Intermetallic compound formation and mechanical property of SN-CU-XCR/CU lead-free solder joint

2018 ◽  
Author(s):  
Junghwan Bang ◽  
Dong-Yurl Yu ◽  
Yong-Ho Ko ◽  
Hiroshi Nishikawa ◽  
Chang-Woo Lee
Keyword(s):  
Mechanical Property ◽  
Intermetallic Compound ◽  
Solder Joint ◽  
Lead Free ◽  
Lead Free Solder ◽  
Compound Formation ◽  
Intermetallic Compound Formation ◽  
Free Solder

Intermetallic compound formation and mechanical property of Sn-Cu-xCr/Cu lead-free solder joint

2017 ◽  
Vol 728 ◽  
pp. 992-1001 ◽  
Author(s):  
Junghwan Bang ◽  
Dong-Yurl Yu ◽  
Yong-Ho Ko ◽  
Min-Su Kim ◽  
Hiroshi Nishikawa ◽  
...  
Keyword(s):  
Mechanical Property ◽  
Intermetallic Compound ◽  
Solder Joint ◽  
Lead Free ◽  
Lead Free Solder ◽  
Compound Formation ◽  
Intermetallic Compound Formation ◽  
Free Solder

Influence of Bi Addition on Wettability and Mechanical Properties of Sn-0.7Cu Solder Alloy

2018 ◽  
Vol 273 ◽  
pp. 27-33 ◽  
Author(s):  
Mohd Izrul Izwan Ramli ◽  
M.S.S. Yusof ◽  
Mohd Arif Anuar Mohd Salleh ◽  
Rita Mohd Said ◽  
Kazuhiro Nogita
Keyword(s):  
Mechanical Properties ◽  
Intermetallic Compound ◽  
Lead Free Solder ◽  
Compound Formation ◽  
Alloying Additions ◽  
Wetting Properties ◽  
Intermetallic Compound Formation ◽  
Interfacial Intermetallic Compound ◽  
Free Solder ◽  
Intermetallic Layers

The effect of bismuth (Bi) micro-alloying additions on wettability and mechanical properties of Sn-0.7Cu lead-free solder were explored. This paper also investigates the influences of various Bi percentages on the suppression of intermetallic compound formation. Scanning electron microscope (SEM) was used to observe the microstructure evolution of solder joint including the thickness of interfacial intermetallic layers. Overall, with the addition of Bi to Sn-0.7Cu solder, the size of primary Cu6Sn5become smaller and suppresses the thickness of interfacial intermetallic compound between solder and the Cu substrate. Microhardness value and wetting properties also increased with Bi addition which resulted in smaller size of β-Sn and Cu6Sn5.

Investigation of Ni-Microalloyed Sn-0.5Cu Lead-Free Solders

2015 ◽  
Vol 1120-1121 ◽  
pp. 466-472
Author(s):  
Anett Gyenes ◽  
Erzsébet Nagy ◽  
Péter Lanszki ◽  
Zoltán Gácsi
Keyword(s):  
Intermetallic Compound ◽  
Nickel Content ◽  
Lead Free ◽  
Compound Formation ◽  
Intermetallic Compound Formation ◽  
Eutectic Formation ◽  
Nickel Addition ◽  
Free Solder ◽  
Lead Free Solders ◽  
Ppm Level

In this study the effects of small amounts of nickel addition (0-2000 ppm) on the microstructure, on Cu6Sn5 intermetallic compound formation and the mechanical properties of a Sn-0.5Cu lead-free solder were investigated. It is known that even ppm level additions of Ni have significant effects on the microstructure of Sn-Cu solder alloys. Ni suppresses the growth of β-Sn dendrites in favour of eutectic formation. As the nickel content increases, the microstructure undergoes a morphology evolution from hypoeutectic through fully eutectic to hypereutectic. Furthermore, the presence of Ni in the Cu6Sn5 intermetallic compound phase stabilises its high-temperature allotrope η-Cu6Sn5.

Effect of Bi Addition on Microstructures, Properties and Interfacial Intermetallic Compound Growth of Low-Ag Sn-Cu Lead-Free Solder

2015 ◽  
Vol 815 ◽  
pp. 109-114 ◽  
Author(s):  
Yuan Wang ◽  
Xiu Chen Zhao ◽  
Ying Liu ◽  
Jing Wei Cheng ◽  
Hong Li ◽  
...  
Keyword(s):  
Shear Strength ◽  
Intermetallic Compound ◽  
Solder Joint ◽  
Thermal Cycling ◽  
Melting Temperature ◽  
Hot Spot ◽  
Lead Free ◽  
Lead Free Solder ◽  
Interfacial Intermetallic Compound ◽  
Free Solder

The research on a new low-Ag lead-free solder has become a hot spot in the field of electronic packaging. In this work, the effects of Bi addition on microstructure, melting temperature, wettability of low-Ag solder, shear strength of solder joint and the growth of interfacial intermetallic compound (IMC) before and after thermal cycling were investigated. A moderate amount of Bi element resulted in the microstructural refinement and melting temperature reduction of Sn-0.2Ag-0.7Cu solder. Wetting test results showed that a small amount of Bi produced the significant effect on improving the wettability. In addition, it is shown that the thickness of interfacial IMC during thermal cycling decreased first and then increased; the shear strength of solder joint increased with the increase of Bi.

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