Three dimensional coupled thermoelasticity solution of sandwich plate with FGM core under thermal shock

2017 ◽  
Vol 177 ◽  
pp. 96-103 ◽  
Author(s):  
A. Alibeigloo
Keyword(s):  
Thermal Shock ◽  
Sandwich Plate ◽  
Three Dimensional ◽  
Coupled Thermoelasticity

Dependence of the Deformation of 128×128 InSb Focal-plane Arrays on the Silicon Readout Integrated Circuit Thickness

2015 ◽  
Vol 9 (1) ◽  
pp. 170-174 ◽  
Author(s):  
Xiaoling Zhang ◽  
Qingduan Meng ◽  
Liwen Zhang
Keyword(s):  
Thermal Shock ◽  
Indium Antimonide ◽  
Integrated Circuit ◽  
Focal Plane ◽  
Three Dimensional ◽  
Fracture Probability ◽  
Focal Plane Arrays ◽  
Thermal Shock Test ◽  
Readout Integrated Circuit ◽  
Three Dimensional Modeling

The square checkerboard buckling deformation appearing in indium antimonide infrared focal-plane arrays (InSb IRFPAs) subjected to the thermal shock tests, results in the fracturing of the InSb chip, which restricts its final yield. In light of the proposed three-dimensional modeling, we proposed the method of thinning a silicon readout integrated circuit (ROIC) to level the uneven top surface of InSb IRFPAs. Simulation results show that when the silicon ROIC is thinned from 300 μm to 20 μm, the maximal displacement in the InSb IRFPAs linearly decreases from 7.115 μm to 0.670 μm in the upward direction, and also decreases linearly from 14.013 μm to 1.612 μm in the downward direction. Once the thickness of the silicon ROIC is less than 50 μm, the square checkerboard buckling deformation distribution presenting in the thicker InSb IRFPAs disappears, and the top surface of the InSb IRFPAs becomes flat. All these findings imply that the thickness of the silicon ROIC determines the degree of deformation in the InSb IRFPAs under a thermal shock test, that the method of thinning a silicon ROIC is suitable for decreasing the fracture probability of the InSb chip, and that this approach improves the reliability of InSb IRFPAs.

Coupled thermoelasticity of FG-GPLRC multi-curved composite panel under thermal shock loading

2021 ◽  
pp. 114515
Author(s):  
Qiangfeng Wang ◽  
Jun Gao ◽  
Shengbin Wu ◽  
Mohamed Amine Khadimallah ◽  
Huiwei Chen
Keyword(s):  
Thermal Shock ◽  
Shock Loading ◽  
Composite Panel ◽  
Coupled Thermoelasticity

Thermal shock behavior of a three-dimensional SiC/SiC composite

2006 ◽  
Vol 37 (12) ◽  
pp. 3587-3592 ◽  
Author(s):  
Shoujun Wu ◽  
Laifei Cheng ◽  
Litong Zhang ◽  
Yongdong Xu
Keyword(s):  
Thermal Shock ◽  
Three Dimensional ◽  
Thermal Shock Behavior

scholarly journals Applications of Energy Release Rate Techniques to Part-Through Cracks in Experimental Pressure Vessels

1982 ◽  
Vol 104 (4) ◽  
pp. 308-316 ◽  
Author(s):  
B. R. Bass ◽  
R. H. Bryan ◽  
J. W. Bryson ◽  
J. G. Merkle
Keyword(s):  
Energy Release Rate ◽  
Thermal Shock ◽  
Energy Release ◽  
Release Rate ◽  
Three Dimensional ◽  
Pressure Vessels ◽  
Test Vessel ◽  
Deformation Plasticity ◽  
Cracked Structures ◽  
Virtual Crack Extension Method

In nonlinear applications of computational fracture mechanics, energy release rate techniques are used increasingly for computing stress intensity parameters of crack configurations. Recently, deLorenzi used the virtual-crack-extension method to derive an analytical expression for the energy release rate that is better suited for three-dimensional calculations than the well-known J-integral. Certain studies of fracture phenomena, such as pressurized-thermal-shock of cracked structures, require that crack tip parameters be determined for combined thermal and mechanical loads. A method is proposed here that modifies the isothermal formulation of deLorenzi to account for thermal strains in cracked bodies. This combined thermo-mechanical formulation of the energy release rate is valid for general fracture, including nonplanar fracture, and applies to thermo-elastic as well as deformation plasticity material models. Two applications of the technique are described here. In the first, semi-elliptical surface cracks in an experimental test vessel are analyzed under elastic-plastic conditions using the finite element method. The second application is a thick-walled test vessel subjected to combined pressure and thermal shock loading.

Stable and Unstable Crack Growth of A508 Class 3 Plates Subjected to Combined Force of Thermal Shock and Tension

1989 ◽  
Vol 111 (3) ◽  
pp. 234-240 ◽  
Author(s):  
G. Yagawa ◽  
Y. Ando ◽  
K. Ishihara ◽  
T. Iwadate ◽  
Y. Tanaka
Keyword(s):  
Thermal Shock ◽  
Nuclear Power ◽  
Power Plants ◽  
Fracture Behavior ◽  
Structural Integrity ◽  
Three Dimensional ◽  
Test Results ◽  
Unstable Crack ◽  
Pressurized Thermal Shock ◽  
Series Of Experiments

An urgent problem for nuclear power plants is to assess the structural integrity of the reactor pressure vessel under pressurized thermal shock. In order to estimate crack behavior under combined force of thermal shock and tension simulating pressurized thermal shock, two series of experiments are demonstrated: one to study the effect of material deterioration due to neutron irradiation on the fracture behavior, and the other to study the effect of system compliance on fracture behavior. The test results are discussed with the three-dimensional elastic-plastic fracture parameters, J and Jˆ integrals.

scholarly journals Three-Dimensional Vibration Analysis of a Functionally Graded Sandwich Rectangular Plate Resting on an Elastic Foundation Using a Semi-Analytical Method

Materials ◽  
2019 ◽  
Vol 12 (20) ◽  
pp. 3401 ◽  
Author(s):  
Cui ◽  
Zhou ◽  
Ye ◽  
Gaidai ◽  
Li ◽  
...  
Keyword(s):  
Boundary Conditions ◽  
Rectangular Plate ◽  
Elastic Foundation ◽  
Power Law ◽  
Analytical Method ◽  
Sandwich Plate ◽  
Natural Frequencies ◽  
Three Dimensional ◽  
Functionally Graded ◽  
Sandwich Plates

The three-dimensional vibration of a functionally graded sandwich rectangular plate on an elastic foundation with normal boundary conditions was analyzed using a semi-analytical method based on three-dimensional elasticity theory. The material properties of the sandwich plate varied with thickness according to the power law distribution. Two types of functionally graded material (FGM) sandwich plates were investigated in this paper: one with a homogeneous core and FGM facesheets, and another with homogeneous panels and an FGM core. Various displacements of the plates were created using an improved Fourier series consisting of a standard Fourier cosine series along with a certain number of closed-form auxiliary functions satisfying the essential boundary conditions. The vibration behavior of the FGM sandwich plate, including the natural frequencies and mode shapes, was obtained using the Ritz method. The effectiveness and accuracy of the suggested technique were fully verified by comparing the natural frequencies of sandwich plates with results from investigations of other functionally graded sandwich rectangular plates in the literature. A parametric study, including elastic parameters, foundation parameters, power law exponents, and layer thickness ratios, was performed, and some new results are presented.

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