Development of a Numerical Model for Simulating Transient Liquid Phase (TLP) Bonding Involving Two Solid–Liquid Interfaces that Concurrently Undergo 2D or 3D Migration
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2020 ◽
Vol 25
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pp. 101481
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2004 ◽
Vol 9
(6)
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pp. 525-531
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2010 ◽
Vol 61
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pp. 312-317
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2010 ◽
Vol 64
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pp. 88-97
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2010 ◽
Vol 442
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pp. 66-73
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2004 ◽
Vol 9
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pp. 513-518
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2016 ◽
Vol 47
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pp. 2026-2039
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