Impact of Microstructure Evolution and Isothermal Aging on Sn-Ag-Cu Solder Interconnect Board-Level High-G Mechanical Shock Performance and Crack Propagation

2011 ◽  
Vol 41 (2) ◽  
pp. 273-282 ◽  
Author(s):  
Tae-Kyu Lee ◽  
Bite Zhou ◽  
Thomas Bieler ◽  
Kuo-Chuan Liu
Keyword(s):  
Crack Propagation ◽  
Microstructure Evolution ◽  
Isothermal Aging ◽  
Mechanical Shock ◽  
Solder Interconnect ◽  
Board Level

Impact of isothermal aging on fine pitch BGA packages with Sn-Ag-Cu solder interconnects

2010 ◽  
Vol 2010 (1) ◽  
pp. 000298-000305
Author(s):  
Tae-Kyu Lee ◽  
Weidong Xie ◽  
Thomas R. Bieler ◽  
Kuo-Chuan Liu ◽  
Jie Xue
Keyword(s):  
Thermal Cycling ◽  
Microstructure Evolution ◽  
Isothermal Aging ◽  
Substrate Surface ◽  
Solder Interconnects ◽  
Surface Finishes ◽  
Bga Packages ◽  
Fine Pitch ◽  
Solder Balls

The interaction between isothermal aging and long-term reliability of fine pitch ball grid array (BGA) packages with Sn-3.0Ag-0.5Cu (wt%) solder ball interconnects are investigated. In this study, 0.4mm fine pitch packages with 0.3mm diameter Sn-Ag-Cu solder balls are used. Two different die sizes and two different package substrate surface finishes are selected to compare the internal strain impact and alloy effect, especially the Ni effect during thermal cycling. To see the thermal impact on the thermal performance and long-term reliability, the samples are isothermally aged and thermal cycled from 0 to 100°C with a 10minute dwell time. Based on weibull plots for each aging condition, the lifetime of the package reduced approximately 44% with 150°C aging precondition. The microstructure evolution is observed during thermal aging and thermal cycling with different phase microstructure transformations between electrolytic Ni/Au and OSP surface finishes, focusing on the microstructure evolution near the package side interface. Different mechanisms after aging at various conditions are observed, and their impacts on the fatigue life of solder joints are discussed.

Impact of an Elevated Temperature Environment on Sn-Ag-Cu Interconnect Board Level High-G Mechanical Shock Performance

2016 ◽  
Vol 45 (12) ◽  
pp. 6177-6183
Author(s):  
Tae-Kyu Lee ◽  
Zhiqiang Chen ◽  
Greg Baty ◽  
Thomas R. Bieler ◽  
Choong-Un Kim
Keyword(s):  
Elevated Temperature ◽  
Mechanical Shock ◽  
Temperature Environment ◽  
Cu Interconnect ◽  
Board Level

scholarly journals Microstructure Evolution during Isothermal Aging for Wrought Nickel-Based Superalloy Udimet 520

2020 ◽  
Vol 61 (8) ◽  
pp. 1689-1697
Author(s):  
Yoshiya Yamaguchi ◽  
Mayumi Abe ◽  
Ryotaro Tajima ◽  
Yoshihiro Terada
Keyword(s):  
Microstructure Evolution ◽  
Isothermal Aging ◽  
Nickel Based Superalloy

Effects of isothermal aging on interfacial microstructure evolution and shear behavior of Au-12Ge/Ni(P)/Kovar Solder Joints

2020 ◽  
Vol 124 ◽  
pp. 106865
Author(s):  
Yufeng Huang ◽  
Xun Chen ◽  
Feng Xue ◽  
Tong Wu ◽  
Wensheng Liu ◽  
...  
Keyword(s):  
Microstructure Evolution ◽  
Isothermal Aging ◽  
Solder Joints ◽  
Shear Behavior ◽  
Interfacial Microstructure

Isothermal Aging Effects on the Mechanical Shock Performance of Lead-Free Solder Joints

2011 ◽  
Vol 1 (5) ◽  
pp. 714-721 ◽  
Author(s):  
Hongtao Ma ◽  
Tae-Kyu Lee ◽  
Dong Hyun Kim ◽  
H G Park ◽  
Sang Ha Kim ◽  
...  
Keyword(s):  
Isothermal Aging ◽  
Solder Joints ◽  
Lead Free ◽  
Lead Free Solder ◽  
Mechanical Shock ◽  
Aging Effects ◽  
Free Solder
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