A Novel Mechanism of Embrittlement Affecting the Impact Reliability of Tin-Based Lead-Free Solder Joints

2009 ◽  
Vol 38 (9) ◽  
pp. 1881-1895 ◽  
Author(s):  
Konstantina Lambrinou ◽  
Wout Maurissen ◽  
Paresh Limaye ◽  
Bart Vandevelde ◽  
Bert Verlinden ◽  
...  
Keyword(s):  
Solder Joints ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder ◽  
Impact Reliability ◽  
The Impact

The impact of thermal cycling regime on the shear strength of lead‐free solder joints

2005 ◽  
Vol 17 (2) ◽  
pp. 22-31 ◽  
Author(s):  
Milos Dusek ◽  
Martin Wickham ◽  
Christopher Hunt
Keyword(s):  
Shear Strength ◽  
Thermal Cycling ◽  
Solder Joints ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder ◽  
The Impact

Research on Microstructure and Shear Behavior of Au/Sn-Ag-Cu/Cu Lead-free Solder Joints at Different Soldering Temperatures

2021 ◽  
Author(s):  
Xinmeng Zhai ◽  
Yue Chen ◽  
Yuefeng Li ◽  
Jun Zou ◽  
Mingming Shi ◽  
...  
Keyword(s):  
Solder Joints ◽  
Shear Behavior ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder

Electromigration Induced Stress in Lead-Free Solder Joints

2016 ◽  
Author(s):  
Jiamin Ni ◽  
Antoinette Maniatty ◽  
Yong Liu ◽  
Jifa Hao ◽  
Matt Ring
Keyword(s):  
Solder Joints ◽  
Lead Free ◽  
Lead Free Solder ◽  
Induced Stress ◽  
Free Solder

Impact reliability estimation of lead free solder joint with IMC layer

2009 ◽  
Vol 517 (14) ◽  
pp. 4255-4259 ◽  
Author(s):  
Jong-Min Kim ◽  
Seung-Wan Woo ◽  
Yoon-Suk Chang ◽  
Young-Jin Kim ◽  
Jae-Boong Choi ◽  
...  
Keyword(s):  
Solder Joint ◽  
Reliability Estimation ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder ◽  
Impact Reliability

Void Formation and Their Effect on Reliability of Lead-Free Solder Joints on MID and PCB Substrates

2017 ◽  
Vol 66 (4) ◽  
pp. 1229-1237 ◽  
Author(s):  
P. Wild ◽  
T. Grozinger ◽  
D. Lorenz ◽  
A. Zimmermann
Keyword(s):  
Solder Joints ◽  
Void Formation ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder

Quantitative Evaluation of Voids in Lead Free Solder Joints

2015 ◽  
Vol 772 ◽  
pp. 284-289 ◽  
Author(s):  
Sabuj Mallik ◽  
Jude Njoku ◽  
Gabriel Takyi
Keyword(s):  
Solder Bump ◽  
Solder Joints ◽  
Void Formation ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Paste ◽  
X Ray ◽  
Size And Shape ◽  
Solder Bumps ◽  
Free Solder

Voiding in solder joints poses a serious reliability concern for electronic products. The aim of this research was to quantify the void formation in lead-free solder joints through X-ray inspections. Experiments were designed to investigate how void formation is affected by solder bump size and shape, differences in reflow time and temperature, and differences in solder paste formulation. Four different lead-free solder paste samples were used to produce solder bumps on a number of test boards, using surface mount reflow soldering process. Using an advanced X-ray inspection system void percentages were measured for three different size and shape solder bumps. Results indicate that the voiding in solder joint is strongly influenced by solder bump size and shape, with voids found to have increased when bump size decreased. A longer soaking period during reflow stage has negatively affectedsolder voids. Voiding was also accelerated with smaller solder particles in solder paste.

Sign in / Sign up

Export Citation Format

Share Document