Elimination of Voids at Interface of β-SiC Films and Si Substrate by Laser CVD

2018 ◽  
Vol 33 (2) ◽  
pp. 356-362
Author(s):  
Peipei Zhu ◽  
Qingfang Xu ◽  
Han Guo ◽  
Rong Tu ◽  
Song Zhang ◽  
...  
Keyword(s):  
1987 ◽  
Vol 101 ◽  
Author(s):  
Hirohide Nakamatsu ◽  
Kazuhiko Hirata ◽  
Shichio Kawai

ABSTRACTArF exciraer laser CVD was performed to give epitaxial SiC films on the sapphire or (α-A12O3 (0001) substrate. The rate of film growth was limited by the diffusion of the supplied gases. Small amounts of the gas supply failed to produce the SiC deposition and etched the substrate. The UV light irradiation of the substrate was necessary for the photo-excitation to grow the adherent epitaxial films. Filtered UV light from a D2 lamp revealed that the light with the wavelength shorter than about 310nm was effective for the epitaxial growth. It was found to be essential to excite intermediate products or by-products in the absorbed layer on the substrate. The epitaxial SiC films on the αA12O3 gave blue photoluminescence which may be ascribed to the superstructure of 3C-type SiC crystals.


1998 ◽  
Vol 84 (5) ◽  
pp. 2602-2611 ◽  
Author(s):  
Yong Sun ◽  
Tatsuro Miyasato
Keyword(s):  

1993 ◽  
Vol 8 (3) ◽  
pp. 535-544 ◽  
Author(s):  
Chien C. Chiu ◽  
Seshu B. Desu

SiC thin films grown from the reaction between acetylene (C2H2) and the Si(100) substrates in a horizontal hot-wall CVD reactor by different procedures were studied using x-ray photoelectron spectroscopy (XPS) and scanning electron microscopy (SEM). The growth of the SiC films was observed from the behavior of Si2p peaks and their plasmons. A SiC thin film with a thickness of 35 Å and having a smooth surface morphology was obtained in C2H2 diluted by H2 at 1050 °C for a period of 60 min. Etch pits and hillocks were observed with increasing reaction time at 1050 °C. For the conversion conducted in C2H2, but in the absence of H2, a SiC monolayer with smooth morphology was obtained at 950 °C for 7 min and defects were observed for longer reaction times at this temperature. Defects were also observed for reaction times as short as 10 s at higher reaction temperatures (e.g., 1000 °C). H2 seems to play a key role in suppressing the formation of defects and the reaction between C2H2 and Si substrate. The formation of defects was correlated to the out-diffusion of Si in the carbonization process.


2008 ◽  
Vol 368-372 ◽  
pp. 319-321
Author(s):  
Hui Wang ◽  
Tong Wei Li ◽  
Zheng Xin Tang ◽  
Jing Han You ◽  
Xiang Ru Liu ◽  
...  

SiC films were prepared by HFCVD technique on (111) Si substrate. The composition and the structure of the films were investigated using EDX, XRD and transient fluorescence. Results indicated the films deposited were nanocrystalline and the calculation of the grain size gave a further confirmation. PL measurement of the present films showed that there existed a strong ultraviolet emission at room temperature.


2009 ◽  
Vol 615-617 ◽  
pp. 633-636 ◽  
Author(s):  
Christopher Locke ◽  
G. Kravchenko ◽  
P. Waters ◽  
J. D. Reddy ◽  
K. Du ◽  
...  

Single crystal 3C-SiC films were grown on (100) and (111) Si substrate orientations in order to study the resulting mechanical properties of this material. In addition, poly-crystalline 3C-SiC was also grown on (100)Si so that a comparison with monocrystaline 3C-SiC, also grown on (100)Si, could be made. The mechanical properties of single crystal and polycrystalline 3C-SiC films grown on Si substrates were measured by means of nanoindentation using a Berkovich diamond tip. These results indicate that polycrystalline SiC thin films are attractive for MEMS applications when compared with the single crystal 3C-SiC, which is promising since growing single crystal 3C-SiC films is more challenging. MEMS cantilevers and membranes fabricated from a 2 µm thick single crystal 3C-SiC grown on (100)Si under similar conditions resulted in a small degree of bow with only 9 µm of deflection for a cantilever of 700 µm length with an estimated tensile film stress of 300 MPa. Single crystal 3C-SiC films on (111)Si substrates have the highest elastic and plastic properties, although due to high residual stress they tend to crack and delaminate.


2010 ◽  
Vol 1246 ◽  
Author(s):  
Christopher Locke ◽  
Christopher Frewin ◽  
Luca Abbati ◽  
Stephen E. Saddow

AbstractSilicon carbide has robust mechanical, electrical, and chemical properties which make it an attractive material candidate for micro- and nano-electromechanical systems (MEMS and NEMS). 3C-SiC films grown via a polysilicon seed-layer CVD-deposited on an oxide coated (111) Si substrate offers an innovative method to overcome the residual film stress issues associated with 3C-SiC heteroepitaxy and the difficulties of fabricating structures from 3C-SiC films. The oxide plays a dual role by permitting film relaxation with respect to the supporting substrate and functioning as a MEMS release layer, allowing MEMS structures such as cantilevers and diaphragms, to be easily fabricated from the 3C-SiC film. The impact of the oxide layer on the relaxation of the film stress was investigated by comparing direction-sensitive MEMS stress sensors fabricated from 3C-SiC films grown via a polysilicon-on-oxide-coated-substrate and a polysilicon-on-crystalline Si substrate. Scanning Electron Microscopy (SEM) analysis of bridge structures fabricated on the polysilicon-on-oxide substrate revealed evidence of film strain relaxation when compared to bridge structures fabricated on the polysilicon-on-crystalline Si substrate. However, the upward-curled cantilever and comb structures fabricated on both substrates indicate the presence of a strain gradient in the 3C-SiC film grown on both substrates.


2003 ◽  
Vol 12 (9) ◽  
pp. 1505-1509 ◽  
Author(s):  
Q. Zhao ◽  
B. Wang ◽  
J.C. Li ◽  
M. Wang ◽  
X.M. Song ◽  
...  
Keyword(s):  

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