Heat transfer performances of the capillary loop pulsating heat pipes with spring-loaded check valve

2020 ◽  
Vol 167 ◽  
pp. 114803 ◽  
Author(s):  
Zhenping Wan ◽  
Xiaowu Wang ◽  
Chen Feng
Keyword(s):  
Heat Transfer ◽  
Check Valve ◽  
Heat Pipes ◽  
Capillary Loop

scholarly journals Testing algorithm for heat transfer performance of nanofluid-filled heat pipe based on neural network

Open Physics ◽  
2020 ◽  
Vol 18 (1) ◽  
pp. 751-760
Author(s):  
Lei Lei
Keyword(s):  
Neural Network ◽  
Heat Transfer ◽  
Heat Pipe ◽  
Heat Transfer Performance ◽  
Volume Fraction ◽  
Heat Pipes ◽  
Transfer Performance ◽  
Analysis Model ◽  
Accurate Analysis ◽  
Testing Algorithm

AbstractTraditional testing algorithm based on pattern matching is impossible to effectively analyze the heat transfer performance of heat pipes filled with different concentrations of nanofluids, so the testing algorithm for heat transfer performance of a nanofluidic heat pipe based on neural network is proposed. Nanofluids are obtained by weighing, preparing, stirring, standing and shaking using dichotomy. Based on this, the heat transfer performance analysis model of the nanofluidic heat pipe based on artificial neural network is constructed, which is applied to the analysis of heat transfer performance of nanofluidic heat pipes to achieve accurate analysis. The experimental results show that the proposed algorithm can effectively analyze the heat transfer performance of heat pipes under different concentrations of nanofluids, and the heat transfer performance of heat pipes is best when the volume fraction of nanofluids is 0.15%.

Three-dimensional heat transfer analysis of flat-plate oscillating heat pipes

2021 ◽  
pp. 117189
Author(s):  
Kimihide Odagiri ◽  
Kieran Wolk ◽  
Stefano Cappucci ◽  
Stefano Morellina ◽  
Scott Roberts ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Flat Plate ◽  
Three Dimensional ◽  
Heat Pipes ◽  
Heat Transfer Analysis

Thermal Modeling of Unlooped and Looped Pulsating Heat Pipes

2001 ◽  
Vol 123 (6) ◽  
pp. 1159-1172 ◽  
Author(s):  
Mohammad B. Shafii ◽  
Amir Faghri ◽  
Yuwen Zhang
Keyword(s):  
Heat Transfer ◽  
Finite Difference ◽  
Heat Pipes ◽  
Analytical Models ◽  
Charge Ratio ◽  
Sensible Heat ◽  
Governing Equations ◽  
Heating Wall ◽  
Heat Mode ◽  
Explicit Finite Difference

Analytical models for both unlooped and looped Pulsating Heat Pipes (PHPs) with multiple liquid slugs and vapor plugs are presented in this study. The governing equations are solved using an explicit finite difference scheme to predict the behavior of vapor plugs and liquid slugs. The results show that the effect of gravity on the performance of top heat mode unlooped PHP is insignificant. The effects of diameter, charge ratio, and heating wall temperature on the performance of looped and unlooped PHPs are also investigated. The results also show that heat transfer in both looped and unlooped PHPs is due mainly to the exchange of sensible heat.

Heat transfer intensification by increasing vapor flow rate in flat heat pipes

2015 ◽  
Author(s):  
Silviu Sprinceana ◽  
Ioan Mihai ◽  
Marius Beniuga ◽  
Cornel Suciu
Keyword(s):  
Heat Transfer ◽  
Flow Rate ◽  
Heat Pipes ◽  
Vapor Flow ◽  
Heat Transfer Intensification

Numerical and Experimental Investigation of Heat Transfer Enhancement Using Heat Pipes for Electronic Cooling

2018 ◽  
Author(s):  
Ning Zhang ◽  
Pankaj R. Chandra ◽  
Ryan Robledo ◽  
Sree Harsha Balijepalli
Keyword(s):  
Heat Transfer ◽  
Heat Pipes ◽  
Copper Plate ◽  
Heat Sinks ◽  
Modern World ◽  
Processing Unit ◽  
Maximum Heat ◽  
Central Processing ◽  
Load Combination ◽  
Maximum Heat Transfer

Computers are crucial to nearly every endeavor in the modern world. Some computers, particularly those used in military applications, are required to endure extreme conditions with limited maintenance and few parts. Units such as these will hereafter be referred to as “rugged computers.” This series of experiments aims to produce improvements to rugged computers currently in service. Using heat pipes and finned heat sinks on an enclosed box, a computer’s Central Processing Unit (CPU) is able to reject heat without suffering contamination from unforgiving environments. A modular prototype was designed to allow for three distinct cases; a case with no heat pipes and fins, a cast with heat-pipes mounted internally with exterior fins and a case with heat-pipes extended externally with exterior fins. Each case was tested at three different heat loads, with a copper plate heated by a silicone heat strip simulating the heat load generated by a CPU. Each case/load combination was run many times to check for repeatability. The aim of this research is to discover the ideal case for maximum heat transfer from the CPU to the external environment. In addition to the experiments, numerical simulation of these modular prototypes with different designs of heat pipes were conducted in this research. Creating an accurate model for computer simulations will provide validation for the experiments and will prove useful in testing cases not represented by the modular prototype. The flow and heat transfer simulations were conducted using Autodesk CFD. The aim here is to create a model that accurately reflects the experimentally-verified results from the modular prototype’s cases and loads, thereby providing a base from whence further designs can branch off and be simulated with a fair degree of accuracy.

Theoretical Investigation of Heat Pipes Operating at Low Vapor Pressures

1968 ◽  
Vol 90 (4) ◽  
pp. 547-552 ◽  
Author(s):  
E. K. Levy
Keyword(s):  
Heat Transfer ◽  
Heat Pipe ◽  
Dimensional Analysis ◽  
Theoretical Investigation ◽  
Heat Pipes ◽  
Vapor Pressures ◽  
One Dimensional ◽  
Evaporator Section ◽  
Heat Transfer Capacity ◽  
Theoretical Results

A one-dimensional analysis of a compressible vapor flowing within the evaporator section of a heat pipe is presented. Comparisons between the theoretical results and existing heat pipe data show that the presence of gasdynamic choking can limit the heat transfer capacity of a heat pipe operating at sufficiently low vapor pressures.

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