Glassy carbon manufacture using rapid photonic curing

Photonic curing was explored as a rapid method for producing glassy carbon coatings, reducing processing time from ~ 20 h for conventional thermal processing down to ~ 1 min. A resole-type thermoset polymer resin coated on steel foil was used as a precursor, placed in a nitrogen purged container and exposed to high energy light (~ 27 J/cm2 per pulse for up to 20 pulses). Comparison samples were produced at 800 °C using a conventional nitrogen purged thermal route. For both photonic and conventionally produced coatings, Raman spectroscopy and primary peak XPS data showed sp2 bonded carbon, indicative of bulk glassy carbon. This transformation evolved with increasing number of pulses, and therefore amount of energy transferred to the coating. The produced coatings were resilient, highly smooth, with no evidence of surface defects. XPS analysis indicated greater sp3 content at the immediate surface (5–10 nm) for photonic cured carbon compared with thermally cured carbon, likely due to the local environment (temperature, atmosphere) around the surface during conversion. The ability to rapidly manufacture glassy carbon coatings provides new opportunities to expand the window of applications of glassy carbons in coatings towards large-scale high volume applications.

Photonic Curing of Nickel Oxide Transport Layer and Perovskite Active Layer for Flexible Perovskite Solar Cells: A Path Towards High-Throughput Manufacturing

High-throughput roll-to-roll (R2R) manufacturing of perovskite solar cells (PSCs) is currently limited by thermal processes that take tens of minutes each, translating to impractically long annealing tools at high web speeds. In addition, PSCs are usually made with metal oxide transport layer materials that require high temperatures for thermal annealing. Here, we demonstrate the fabrication of PSCs using photonic curing, instead of thermal annealing, to convert NiOx directly from sol-gel precursors for hole transport layers and to crystallize methylammonium lead iodide (MAPbI3) active layers on flexible Willow® Glass substrates. Photonic curing uses short, intense pulses of light to process materials at a high speed, hence it is compatible with R2R manufacturing. We achieved power conversion efficiencies (PCEs) of 11.7% in forward-scan and 10.9% in reverse-scan for PSCs made with photonic cured NiOx and MAPbI3 films. Furthermore, both NiOx and MAPbI3 films could be processed with a single photonic curing pulse, with a web speed of 5.7 m/min, and still produce PCEs comparable to thermally annealed control samples. Based on the single-pulse photonic curing condition for each film, we project a web speed of 26 m/min, laying a pathway to high-throughput production of perovskite solar modules.

One-step photonic curing of screen-printed conductive Ni flake electrodes for use in flexible electronics

Photonic curing has shown great promise in maintaining the integrity of flexible thin polymer substrates without structural degradation due to shrinkage, charring or decomposition during the sintering of printed functional ink films in milliseconds at high temperatures. In this paper, single-step photonic curing of screen-printed nickel (Ni) electrodes is reported for sensor, interconnector and printed electronics applications. Solid bleached sulphate paperboard (SBS) and polyethylene terephthalate polymer (PET) substrates are employed to investigate the electrical performance, ink transfer and ink spreading that directly affect the fabrication of homogeneous ink films. Ni flake ink is selected, particularly since its effects on sintering and rheology have not yet been examined. The viscosity of Ni flake ink yields shear-thinning behavior that is distinct from that of screen printing. The porous SBS substrate is allowed approximately 20% less ink usage. With one-step photonic curing, the electrodes on SBS and PET exhibited electrical performances of a minimum of 4 Ω/sq and 16 Ω/sq, respectively, at a pulse length of 1.6 ms, which is comparable to conventional thermal heating at 130 °C for 5 min. The results emphasize the suitability of Ni flake ink to fabricate electronic devices on flexible substrates by photonic curing.