Hard-templating of carbon using porous SiO2 monoliths revisited - Quantitative impact of spatial confinement on the microstructure evolution

Carbon ◽  
2018 ◽  
Vol 129 ◽  
pp. 552-563 ◽  
Author(s):  
M.O. Loeh ◽  
F. Badaczewski ◽  
M. von der Lehr ◽  
R. Ellinghaus ◽  
S. Dobrotka ◽  
...  
2014 ◽  
Vol 29 (9) ◽  
pp. 941
Author(s):  
JIANG Jin-Long ◽  
WANG Qiong ◽  
HUANG Hao ◽  
ZHANG Xia ◽  
WANG Yu-Bao ◽  
...  

2019 ◽  
Author(s):  
Amalia Rapakousiou ◽  
Alejandro López-moreno ◽  
Belén Nieto-Ortega ◽  
M. Mar Bernal ◽  
Miguel A. Monclús ◽  
...  

We introduce poly(1,6-pyrene terephthalamide) polymer (PPyrTA) as an aromatic polyamide analogue of poly(p-phenylene terephthalamide) (PPTA), also known as Kevlar®. This work shows that the incorporation of polycyclic aromatic pyrene moieties improves drastically the mechanical properties of the polymeric structure, increasing elastic nanoindentation-determined modulus and hardness by factors of 1.9 and 4.3, respectively. Liquid deprotonated dispersions of PPyrTA nanofibers were used as nanoscale building block for producing large-surface, free-standing polymer macroscopic nanofilms. This 2D assembly leads to further significant improvements in reduced modulus and hardness (more than twice) compared to the starting polymer macroscale fibres, due to a better re-organizational arrangement of the PPyrTA nanofibers in the nanofilms, formed under 2D spatial confinement.


Author(s):  
Wentao Qin ◽  
Dorai Iyer ◽  
Jim Morgan ◽  
Carroll Casteel ◽  
Robert Watkins ◽  
...  

Abstract Ni(5 at.%Pt ) films were silicided at a temperature below 400 °C and at 550 °C. The two silicidation temperatures had produced different responses to the subsequent metal etch. Catastrophic removal of the silicide was seen with the low silicidation temperature, while the desired etch selectivity was achieved with the high silicidation temperature. The surface microstructures developed were characterized with TEM and Auger depth profiling. The data correlate with both silicidation temperatures and ultimately the difference in the response to the metal etch. With the high silicidation temperature, there existed a thin Si-oxide film that was close to the surface and embedded with particles which contain metals. This thin film is expected to contribute significantly to the desired etch selectivity. The formation of this layer is interpreted thermodynamically.


2020 ◽  
Author(s):  
Yuanjiang Lv ◽  
Xin Xin Lian ◽  
Haoliang Sun ◽  
Xiaoxue Huang ◽  
Guang xin Wang

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