Simulations of the impact of single-grained lead-free solder joints on the reliability of ball Grid Array components

2017 ◽  
Author(s):  
Andreas Lovberg ◽  
Per-Erik Tegehall ◽  
Goran Wetter ◽  
Klas Brinkfeldt ◽  
Dag Andersson
Keyword(s):  
Solder Joints ◽  
Ball Grid Array ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder ◽  
The Impact

A Novel Mechanism of Embrittlement Affecting the Impact Reliability of Tin-Based Lead-Free Solder Joints

2009 ◽  
Vol 38 (9) ◽  
pp. 1881-1895 ◽  
Author(s):  
Konstantina Lambrinou ◽  
Wout Maurissen ◽  
Paresh Limaye ◽  
Bart Vandevelde ◽  
Bert Verlinden ◽  
...  
Keyword(s):  
Solder Joints ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder ◽  
Impact Reliability ◽  
The Impact

Methodology for Analyzing Slip Behavior in Ball Grid Array Lead-Free Solder Joints After Simple Shear

2009 ◽  
Vol 38 (12) ◽  
pp. 2702-2711 ◽  
Author(s):  
Bite Zhou ◽  
Thomas R. Bieler ◽  
Tae-Kyu Lee ◽  
Kuo-Chuan Liu
Keyword(s):  
Simple Shear ◽  
Solder Joints ◽  
Ball Grid Array ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder

A Systematic Approach for Determining the Thermal Fatigue-Life of Plastic Ball Grid Array (PBGA) Lead-Free Solder Joints

2005 ◽  
Author(s):  
John Lau ◽  
Ricky Lee ◽  
Walter Dauksher ◽  
Dongkai Shangguan ◽  
Fubin Song ◽  
...  
Keyword(s):  
Fatigue Life ◽  
Thermal Fatigue ◽  
Solder Joints ◽  
Ball Grid Array ◽  
Lead Free ◽  
Lead Free Solder ◽  
Thermal Fatigue Life ◽  
Plastic Ball ◽  
Plastic Ball Grid Array ◽  
Free Solder

Reliability of plastic ball grid array (PBGA) SnAgCu lead-free solder joints is investigated. Emphasis is placed on the design for reliability (DFR) of lead-free solder joints. In particular, the thermal-fatigue life of the lead-free solder joints of a PBGA package assembly is predicted and compared with thermal cycling test results.

The influence of solder composition on the impact strength of lead-free solder ball grid array joints

2011 ◽  
Vol 51 (3) ◽  
pp. 657-667 ◽  
Author(s):  
H. Tsukamoto ◽  
T. Nishimura ◽  
S. Suenaga ◽  
S.D. McDonald ◽  
K.W. Sweatman ◽  
...  
Keyword(s):  
Impact Strength ◽  
Solder Ball ◽  
Ball Grid Array ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder ◽  
The Impact ◽  
Solder Composition
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