scholarly journals HCl, KCl and KOH solvation resolved solute-solvent interactions and solution surface stress

2017 ◽  
Vol 422 ◽  
pp. 475-481 ◽  
Author(s):  
Xi Zhang ◽  
Yan Xu ◽  
Yong Zhou ◽  
Yinyan Gong ◽  
Yongli Huang ◽  
...  
Author(s):  
Theresa Han ◽  
Eunin Cho ◽  
Jinwoo Heo ◽  
Seoung Jae Lee

Abstract In the manufacture of Printed Wiring Boards (PWB), unwelcome structures, such as nodules and whiskers can be formed during copper electroplating with copper sulfate. Copper (Cu) whiskers with lengths of up to a few hundred micrometers can lead to electrical shorts between layers or patterns. In this paper, we document factors that can affect the growth of Cu whiskers; decomposition of additives in the Cu electroplating solution, surface stress, acidic cleaner, and the ingredients of a dry film. Contaminants from outside of the electroplating bath and the ingredients of the dry film were shown as key components in the formation of Cu whiskers.


2020 ◽  
Vol 22 (4) ◽  
pp. 939-958
Author(s):  
Indrajit Roy ◽  
D. P. Acharya ◽  
Sourav Acharya

AbstractThe present paper investigates the propagation of quasi longitudinal (qLD) and quasi transverse (qTD) waves in a magneto elastic fibre-reinforced rotating semi-infinite medium. Reflections of waves from the flat boundary with surface stress have been studied in details. The governing equations have been used to obtain the polynomial characteristic equation from which qLD and qTD wave velocities are found. It is observed that both the wave velocities depend upon the incident angle. After imposing the appropriate boundary conditions including surface stress the resultant amplitude ratios for the total displacements have been obtained. Numerically simulated results have been depicted graphically by displaying two and three dimensional graphs to highlight the influence of magnetic field, rotation, surface stress and fibre-reinforcing nature of the material medium on the propagation and reflection of plane waves.


2020 ◽  
Vol 13 (11) ◽  
pp. 115004
Author(s):  
Yehejong Saqier ◽  
Guohong Yun ◽  
Bai Narsu

1992 ◽  
Vol 57 (11) ◽  
pp. 2227-2234 ◽  
Author(s):  
Ján Benko ◽  
Oľga Vollárová

The enthalpies of solution ∆Hs0 were determined for NaSCN, KSCN, NaBrO3, KBrO3, NaClO3, KClO3, NaIO4, KMnO4, KNO2 and NaNO2 in water-methanol mixtures. The transfer functions ∆Ht0 of the salts and anions were calculated based on the extrathermodynamic TPTB assumption. The ∆Ht0 values of the anion obtained from the sodium and potassium salts were compared. The differences observed, particularly at higher concentrations of the cosolvent, are discussed with respect to the interactions between the solvent molecules and the solute-solvent interactions.


2005 ◽  
Vol 70 (12) ◽  
pp. 2027-2037 ◽  
Author(s):  
Teresa Łuczak

Adsorption of aliphatic amines (C1-C4) at the gold electrode was studied by tensammetry. It has been established that the experimental dependence between the gold surface coverage (Θ) and the bulk amine concentration (cA) fits satisfactorily both by the Frumkin and Flory-Huggins isotherms. The standard Gibbs energy of adsorption, ∆G°ad at Emax for Θ < 0.8 has been found to increase in the order methylamine < ethylamine < propylamine < butylamine. This is rationalised in terms of surface-adsorbate, adsorbate-adsorbate and adsorbate-solvent interactions.


2000 ◽  
Vol 65 (9) ◽  
pp. 1455-1463
Author(s):  
Oľga Vollárová ◽  
Ján Benko

The solubility, partial molar volume and standard integral molar enthalpy of solution of cis- and trans-[CoCl2(en)2]Cl in water, aqueous methanol, aqueous tert-butyl alcohol and aqueous acetonitrile are reported. The transfer functions ∆Gt0, ∆Ht0 and T∆St0 as well as partial molar volumes are used to obtain information on the solute-solvent interactions. Results obtained are discussed in terms of differences in the surface charge distribution in isomeric coordination species.


2007 ◽  
Vol 78 (1) ◽  
pp. 13001 ◽  
Author(s):  
Y Umeno ◽  
C Elsässer ◽  
B Meyer ◽  
P Gumbsch ◽  
M Nothacker ◽  
...  

Author(s):  
Siu-Wai Chan ◽  
Wenxuan Wang
Keyword(s):  

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