Evaluation of failure mechanism in lap splices and role of stirrup confinement using 3D RBSM

2021 ◽  
pp. 113570
Author(s):  
Usman Farooq ◽  
Hikaru Nakamura ◽  
Taito Miura
Author(s):  
Jin Young Kim ◽  
R. E. Hummel ◽  
R. T. DeHoff

Gold thin film metallizations in microelectronic circuits have a distinct advantage over those consisting of aluminum because they are less susceptible to electromigration. When electromigration is no longer the principal failure mechanism, other failure mechanisms caused by d.c. stressing might become important. In gold thin-film metallizations, grain boundary grooving is the principal failure mechanism.Previous studies have shown that grain boundary grooving in gold films can be prevented by an indium underlay between the substrate and gold. The beneficial effect of the In/Au composite film is mainly due to roughening of the surface of the gold films, redistribution of indium on the gold films and formation of In2O3 on the free surface and along the grain boundaries of the gold films during air annealing.


2022 ◽  
Vol 12 (1) ◽  
pp. 1-26
Author(s):  
M. Watford ◽  
J. Templeman ◽  
Z. Orazalin ◽  
H. Zhou ◽  
A. Franza ◽  
...  

In this paper, the lateral limiting pressure offered by the deep ‘flow-around’ soil failure mechanism for perimeter (ring) pile groups in undrained soil is explored using two−dimensional finite element modelling. A parametric study investigates the role of group configuration, pile−soil adhesion, group size, pile spacing and load direction on group capacity and corresponding soil failure mechanisms. The finite element output show that the plan group configuration (square or circular) has a negligible influence on lateral capacity for closely spaced perimeter pile groups. When compared to ‘full’ square pile groups with the same number of piles, the present results suggest that for practical pile spacing (≳ two pile diameters), perimeter groups do not necessarily increase capacity efficiency, particularly if the piles are smooth. Nevertheless, perimeter groups are shown to be characterized by both the invariance of their capacity to the direction of loading and their highly uniform load-sharing between piles, which are beneficial features to optimize design.


1993 ◽  
Vol 36 (4) ◽  
pp. 39-45
Author(s):  
J. Hu ◽  
D. Barker ◽  
A. Dasgupta ◽  
A. Arora

Accelerated life testing techniques provide a short-cut method to investigate the reliability of electronic devices with respect to certain dominant failure mechanisms that occur under normal operating conditions. However, accelerated tests have often been conducted without knowledge of the failure mechanisms and without ensuring that the test accelerated the same mechanism as that obscrved under normal operating conditions. This paper summarizes common failure mechanisms in electronic devices and packages and investigates possible failure mechanism shifting during accelerated testing.


2019 ◽  
Vol 364 ◽  
pp. 32-42 ◽  
Author(s):  
Xiangru Shi ◽  
Ben D. Beake ◽  
Tomasz W. Liskiewicz ◽  
Jian Chen ◽  
Zhengming Sun

Author(s):  
Robert W. Armstrong

The role of the forensic engineer is to interpret technical information within his/her area of expertise and present interpretations and conclusions to the client, to opposing counsel, and, if necessary, to the court. The ultimate goal is discovery of the true cause of the event which prompted the litigation. This paper presents an analysis of one mode of failure of building wire insulation found in residential, commercial and industrial electrical systems. Also presented are sources of documentation related to this failure mechanism.


2011 ◽  
Vol 196 (16) ◽  
pp. 6695-6702 ◽  
Author(s):  
D. Munao ◽  
J.W.M. van Erven ◽  
M. Valvo ◽  
E. Garcia-Tamayo ◽  
E.M. Kelder

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