Copper foam/PCMs based heat sinks: An experimental study for electronic cooling systems

2018 ◽  
Vol 127 ◽  
pp. 381-393 ◽  
Author(s):  
Tauseef-ur- Rehman ◽  
Hafiz Muhammad Ali ◽  
Ahmed Saieed ◽  
William Pao ◽  
Muzaffar Ali
Keyword(s):  
Experimental Study ◽  
Electronic Cooling ◽  
Heat Sinks ◽  
Cooling Systems ◽  
Copper Foam

scholarly journals Cooling Performance of Heat Sinks Used in Electronic Devices

2018 ◽  
Vol 171 ◽  
pp. 02003
Author(s):  
Ibrahim Mjallal ◽  
Hussein Farhat ◽  
Mohammad Hammoud ◽  
Samer Ali ◽  
Ali AL Shaer ◽  
...  
Keyword(s):  
Heat Sink ◽  
Electronic Devices ◽  
Heat Fluxes ◽  
Electronic Cooling ◽  
Heat Sinks ◽  
Passive Cooling ◽  
Short Term ◽  
Cooling Systems ◽  
Thermal Output ◽  
Electrical Devices

Existing passive cooling solutions limit the short-term thermal output of systems, thereby either limiting instantaneous performance or requiring active cooling solutions. As the temperature of the electronic devices increases, their failure rate increases. That’s why electrical devices should be cooled. Conventional electronic cooling systems usually consist of a metal heat sink coupled to a fan. This paper compares the heat distribution on a heat sink relative to different heat fluxes produced by electronic chips. The benefit of adding a fan is also investigated when high levels of heat generation are expected.

scholarly journals Combined Natural Convection and Surface Radiation Inside Vented Triangular Enclosure - An Experimental Study

2018 ◽  
Vol 144 ◽  
pp. 04019
Author(s):  
Rahul Raj ◽  
K. C. Pradyumna ◽  
B. R. Rakshith ◽  
R. B. Nithin ◽  
S. R. Karthik
Keyword(s):  
Experimental Study ◽  
Natural Convection ◽  
Radiation Heat Transfer ◽  
Base Plate ◽  
Electronic Cooling ◽  
Surface Radiation ◽  
Cooling Systems ◽  
Opening Ratio ◽  
Chamber Temperature ◽  
Triangular Enclosure

In the present experimental study, the influence of Opening ratio on the chamber temperature in case of vented triangular enclosure with hot base plate has been undertaken. Due to more flow passage, the average air temperature in the enclosure decreases by 12% for OR of 0.25 and 13% for OR of 0.5 compared to OR of 0.125. Similar trend is observed for Rayleigh number with a rise of 73% in OR 0.5 compared to OR of 0.125. Further, the influence of radiation heat transfer in the natural convection based enclosure is also studied. This kind of investigation is useful in the design and analysis of electronic cooling systems.

A REVIEW ON POLYMER HEAT SINKS FOR ELECTRONIC COOLING APPLICATIONS

2018 ◽  
Author(s):  
Daniel Borba Marchetto ◽  
Debora Carneiro Moreira ◽  
Gherhardt Ribatski
Keyword(s):  
Electronic Cooling ◽  
Heat Sinks

Influence of selected factors on parameters of a cooling system with a Peltier module and forced air flow

2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Krzysztof Posobkiewicz ◽  
Krzysztof Górecki
Keyword(s):  
Thermal Resistance ◽  
Heat Sink ◽  
Cooling System ◽  
Heat Sinks ◽  
Cooling Power ◽  
Cooling Systems ◽  
Content Type ◽  
Peltier Module ◽  
Peltier Modules ◽  
Forced Air

Purpose The purpose of this study is to investigate the validation of the usefulness of cooling systems containing Peltier modules for cooling power devices based on measurements of the influence of selected factors on the value of thermal resistance of such a cooling system. Design/methodology/approach A cooling system containing a heat-sink, a Peltier module and a fan was built by the authors and the measurements of temperatures and thermal resistance in various supply conditions of the Peltier module and the fan were carried out and discussed. Findings Conclusions from the research carried out answer the question if the use of Peltier modules in active cooling systems provides any benefits comparing with cooling systems containing just passive heat-sinks or conventional active heat-sinks constructed of a heat-sink and a fan. Research limitations/implications The research carried out is the preliminary stage to asses if a compact thermal model of the investigated cooling system can be formulated. Originality/value In the paper, the original results of measurements and calculations of parameters of a cooling system containing a Peltier module and an active heat-sink are presented and discussed. An influence of power dissipated in the components of the cooling system on its efficiency is investigated.

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