Experimental study of the kinetics of transient liquid phase solidification reaction in electroplated gold-tin layers on copper

1997 ◽  
Vol 28 (3) ◽  
pp. 699-706 ◽  
Author(s):  
Ramnath Venkatraman ◽  
James R. Wilcox ◽  
Stephen R. Cain
Keyword(s):  
Experimental Study ◽  
Liquid Phase ◽  
Transient Liquid Phase ◽  
Solidification Reaction ◽  
Kinetics Of

Kinetics of the Pd/In thin-film bilayer reaction: Implications for transient-liquid-phase wafer bonding

2001 ◽  
Vol 30 (11) ◽  
pp. 1471-1475 ◽  
Author(s):  
N. Quitoriano ◽  
W. S. Wong ◽  
L. Tsakalakos ◽  
Y. Cho ◽  
T. Sands
Keyword(s):  
Thin Film ◽  
Liquid Phase ◽  
Wafer Bonding ◽  
Transient Liquid Phase ◽  
Kinetics Of

scholarly journals Kinetics of liquid-phase diphenylacetylene hydrogenation on “single-atom alloy” Pd-Ag catalyst: Experimental study and kinetic analysis

2021 ◽  
Vol 506 ◽  
pp. 111550
Author(s):  
Alexander V. Rassolov ◽  
Igor S. Mashkovsky ◽  
Galina O. Bragina ◽  
Galina N. Baeva ◽  
Pavel V. Markov ◽  
...  
Keyword(s):  
Experimental Study ◽  
Liquid Phase ◽  
Kinetic Analysis ◽  
Single Atom ◽  
Ag Catalyst ◽  
Kinetics Of ◽  
Single Atom Alloy

scholarly journals Overview of transient liquid phase and partial transient liquid phase bonding

2011 ◽  
Vol 46 (16) ◽  
pp. 5305-5323 ◽  
Author(s):  
Grant O. Cook ◽  
Carl D. Sorensen
Keyword(s):  
Liquid Phase ◽  
Bonding Temperature ◽  
Transient Liquid Phase ◽  
Isothermal Solidification ◽  
Bonding Process ◽  
Advantages And Disadvantages ◽  
Tlp Bonding ◽  
Wide Range ◽  
Kinetics Of ◽  
Bonding Kinetics

AbstractTransient liquid phase (TLP) bonding is a relatively new bonding process that joins materials using an interlayer. On heating, the interlayer melts and the interlayer element (or a constituent of an alloy interlayer) diffuses into the substrate materials, causing isothermal solidification. The result of this process is a bond that has a higher melting point than the bonding temperature. This bonding process has found many applications, most notably the joining and repair of Ni-based superalloy components. This article reviews important aspects of TLP bonding, such as kinetics of the process, experimental details (bonding time, interlayer thickness and format, and optimal bonding temperature), and advantages and disadvantages of the process. A wide range of materials that TLP bonding has been applied to is also presented. Partial transient liquid phase (PTLP) bonding is a variant of TLP bonding that is typically used to join ceramics. PTLP bonding requires an interlayer composed of multiple layers; the most common bond setup consists of a thick refractory core sandwiched by thin, lower-melting layers on each side. This article explains how the experimental details and bonding kinetics of PTLP bonding differ from TLP bonding. Also, a range of materials that have been joined by PTLP bonding is presented.

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