scholarly journals Diffusion Barrier Performance of AlCrTaTiZr/AlCrTaTiZr-N High-Entropy Alloy Films for Cu/Si Connect System

Entropy ◽  
2020 ◽  
Vol 22 (2) ◽  
pp. 234
Author(s):  
Chunxia Jiang ◽  
Rongbin Li ◽  
Xin Wang ◽  
Hailong Shang ◽  
Yong Zhang ◽  
...  
Keyword(s):  
Intermetallic Compounds ◽  
Diffusion Barrier ◽  
Lattice Mismatch ◽  
Copper Film ◽  
Amorphous Structure ◽  
High Entropy Alloy ◽  
Alloy Films ◽  
High Entropy ◽  
Atom Diffusion ◽  
Barrier Performance

In this study, high-entropy alloy films, namely, AlCrTaTiZr/AlCrTaTiZr-N, were deposited on the n-type (100) silicon substrate. Then, a copper film was deposited on the high-entropy alloy films. The diffusion barrier performance of AlCrTaTiZr/AlCrTaTiZr-N for Cu/Si connect system was investigated after thermal annealing for an hour at 600 °C, 700 °C, 800 °C, and 900 °C. There were no Cu-Si intermetallic compounds generated in the Cu/AlCrTaTiZr/AlCrTaTiZr-N/Si film stacks after annealing even at 900 °C through transmission electron microscopy (TEM) and atomic probe tomography (APT) analysis. The results indicated that AlCrTaTiZr/AlCrTaTiZr-N alloy films can prevent copper diffusion at 900 °C. The reason was investigated in this work. The amorphous structure of the AlCrTaTiZr layer has lower driving force to form intermetallic compounds; the lattice mismatch between the AlCrTaTiZr and AlCrTaTiZ-rN layers increased the diffusion distance of the Cu atoms and the difficulty of the Cu atom diffusion to the Si substrate.

AlCoCrNiMo high-entropy alloy as diffusion barrier between NiAlHf coating and Ni-based single crystal superalloy

2021 ◽  
Vol 414 ◽  
pp. 127101 ◽  
Author(s):  
Zhongzhan Xu ◽  
Peng Zhang ◽  
Wei Wang ◽  
Qian Shi ◽  
Hongzhi Yang ◽  
...  
Keyword(s):  
Single Crystal ◽  
Diffusion Barrier ◽  
Single Crystal Superalloy ◽  
High Entropy Alloy ◽  
High Entropy

scholarly journals A Study of Thin Film Resistors Prepared Using Ni-Cr-Si-Al-Ta High Entropy Alloy

2015 ◽  
Vol 2015 ◽  
pp. 1-7 ◽  
Author(s):  
Ruei-Cheng Lin ◽  
Tai-Kuang Lee ◽  
Der-Ho Wu ◽  
Ying-Chieh Lee
Keyword(s):  
Annealing Temperature ◽  
Phase Evolution ◽  
Amorphous Structure ◽  
High Entropy Alloy ◽  
X Ray Diffraction ◽  
Temperature Coefficient Of Resistance ◽  
X Ray ◽  
High Entropy ◽  
Transmission Electron ◽  
Thin Film Resistors

Ni-Cr-Si-Al-Ta resistive thin films were prepared on glass and Al2O3substrates by DC magnetron cosputtering from targets of Ni0.35-Cr0.25-Si0.2-Al0.2casting alloy and Ta metal. Electrical properties and microstructures of Ni-Cr-Si-Al-Ta films under different sputtering powers and annealing temperatures were investigated. The phase evolution, microstructure, and composition of Ni-Cr-Si-Al-Ta films were characterized by X-ray diffraction (XRD), transmission electron microscopy (TEM), and Auger electron spectroscopy (AES). When the annealing temperature was set to 300°C, the Ni-Cr-Si-Al-Ta films with an amorphous structure were observed. When the annealing temperature was at 500°C, the Ni-Cr-Si-Al-Ta films crystallized into Al0.9Ni4.22, Cr2Ta, and Ta5Si3phases. The Ni-Cr-Si-Al-Ta films deposited at 100 W and annealed at 300°C which exhibited the higher resistivity 2215 μΩ-cm with −10 ppm/°C of temperature coefficient of resistance (TCR).

Fatigue resistance of nanotwinned high-entropy alloy films

2019 ◽  
Vol 739 ◽  
pp. 26-30 ◽  
Author(s):  
Wenyi Huo ◽  
Feng Fang ◽  
Xiaodong Liu ◽  
Shuyong Tan ◽  
Zonghan Xie ◽  
...  
Keyword(s):  
Fatigue Resistance ◽  
High Entropy Alloy ◽  
Alloy Films ◽  
High Entropy

Solid State Amorphization and Alloy Parameters for High Entropy Alloys

2021 ◽  
Vol 1016 ◽  
pp. 990-996
Author(s):  
Takeshi Nagase
Keyword(s):  
Solid Solution ◽  
Solid State ◽  
Intermetallic Compounds ◽  
Electron Irradiation ◽  
Fast Electron ◽  
High Entropy Alloy ◽  
Solid Solution Formation ◽  
High Entropy ◽  
Solution Formation ◽  
State Amorphization

Fast electron irradiation can induce the solid-state amorphization (SSA) of many intermetallic compounds. The occurrence of SSA stimulated by fast electron irradiation was found in the Al0.5TiZrPdCuNi high-entropy alloy (HEA). The relationship between the occurrence of SSA in intermetallic compounds under fast electron irradiation and the empirical alloy parameters for predicting the solid-solution-formation tendency in HEAs was discussed. The occurrence of SSA in intermetallic compounds was hardly predicted, only by the alloy parameters of δ or ΔHmix, which have been widely used for predicting solid-solution formation in HEAs. All intermetallic compounds with ΔHmix ≤ -35 kJ/mol and those with δ ≥ 12.5 exhibit the occurrence of SSA. This implies that the intermetallic compounds with a largely negative ΔHmix value and a largely positive δ parameter are favorable for the occurrence of SSA.

Fracture of void-embedded high-entropy-alloy films: A comprehensive atomistic study

Materialia ◽  
2020 ◽  
Vol 12 ◽  
pp. 100790 ◽  
Author(s):  
Yi Cui ◽  
Zengtao Chen ◽  
Yang Ju
Keyword(s):  
High Entropy Alloy ◽  
Alloy Films ◽  
High Entropy ◽  
Atomistic Study

scholarly journals Effects of Nb Addition on Microstructures and Mechanical Properties of Nbx-CoCrFeMnNi High Entropy Alloy Films

Coatings ◽  
2021 ◽  
Vol 11 (12) ◽  
pp. 1539
Author(s):  
Yu-Hsuan Liang ◽  
Chia-Lin Li ◽  
Chun-Hway Hsueh
Keyword(s):  
Mechanical Properties ◽  
Amorphous Phase ◽  
Compressive Yield Strength ◽  
High Entropy Alloy ◽  
Face Centered Cubic ◽  
Compression Tests ◽  
Alloy Films ◽  
High Entropy ◽  
Microstructures And Mechanical Properties ◽  
Nb Addition

In the present work, Nbx-CoCrFeMnNi high entropy alloy films (HEAFs, 0 to 7.2 at.% Nb) were fabricated by radio frequency (RF) magnetron co-sputtering of CoCrFeMnNi alloy and Nb targets. The effects of Nb addition on the microstructures and mechanical properties of HEAFs were systematically investigated. For Nb-free film (0 at.% Nb), the face-centered cubic (FCC) peaks were identified in the X-ray diffraction (XRD) pattern. The addition of Nb resulted in a broadening of diffraction peaks, a decrease in peak intensity, and the vanishment of high-angle peaks. Transmission electron microscope (TEM) images indicated the formation of nanotwins at low Nb concentrations, and a transition from a single phase FCC solid solution to an amorphous phase was observed with the increasing Nb concentration. The films were strengthened with an increase in Nb concentration. Specifically, the hardness characterized by nanoindentation increased from 6.5 to 8.1 GPa. The compressive yield strength and fracture strength measured from micropillar compression tests were improved from 1.08 GPs and 2.56 GPa to 2.70 GPa and 5.76 GPa, respectively, whereas the fracture strain decreased from >29.4% (no fracture) to 15.8%. Additionally, shear banding was observed in the presence of amorphous phase.

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