Reactive Sintering of Copper Nanoparticles Using Intense Pulsed Light for Printed Electronics

2010 ◽  
Vol 40 (1) ◽  
pp. 42-50 ◽  
Author(s):  
Jongeun Ryu ◽  
Hak-Sung Kim ◽  
H. Thomas Hahn
Keyword(s):  
Copper Nanoparticles ◽  
Printed Electronics ◽  
Intense Pulsed Light ◽  
Reactive Sintering ◽  
Pulsed Light

scholarly journals Rapid and efficient intense pulsed light reduction of graphene oxide inks for flexible printed electronics

RSC Advances ◽  
2017 ◽  
Vol 7 (81) ◽  
pp. 51711-51720 ◽  
Author(s):  
Limin Pei ◽  
Yu-Feng Li
Keyword(s):  
Graphene Oxide ◽  
Printed Electronics ◽  
Intense Pulsed Light ◽  
Pulsed Light ◽  
Light Reduction

Inkjet-printed GO patterns without additives were reduced by IPL treatment and achieved resistance as low as 760.4 Ω and acceptable flexibility.

Ultra-fast photonic curing of electrically conductive adhesives fabricated from vinyl ester resin and silver micro-flakes for printed electronics

RSC Advances ◽  
2014 ◽  
Vol 4 (31) ◽  
pp. 15914-15922 ◽  
Author(s):  
Hui-Wang Cui ◽  
Jin-Ting Jiu ◽  
Shijo Nagao ◽  
Tohru Sugahara ◽  
Katsuaki Suganuma ◽  
...  
Keyword(s):  
Vinyl Ester ◽  
Printed Electronics ◽  
Intense Pulsed Light ◽  
Vinyl Ester Resin ◽  
Pulsed Light ◽  
Conductive Adhesives ◽  
Electrically Conductive ◽  
Electrically Conductive Adhesives ◽  
Photonic Curing

Electrically conductive vinyl ester resin–silver micro-flake adhesives, combined with intense pulsed light, present ultra-fast photonic curing within a second.

scholarly journals Intense pulsed light sintering of copper nanoink for printed electronics

2009 ◽  
Vol 97 (4) ◽  
pp. 791-798 ◽  
Author(s):  
Hak-Sung Kim ◽  
Sanjay R. Dhage ◽  
Dong-Eun Shim ◽  
H. Thomas Hahn
Keyword(s):  
Printed Electronics ◽  
Intense Pulsed Light ◽  
Pulsed Light

A Review on Intense Pulsed Light Sintering Technologies for Conductive Electrodes in Printed Electronics

2020 ◽  
Vol 8 (1) ◽  
pp. 327-363 ◽  
Author(s):  
Yong-Rae Jang ◽  
Sung-Jun Joo ◽  
Ji-Hyeon Chu ◽  
Hui-Jin Uhm ◽  
Jong-Whi Park ◽  
...  
Keyword(s):  
Printed Electronics ◽  
Intense Pulsed Light ◽  
Pulsed Light

scholarly journals Sintering Copper Nanoparticles with Photonic Additive for Printed Conductive Patterns by Intense Pulsed Light

Nanomaterials ◽  
2019 ◽  
Vol 9 (8) ◽  
pp. 1071 ◽  
Author(s):  
Chung ◽  
Lai ◽  
Yonezawa ◽  
Liao
Keyword(s):  
Copper Nanoparticles ◽  
Cuprous Oxide ◽  
Cupric Oxide ◽  
Copper Film ◽  
Weight Ratio ◽  
Absorption Efficiency ◽  
Intense Pulsed Light ◽  
Oxide Shell ◽  
Pulsed Light ◽  
Compact Structure

In this study, an ink formulation was developed to prepare conductive copper thin films with compact structure by using intense pulsed light (IPL) sintering. To improve inter-particle connections in the sintering process, a cuprous oxide shell was synthesized over copper nanoparticles (CuNP). This cuprous oxide shell can be reduced by IPL with the presence of a reductant and fused to form connection between large copper particles. However, the thermal yield stress after strong IPL sintering resulted in cracks of conductive copper film. Thus, a multiple pulse sintering with an off time of 2 s was needed to reach a low resistivity of 10−5 Ω·cm. To increase the light absorption efficiency and to further decrease voids between CuNPs in the copper film, cupric oxide nanoparticles (CuONP) of 50 nm, were also added into ink. The results showed that these CuONPs can be reduced to copper with a single pulse IPL and fused with the surrounding CuNPs. With an optimal CuNP/CuONP weight ratio of 1/80, the copper film showed a lowest resistivity of 7 × 10−5 Ω·cm, ~25% conductivity of bulk copper, with a single sintering energy at 3.08 J/cm2. The ink can be printed on flexible substrates as conductive tracks and the resistance remained nearly the same after 10,000 bending cycles.

Intense Pulsed Light Sintering of Copper Nanoink for Conductive Copper Film

2015 ◽  
Vol 748 ◽  
pp. 187-192 ◽  
Author(s):  
Wei Bing Gu ◽  
Zheng Cui
Keyword(s):  
Printed Electronics ◽  
Low Cost ◽  
Copper Film ◽  
Intense Pulsed Light ◽  
Attractive Potential ◽  
High Resistivity ◽  
Copper Nanoparticle ◽  
Pulsed Light ◽  
X Ray Diffraction ◽  
Nanoparticle Inks

Conducting electrodes and films are becoming increasingly important for the printed electronics which can be applied in various fields such as RFID tags, photovoltaics, display and PCB. And copper nanoparticle inks serve as an attractive potential replacement to silver nanoparticle inks because its low cost and good electrical conductivtiy.In this paper, the commercial copper nanoparticle powder with oxide shells were dispersed in the solvent of ethylene glycol. Poly (N-vinylpyrrolidone) (PVP K30) was added to the solvent as capping materials. The prepared copper ink was spin-coated on glass substrate under ambient conduction. Then, the deposited Cu ink was sintered by an intense pulsed light (IPL) system. The sintering effects were investigated with different sintering conditions including pulse energy and pulse duration. The resulting electrical resistivity was 94.1uΩ·cm which is about fifty times as high as that of bulk copper. The high resistivity may be mainly attributed to the porosity of sintered film. Also, crystal phase analysis was performed using x-ray diffraction (XRD) and was found the XRD peaks corresponding to cuprous oxide disappeared after IPL sintering. It was believed that PVP reduced the copper oxide to copper in the process of IPL sintering.

Intense Pulsed Light Sintering of Inkjet Printed Silver Nanoparticle Ink: Influence of Flashing Parameters and Substrate

2015 ◽  
Vol 1761 ◽  
Author(s):  
Dana Weise ◽  
Kalyan Yoti Mitra ◽  
Enrico Sowade ◽  
Reinhard R. Baumann
Keyword(s):  
Printed Electronics ◽  
Liquid Films ◽  
Post Treatment ◽  
Intense Pulsed Light ◽  
Flexible Substrates ◽  
Pulsed Light ◽  
High Dependency ◽  
Functional Patterns ◽  
Poly Ethylene ◽  
Thermal Sintering

ABSTRACTInkjet printing of various nanoparticle inks, made from silver or copper nanoparticles, and its transformation into solid functional patterns is of high interest in the field of printed electronics. Liquid materials can be deposited as defined patterns in selected areas with micrometer precision. To convert these printed liquid films, consisting of solvents, additives and nanoparticles, into solid functional patterns a post-treatment is required. To this date, many investigations report on various sintering techniques to achieve e.g. high conductivity from the printed conductive materials.Direct thermal sintering (via furnace or hotplate) requires high temperatures, which makes it not suitable for sensitive polymeric substrates. The novel method of intense pulsed light (IPL) sintering opens the window of opportunity to convert liquid or dried metal layers into solid functional layers within milliseconds without damaging the thermally fragile polymeric substrate.In this work we present and analyze the application of the IPL sintering on inkjet printed silver patterns on various flexible substrates, like Poly(ethylene naphthalate) (PEN), Poly(ethylene terephthalate) (PET), Polyimide (PI) foils and paper.A high dependency of the electrical and structural performance of the printed silver layers on the base substrate was observed when flashing with the IPL technique. Flashing parameters were varied and the resulting sheet resistance is presented.With the analytical comparison of optical and electrical results, the flashing settings could be adapted to achieve highly conductive inkjet printed silver patterns on flexible substrates, when compared to other thermal sintering techniques. Furthermore the first integration of this post treatment methodology into semi-industrial roll-2-roll processing was successfully performed and will be demonstrated.

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