Influence of selected factors on parameters of a cooling system with a Peltier module and forced air flow

2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Krzysztof Posobkiewicz ◽  
Krzysztof Górecki
Keyword(s):  
Thermal Resistance ◽  
Heat Sink ◽  
Cooling System ◽  
Heat Sinks ◽  
Cooling Power ◽  
Cooling Systems ◽  
Content Type ◽  
Peltier Module ◽  
Peltier Modules ◽  
Forced Air

Purpose The purpose of this study is to investigate the validation of the usefulness of cooling systems containing Peltier modules for cooling power devices based on measurements of the influence of selected factors on the value of thermal resistance of such a cooling system. Design/methodology/approach A cooling system containing a heat-sink, a Peltier module and a fan was built by the authors and the measurements of temperatures and thermal resistance in various supply conditions of the Peltier module and the fan were carried out and discussed. Findings Conclusions from the research carried out answer the question if the use of Peltier modules in active cooling systems provides any benefits comparing with cooling systems containing just passive heat-sinks or conventional active heat-sinks constructed of a heat-sink and a fan. Research limitations/implications The research carried out is the preliminary stage to asses if a compact thermal model of the investigated cooling system can be formulated. Originality/value In the paper, the original results of measurements and calculations of parameters of a cooling system containing a Peltier module and an active heat-sink are presented and discussed. An influence of power dissipated in the components of the cooling system on its efficiency is investigated.

scholarly journals Influence of Selected Factors on Thermal Parameters of the Components of Forced Cooling Systems of Electronic Devices

Electronics ◽  
2021 ◽  
Vol 10 (3) ◽  
pp. 340
Author(s):  
Krzysztof Posobkiewicz ◽  
Krzysztof Górecki
Keyword(s):  
Electronic Device ◽  
Cooling System ◽  
Electronic Devices ◽  
Heat Sinks ◽  
Cooling Systems ◽  
Peltier Module ◽  
Wide Range ◽  
Peltier Modules ◽  
Analytical Formulas ◽  
Forced Cooling

The paper presents some investigation results on the properties of forced cooling systems dedicated to electronic devices. Different structures of such systems, including Peltier modules, heat sinks, fans, and thermal interfaces, are considered. Compact thermal models of such systems are formulated. These models take into account a multipath heat transfer and make it possible to compute waveforms of the device’s internal temperature at selected values of the power dissipated in the device. The analytical formulas describing the dependences of the thermal resistance of electronic devices co-operating with the considered cooling systems on the power dissipated in the cooled electronic device and the power feeding the Peltier module and the speed of airflow caused by a fan are proposed. The correctness of the proposed models is verified experimentally in a wide range of powers dissipated in electronic devices operating in different configurations of the used cooling system.

scholarly journals Effect Of Position and Design Parameters of a Fan-Cooled Cold Side Heat Sink of a Thermoelectric Cooling-Module on The Performance of a Hybrid Refrigerator

2021 ◽  
Vol 85 (2) ◽  
pp. 66-79
Author(s):  
Yasser Abdulrazak Alghanima ◽  
Osama Mesalhy ◽  
Ahmed Farouk Abdel Gawad
Keyword(s):  
Heat Sink ◽  
Cooling System ◽  
Heat Sinks ◽  
Design Parameters ◽  
Vapor Compression ◽  
Thermoelectric Cooling ◽  
Cold Side ◽  
Peltier Module ◽  
Cooling Module ◽  
Good Agreement

This paper presents a CFD and experimental study of the thermal behavior of the thermoelectric-compartment in a hybrid household-refrigerator that combines thermoelectric and vapor-compression technologies. The hybrid refrigerator has three compartments. One of them is driven by a thermoelectric cooling system, which was made of one Peltier module and two fan-cooled heat sinks mounted on the hot and cold sides. The simulation results were compared with experimental measurements and showed a good agreement. The performance of the thermoelectric refrigerator was tested with changing the pushing direction. Two pushing directions for the fan were examined. In the first one (direction-I), the fan was fixed such that it sucked the air beside the cold heat sink. While in the second direction (direction-II), the fan was assumed to be flipped to push the air over the cold-side heat sink. The results showed that the second fan direction (direction-II) is more effective for heat transfer mechanism between the cold-side heat sink and the inside air of the thermoelectric-compartment.

scholarly journals Thermal analysis and parametric optimization of plate fin heat sinks under forced air convection

2021 ◽  
pp. 81-81
Author(s):  
Zulfiqar Khattak ◽  
Hafiz Ali
Keyword(s):  
Pressure Drop ◽  
Thermal Resistance ◽  
Heat Sink ◽  
Heat Dissipation ◽  
Parametric Optimization ◽  
Heat Sinks ◽  
Air Velocity ◽  
Forced Air ◽  
Theoretical Results ◽  
Plate Type

Heat dissipation is becoming more and more challenging with the preface of new electronic components having staggering heat generation levels. Present day solutions should have optimized outcomes with reference to the heat sink scenarios. The experimental and theoretical results for plate type heat sink based on mathematical models have been presented in the first part of the paper. Then the parametric optimization (topology optimization) of plate type heat sink using Levenberg-Marquardt technique employed in the COMSOL Multiphysics? software is discussed. Thermal resistance of heat sink is taken as objective function against the variable length in a predefined range. Single as well as multi-parametric optimization of plate type heat sink is reported in the context of pressure drop and air velocity (Reynolds number) inside the tunnel. The results reported are compared with the numerical modeled data and experimental investigation to establish the conformity of results for applied usage. Mutual reimbursements of greater heat dissipation with minimum flow rates are confidently achievable through balanced, heat sink geometry as evident by the presented simulation outcome. About 12% enhancement in pressure drop and up to 51% improvement in thermal resistance is reported for the optimized plate fin heat sink as per data manifested.

Comparison between thermal resistances of optimized water-based and gallium-based heat sinks using the genetic algorithm

2019 ◽  
Vol 30 (3) ◽  
pp. 1388-1406
Author(s):  
Xiong Xiang ◽  
Yu Fan ◽  
Wei Liu ◽  
Aiwu Fan
Keyword(s):  
Genetic Algorithm ◽  
Laminar Flow ◽  
Thermal Resistance ◽  
Heat Sink ◽  
Goal Function ◽  
Heat Sinks ◽  
Channel Height ◽  
Content Type ◽  
Water Based ◽  
Cfd Method

Purpose The purpose of this paper is to compare the thermal resistances between optimized gallium- and water-based heat sinks to show which one is superior. Design/methodology/approach Taking the thermal resistances of heat sinks as the goal function, an optimization process is programmed based on the genetic algorithm. The optimal channel/fin widths and the corresponding thermal resistances of gallium- and water-based heat sinks are obtained and compared with/without a laminar flow constraint. The analytic model and CFD method are applied in different situations to ensure sufficient accuracy. Findings The results show that in the laminar regime, the thermal resistance of optimized gallium-based heat sink is lower than the water-based counterpart in most cases, but the latter becomes better if it is long enough or the channel is sufficient high. Without the laminar constraint, the thermal resistance of the optimized gallium-based heat sink can be decreased by 33-45 per cent compared with the water-based counterparts. It is interesting to find that when the heat sink is long or the channel height is short, the optimal geometry of gallium-based heat sink is a mini gap. Originality/value This paper demonstrates that the cooling performance of gallium-based heat sink can be significantly improved by optimization without the laminar flow constraint.

Thermal Behaviors of Passively-Cooled Hybrid Fin Heat Sinks for Lightweight and High Performance Thermal Management

2015 ◽  
Author(s):  
Nico Setiawan Effendi ◽  
Kyoung Joon Kim
Keyword(s):  
Thermal Resistance ◽  
Heat Sink ◽  
High Performance ◽  
Heat Dissipation ◽  
Computational Study ◽  
Heat Sinks ◽  
Channel Diameter ◽  
Internal Channel ◽  
Study Results ◽  
Parametric Effects

A computational study is conducted to explore thermal performances of natural convection hybrid fin heat sinks (HF HSs). The proposed HF HSs are a hollow hybrid fin heat sink (HHF HS) and a solid hybrid fin heat sink (SHF HS). Parametric effects such as a fin spacing, an internal channel diameter, a heat dissipation on the performance of HF HSs are investigated by CFD analysis. Study results show that the thermal resistance of the HS increases while the mass-multiplied thermal resistance of the HS decreases associated with the increase of the channel diameter. The results also shows the thermal resistance of the SHF HS is 13% smaller, and the mass-multiplied thermal resistance of the HHF HS is 32% smaller compared with the pin fin heat sink (PF HS). These interesting results are mainly due to integrated effects of the mass-reduction, the surface area enhancement, and the heat pumping via the internal channel. Such better performances of HF HSs show the feasibility of alternatives to the conventional PF HS especially for passive cooling of LED lighting modules.

Remote Heat Pipe Based Heat Exchanger Performance in Notebook Cooling

2005 ◽  
Author(s):  
Seyyed Khandani ◽  
Himanshu Pokharna ◽  
Sridhar Machiroutu ◽  
Eric DiStefano
Keyword(s):  
Heat Exchanger ◽  
Thermal Resistance ◽  
Heat Pipe ◽  
Cooling System ◽  
Temperature Drop ◽  
Operating Conditions ◽  
Cooling Systems ◽  
Temperature Variations ◽  
Non Linear ◽  
Condenser Temperature

Remote heat pipe based heat exchanger cooling systems are becoming increasingly popular in cooling of notebook computers. In such cooling systems, one or more heat pipes transfer the heat from the more populated area to a location with sufficient space allowing the use of a heat exchanger for removal of the heat from the system. In analsysis of such systems, the temperature drop in the condenser section of the heat pipe is assumed negligible due to the nature of the condensation process. However, in testing of various systems, non linear longitudinal temperature drops in the heat pipe in the range of 2 to 15 °C, for different processor power and heat exchanger airflow, have been measured. Such temperature drops could cause higher condenser thermal resistance and result in lower overall heat exchanger performance. In fact the application of the conventional method of estimating the thermal performance, which does not consider such a nonlinear temperature variations, results in inaccurate design of the cooling system and requires unnecessarily higher safety factors to compensate for this inaccuracy. To address the problem, this paper offers a new analytical approach for modeling the heat pipe based heat exchanger performance under various operating conditions. The method can be used with any arbitrary condenser temperature variations. The results of the model show significant increase in heat exchanger thermal resistance when considering a non linear condenser temperature drop. The experimental data also verifies the result of the model with sufficient accuracy and therefore validates the application of this model in estimating the performance of these systems.   This paper was also originally published as part of the Proceedings of the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems.

scholarly journals Cooling Performance of Heat Sinks Used in Electronic Devices

2018 ◽  
Vol 171 ◽  
pp. 02003
Author(s):  
Ibrahim Mjallal ◽  
Hussein Farhat ◽  
Mohammad Hammoud ◽  
Samer Ali ◽  
Ali AL Shaer ◽  
...  
Keyword(s):  
Heat Sink ◽  
Electronic Devices ◽  
Heat Fluxes ◽  
Electronic Cooling ◽  
Heat Sinks ◽  
Passive Cooling ◽  
Short Term ◽  
Cooling Systems ◽  
Thermal Output ◽  
Electrical Devices

Existing passive cooling solutions limit the short-term thermal output of systems, thereby either limiting instantaneous performance or requiring active cooling solutions. As the temperature of the electronic devices increases, their failure rate increases. That’s why electrical devices should be cooled. Conventional electronic cooling systems usually consist of a metal heat sink coupled to a fan. This paper compares the heat distribution on a heat sink relative to different heat fluxes produced by electronic chips. The benefit of adding a fan is also investigated when high levels of heat generation are expected.

Network modelling of dry-type transformer cooling systems

2018 ◽  
Vol 37 (3) ◽  
pp. 1039-1053 ◽  
Author(s):  
Andrea Cremasco ◽  
Wei Wu ◽  
Andreas Blaszczyk ◽  
Bogdan Cranganu-Cretu
Keyword(s):  
Network Model ◽  
Thermal Model ◽  
Cfd Simulation ◽  
Cooling System ◽  
Cfd Simulations ◽  
Network Modelling ◽  
Cooling Systems ◽  
Content Type ◽  
System Configurations ◽  
Dielectric Insulation

Purpose The application of dry-type transformers is growing in the market because the technology is non-flammable, safer and environmentally friendly. However, the unit dimensions are normally larger and material costs become higher, as no oil is present for dielectric insulation or cooling. At designing stage, a transformer thermal model used for predicting temperature rise is fundamental and the modelling of cooling system is particularly important. This paper aims to describe a thermal model used to compute dry transformers with different cooling system configurations. Design/methodology/approach The paper introduces a fast-calculating thermal and pressure network model for dry-transformer cooling systems, preliminarily verified by analytical methods and advanced CFD simulations, and finally validated with experimental results. Findings This paper provides an overview of the network model of dry-transformer cooling system, describing its topology and its main variants including natural or forced ventilation, with or without cooling duct in the core, enclosure with roof and floor ventilation openings and air barriers. Finally, it presents a formulation for the new heat exchanger element. Originality/value The network approach presented in this paper allows to model efficiently the cooling system of dry-type transformers. This model is based on physical principles rather than empirical assessments that are valid only for specific transformer technologies. In comparison with CFD simulation approach, the network model runs much faster and the accuracies still fall in acceptable range; therefore, one is able to utilize this method in optimization procedures included in transformer design systems.

Understanding the Impact of Flow Bypass on the Thermal Performance of Air Cooled Heat Sinks

2014 ◽  
Author(s):  
Krishna Kota ◽  
Mohamed M. Awad
Keyword(s):  
Energy Conservation ◽  
Thermal Resistance ◽  
Thermal Performance ◽  
Heat Sink ◽  
Heat Sinks ◽  
Laminar Regime ◽  
Flow Energy ◽  
Factor Α ◽  
The Impact ◽  
Fundamental Mass

In this effort, theoretical modeling was employed to understand the impact of flow bypass on the thermal performance of air cooled heat sinks. Fundamental mass and flow energy conservation equations across a longitudinal fin heat sink configuration and the bypass region were applied and a generic parameter, referred as the Flow Bypass Factor (α), was identified from the theoretical solution that mathematically captures the effect of flow bypass as a quantifiable parameter on the junction-to-ambient thermal resistance of the heat sink. From the results obtained, it was found that, at least in the laminar regime, the impact of flow bypass on performance can be neglected for cases when the bypass gap is typically less than 5% of the fin height, and is almost linear at high relative bypass gaps (i.e., usually for bypass gaps that are more than 10–15% of the fin height). It was also found that the heat sink thermal resistance is more sensitive to small bypass gaps and the effect of flow bypass decreases with increasing bypass gap.

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