scholarly journals Vapour growth of silicon: growth anisotropy and adsorption

1991 ◽  
Vol 115 (1-4) ◽  
pp. 542-550 ◽  
Author(s):  
J.G.E. Gardeniers ◽  
L.J. Giling
2003 ◽  
Vol 254 (3-4) ◽  
pp. 329-335 ◽  
Author(s):  
Woo-Seok Cheong ◽  
Seok-Kiu Lee ◽  
Jae-Sung Roh
Keyword(s):  

1994 ◽  
Vol 75 (8) ◽  
pp. 3900-3907 ◽  
Author(s):  
M. Eizenberg ◽  
F. Meyer ◽  
A. Benhocine ◽  
D. Bouchier

1993 ◽  
Vol 324 ◽  
Author(s):  
Chris M. Lawson ◽  
Robert R. Michael

AbstractWe report on the first use of optical low coherence reflectometry (OLCR) for Edge Defined Film-Fed Growth (EFG) silicon characterization. This OLCR sensor system has been used to measure horizontal profiles of silicon thickness and flatness to an accuracy of 1.5 Rim with the sensor head positioned 1 cm away from the silicon. The use of this noninvasive sensor for EFG silicon growth monitoring may lead to more efficient solar cell manufacturing processes.


1979 ◽  
Author(s):  
R V D'Aiello ◽  
P H Robinson ◽  
D Richman

1993 ◽  
Vol 140 (4) ◽  
pp. 1110-1117
Author(s):  
M. E. Grupen‐Shemansky ◽  
H. M. Liaw ◽  
B. Vasquez ◽  
S. L. Sundaram

1998 ◽  
Vol 507 ◽  
Author(s):  
S. Hamma ◽  
D. Colliquet ◽  
P. Rocai Cabarrocas

ABSTRACTMicrocrystalline silicon films were deposited on corning glass substrates both by the standard hydrogen dilution and the layer-by-layer (LBL) technique. In-situ UV-visible spectroscopic ellipsometry measurements were performed to analyze the evolution of the composition of the films.The change of the hydrogen plasma conditions by increasing the pressure in the LBL process leads to a faster kinetic of crystallization and to an increase of the deposition rate by a factor of two. The increase of the pressure and the decrease of the inter-electrode distance allowed to increase the deposition rate from 0.26 to 3 Å/s in the hydrogen dilution technique. Interestingly enough, the crystalline fraction of the films remains higher than 50%. However, as the deposition rate increases the growth process results in a slower kinetic of crystallization with a long range evolution of the film composition (up to 0.5 νm).


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