ◽  
Nabil Menaa ◽  
Matteo Magistris ◽  
Chris Theis

Abstract Due to the large variations of chemical compositions in electronic material, the estimation of the radionuclide inventory following irradiation represents a technical challenge at CERN high-energy particle accelerators. In particular, the activation of printed circuit boards is of concern to the CERN experiments as they are widely used for various purposes ranging from safety systems to sub-detector controls. Because of maintenance operations, part of this equipment has to be removed from the accelerator machines. The literature provides a variety of compositions for electronic materials, leaving the problematic selection of the most appropriate composition for an activation study to the reader. In this article, we discuss two reference chemical compositions on the basis of a statistical analysis of large datasets of gamma spectroscopy results, and on ActiWiz calculations which take into account different activation scenarios at CERN. These results can be extended to electronic material irradiated in other particle accelerators.

Sensors ◽  
2022 ◽  
Vol 22 (2) ◽  
pp. 623
Author(s):  
Arkadiusz Dąbrowski ◽  
Witold Nawrot ◽  
Mateusz Czok ◽  
Michał Babij ◽  
Piotr Bielówka ◽  
...  

The Low Temperature Cofired Ceramic (LTCC) technology has proven to be highly suitable for 3D microstructures manufacturing in electronic devices due to its excellent electrical and mechanical properties. In this paper, a novel idea of implementing the LTCC structures into high-energy particle detectors technology is proposed. It can be applied in High Energy Physics (HEP) laboratories, where such sophisticated sensors are constantly exposed to particles of the TeV energy range for many years. The most advanced applications of the concept are based on dedicated gas amplifier systems coupled with readout microstructures. Typically, the readout microstructures are made in the Printed Circuit Boards (PCB) technology and processed in a sophisticated and patent-protected way. This article presents the manufacturing process and parameters of the novel microstructures made in the LTCC technology. The structures were implemented into the high-energy particle detector, and the first results are presented.


1999 ◽  
Author(s):  
Stephen V. Musolino ◽  
Steven F. Kane ◽  
Joseph W. Levesque

Abstract The Relativistic Heavy Ion Collider (RHIC) is a high energy particle accelerator built to study basic nuclear physics. It consists of two counter-rotating beams of fully stripped gold ions that are accelerated in two rings to an energy of 100 GeV/nucleon. The rings consist of a circular lattice of superconducting magnets, 3.8 km in circumference. The beams can be stored for a period of five to ten hours and brought into collision for experiments during that time. The first major physics objective when the facility goes into operation is to recreate a state of matter, the quark-gluon plasma, that has been predicted to have existed at a short time after the creation of the universe. There are only a few other high energy particle accelerators like RHIC in the world. Each one is unique in design and contains systems and hazards that are not commonly found in general industry. Therefore, the designers of the machine do not always have consensus design standards and regulatory guidance available to establish the engineering parameters for safety. Some of the areas where standards are not available relate to the cryogenic system, containment of large volumes of flammable gas in fragile vessels in the experimental apparatus and mitigation of a Design Basis Accident with a stored particle beam. The ASME Code requires Charpy testing of welds at cryogenic temperature, but testing at 4 K is nearly impossible to conduct. Engineered welds were used to provide an equivalent level of safety. A cryogenic system is a process system. The RHIC system was designed first by selecting a safe operating mode, then analyzing to ensure this mode was preserved. Cryogenic systems have unique processes, and the safe mode will surprise most process engineers. The experimentalists require detectors to be designed to meet the need of the physics objectives, but the application of standard construction techniques would make research mission impossible. Unique but equivalent safety engineering must be determined. The rules promulgated in the Code of Federal Regulations under the Atomic Energy Act do not cover prompt radiation from accelerators, nor are there any State regulations that govern the design and operation of a large superconducting collider. Special design criteria for prompt radiation were developed to provide guidance for the design of radiation shielding.


Author(s):  
J. Taftϕ ◽  
R. L. Sabatini ◽  
M. Suenaga

Polycrystalline Nb3Sn is a superconductor with a high superconducting temperature, 18 K. The material can withstand a high magnetic field which makes it especially useful in strong superconducting magnets for magnetically confined fusion reactors and high energy particle accelerators. Several metallurgical factors influence the superconducting properties of Nb3Sn, e.g. grain size, compositional inhomogenities and small amounts of alloying elements. We have used a 100 keV analytical electron microscope (AEM) to detect the characteristic x rays (EDS) in order to study spatial composition variations, and to locate alloying elements in the crystal unit cell using ALCHEMI (Atom Location by Channeling Enhanced Microanalysis).


2010 ◽  
Vol 2010 (HITEC) ◽  
pp. 000089-000096 ◽  
Author(s):  
S T Riches ◽  
K Cannon ◽  
C Johnston ◽  
M Sousa ◽  
P Grant ◽  
...  

The requirement to install electronic power and control systems in high temperature environments has posed a challenge to the traditional limit of 125°C for high temperature exposure of electronics systems. The leap in operating temperature to above 200°C in combination with high pressures, vibrations and potentially corrosive environments means that different semiconductors, passives, circuit boards and assembly processes will be needed to fulfil the target performance specifications. Bare die mounted onto ceramic and insulated metal substrates can withstand higher temperatures than soldered surface mount devices on printed circuit boards. The results of the evaluation of electronic interconnect and substrate materials that have been submitted to temperatures of 250°C for up to 2000 hours will be presented, including details on novel adhesive formulations and high temperature insulated metal substrates. The materials and processes developed have been applied to the manufacture of high temperature circuits representative of analogue signal conditioning and processing, using silicon on insulator devices and passive components mounted into HTCC packages and onto thick film on ceramic substrates. Results of the characterisation of these devices and circuits at temperatures of 250°C for up to 2000 hours will be presented. This work forms part of the UPTEMP project has been set-up with support from UK Technology Strategy Board and the EPSRC, which started in March 2007 with 3 years duration. The project brings together a consortium of end-users (Sondex Wireline and Vibro-Meter UK), electronic module manufacturers (GE Aviation Systems Newmarket) and material suppliers (Gwent Electronic Materials and Thermastrate Ltd) with Oxford University-Materials Department, the leading UK high temperature electronics research centre.


1994 ◽  
Vol 90 ◽  
pp. 837 ◽  
Author(s):  
Russell J. Hamilton ◽  
Frederick K. Lamb ◽  
M. Coleman Miller

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