Characteristics of biochemical resistance mechanism of novel insecticides in Phenacoccus solenopsis Tinsley (Hemiptera: Pseudococcidae)

2020 ◽  
Vol 138 ◽  
pp. 105320 ◽  
Author(s):  
Muhammad Zeeshan Nazar ◽  
Shoaib Freed ◽  
Sikandar Hussain ◽  
Muhammad Waqas Sumra ◽  
Muhammad Sheraz Shah ◽  
...  
2018 ◽  
Vol 19 (4) ◽  
pp. 1441-1450 ◽  
Author(s):  
LOLA ADRES YANTI ◽  
ACHMAD ACHMAD ◽  
NURUL KHUMAIDA

Yanti LA, Achmad, Khumaida N. 2018. Resistance mechanisms of white jabon seedlings (Anthocephalus cadamba) againstBotryodiplodia theobromae causing dieback disease. Biodiversitas 19: 1441-1450. Anthocephalus cadamba (Roxb.) Miq. seedlings arethe most preferred plant for the nursery as they serve a lot of benefits and can be used as shading trees, reforestation, plywood, pulp,paper, and traditional medicines. Further, those benefits can increase the economic value of this plant. The main problem in the nurseryof forestry plants is pest and disease attacks, one of which is dieback disease. The dieback disease is caused by Botryodiplodiatheobromae Pat. that may lead death of the host plant. Every plant has its resistance mechanism toward pathogen attacks. This researchaimed: (1) to study B. theobromae attack through wounded and non-wounded stem infection methods on white jabon seedlings; (2) tostudy the resistance mechanisms of white jabon seedlings both structural and biochemical resistance against B. theobromae. This studyemployed a factorial treatment design laid out in a completely randomized design. The structural resistance was determined by studyingthe microscopic appearance of the white jabon seedlings’ stem by using a scanning electron microscope. Meanwhile, the biochemicalresistance was determined by characterizing the chemical compounds of white jabon seedlings' stem using phytochemistry analysis. Theresult showed that the disease incidence of the control (inoculated without pathogen isolate) and the inoculated (inoculated withpathogen isolate) seedlings were, respectively, 0% and 100% (with wounded stem) and 0% and 30% (non-wounded). The diseaseseverity of control and inoculated seedlings were 0% and 62% (with wounded stem) and 0% and 12% (non-wounded stem),respectively. The incubation period of wounded and non-wounded stems on inoculated seedlings (inoculated with pathogen isolate) wasone day after inoculation with the numeric values (disease scores) of 4 and 2, respectively. White jabon seedlings had necrotic resistanceas structural resistance mechanism against the pathogen attack. White jabon seedlings also contained secondary metabolites such asalkaloids, flavonoid, phenyl hydroquinone, tannin, saponin, and steroids. The biochemical resistance of white jabon seedling afterpathogen attacks was shown by the increase of accumulated phenolic compounds such as flavonoid and tannin.


2013 ◽  
Vol 59 (2) ◽  
pp. 81-89
Author(s):  
Tomoaki Soma ◽  
Masafumi Inoue ◽  
Masahiro Inayama ◽  
Hiroya Obayashi ◽  
Naoto Ando

2020 ◽  
Vol 53 (1) ◽  
Author(s):  
Anam Mehwish Khanzada ◽  
Muhammad Ali Khanzada ◽  
Rehana Naz Syed ◽  
Abdul Mubeen Lodhi

Agrotek ◽  
2018 ◽  
Vol 2 (6) ◽  
Author(s):  
Cipta Meliala ◽  
Felicity Fear ◽  
Denis Tourvieille de Labrouhe

Downy mildew symptoms caused by Plasmopara halstedii encountered in sunflower plantation are varied. This variation may be related to the resistance mechanism presented by plant to the invasion of the fungus. Our objectives were firstly is to evaluate symptom development after fungus race 710 inoculation on some vegetative stage of susceptible hybrid. Second objective is to evaluate the reaction some sunflower genotypes after fungus inoculation. The study was conducted under controlled conditions or under netting cages in the field. The development of downy mildew symptoms were affected by all factors studied. Shoot inoculation may present a good method to produce downy mildew symptom similar to the natural infection. Downy mildew symptom progression may be used to screen a genotype with a horizontal resistance.


2018 ◽  
Author(s):  
Wentao Qin ◽  
Scott Donaldson ◽  
Dan Rogers ◽  
Lahcen Boukhanfra ◽  
Julien Thiefain ◽  
...  

Abstract Many semiconductor products are manufactured with mature technologies involving the uses of aluminum (Al) lines and tungsten (W) vias. High resistances of the vias were sometimes observed only after electrical or thermal stress. A layer of Ti oxide was found on such a via. In the wafer processing, the post W chemical mechanical planarization (WCMP) cleaning left residual W oxide on the W plugs. Ti from the overlaying metal line spontaneously reduced the W oxide, through which Ti oxide formed. Compared with W oxide, the Ti oxide has a larger formation enthalpy, and the valence electrons of Ti are more tightly bound to the O ion cores. As a result, the Ti oxide is more resistive than the W oxide. Consequently, the die functioned well in the first test in the fab, but the via resistance increased significantly after a thermal stress, which led to device failure in the second test. The NH4OH concentration was therefore increased to more effectively remove residual W oxide, which solved the problem. The thermal stress had prevented the latent issue from becoming a more costly field failure.


2020 ◽  
Vol 129 (1) ◽  
pp. 63
Author(s):  
Khaoula Aroua ◽  
Mehmet Bora Kaydan ◽  
Cansu Ercan ◽  
Mohammed Biche

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