Outstanding radiation tolerance and mechanical behavior in ultra-fine nanocrystalline Al1.5CoCrFeNi high entropy alloy films under He ion irradiation

2020 ◽  
Vol 516 ◽  
pp. 146129
Author(s):  
Guo Pu ◽  
Liwei Lin ◽  
Ran Ang ◽  
Kun Zhang ◽  
Bo Liu ◽  
...  
Keyword(s):  
Mechanical Behavior ◽  
Ion Irradiation ◽  
High Entropy Alloy ◽  
Radiation Tolerance ◽  
Alloy Films ◽  
High Entropy

Mechanical behavior of the HfNbZrTi high entropy alloy after ion irradiation based on micro-pillar compression tests

2022 ◽  
Vol 892 ◽  
pp. 162043
Author(s):  
Shengyuan Peng ◽  
Ke Jin ◽  
Xin Yi ◽  
Zhaohui Dong ◽  
Xun Guo ◽  
...  
Keyword(s):  
Mechanical Behavior ◽  
Ion Irradiation ◽  
High Entropy Alloy ◽  
Compression Tests ◽  
High Entropy

scholarly journals Microstructural stability and mechanical behavior of FeNiMnCr high entropy alloy under ion irradiation

2016 ◽  
Vol 113 ◽  
pp. 230-244 ◽  
Author(s):  
N.A.P. Kiran Kumar ◽  
C. Li ◽  
K.J. Leonard ◽  
H. Bei ◽  
S.J. Zinkle
Keyword(s):  
Mechanical Behavior ◽  
Ion Irradiation ◽  
High Entropy Alloy ◽  
Microstructural Stability ◽  
High Entropy

Ion irradiation response and mechanical behavior of reduced activity high entropy alloy

2020 ◽  
Vol 529 ◽  
pp. 151955 ◽  
Author(s):  
Maryam Sadeghilaridjani ◽  
Aditya Ayyagari ◽  
Saideep Muskeri ◽  
Vahid Hasannaeimi ◽  
Riyadh Salloom ◽  
...  
Keyword(s):  
Mechanical Behavior ◽  
Ion Irradiation ◽  
High Entropy Alloy ◽  
High Entropy ◽  
Reduced Activity

Fatigue resistance of nanotwinned high-entropy alloy films

2019 ◽  
Vol 739 ◽  
pp. 26-30 ◽  
Author(s):  
Wenyi Huo ◽  
Feng Fang ◽  
Xiaodong Liu ◽  
Shuyong Tan ◽  
Zonghan Xie ◽  
...  
Keyword(s):  
Fatigue Resistance ◽  
High Entropy Alloy ◽  
Alloy Films ◽  
High Entropy

scholarly journals Diffusion Barrier Performance of AlCrTaTiZr/AlCrTaTiZr-N High-Entropy Alloy Films for Cu/Si Connect System

Entropy ◽  
2020 ◽  
Vol 22 (2) ◽  
pp. 234
Author(s):  
Chunxia Jiang ◽  
Rongbin Li ◽  
Xin Wang ◽  
Hailong Shang ◽  
Yong Zhang ◽  
...  
Keyword(s):  
Intermetallic Compounds ◽  
Diffusion Barrier ◽  
Lattice Mismatch ◽  
Copper Film ◽  
Amorphous Structure ◽  
High Entropy Alloy ◽  
Alloy Films ◽  
High Entropy ◽  
Atom Diffusion ◽  
Barrier Performance

In this study, high-entropy alloy films, namely, AlCrTaTiZr/AlCrTaTiZr-N, were deposited on the n-type (100) silicon substrate. Then, a copper film was deposited on the high-entropy alloy films. The diffusion barrier performance of AlCrTaTiZr/AlCrTaTiZr-N for Cu/Si connect system was investigated after thermal annealing for an hour at 600 °C, 700 °C, 800 °C, and 900 °C. There were no Cu-Si intermetallic compounds generated in the Cu/AlCrTaTiZr/AlCrTaTiZr-N/Si film stacks after annealing even at 900 °C through transmission electron microscopy (TEM) and atomic probe tomography (APT) analysis. The results indicated that AlCrTaTiZr/AlCrTaTiZr-N alloy films can prevent copper diffusion at 900 °C. The reason was investigated in this work. The amorphous structure of the AlCrTaTiZr layer has lower driving force to form intermetallic compounds; the lattice mismatch between the AlCrTaTiZr and AlCrTaTiZ-rN layers increased the diffusion distance of the Cu atoms and the difficulty of the Cu atom diffusion to the Si substrate.

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