Highly conductive boron doped micro/nanocrystalline silicon thin films deposited by VHF-PECVD for solar cell applications

2015 ◽  
Vol 643 ◽  
pp. 94-99 ◽  
Author(s):  
Sucheta Juneja ◽  
S. Sudhakar ◽  
Jhuma Gope ◽  
Kalpana Lodhi ◽  
Mansi Sharma ◽  
...  
2004 ◽  
Vol 58 (30) ◽  
pp. 3963-3966 ◽  
Author(s):  
Z.X. Zhao ◽  
R.Q. Cui ◽  
F.Y. Meng ◽  
B.C. Zhao ◽  
H.C. Yu ◽  
...  

2012 ◽  
Vol 503 ◽  
pp. 386-390
Author(s):  
Xiu Qin Wang ◽  
Jian Ning Ding ◽  
Ning Yi Yuan ◽  
Shu Bo Wang

Boron-doped nanocrystalline silicon thin films(p-nc-Si:H) were deposited on glass substrates by plasma enhanced chemical vapour deposition (PECVD) using SiH4/ H2/ B2H6. The effects of substrate temperature, rf power and diborane flow on the microstructure, the electrical properties of nanocrystalline silicon thin films have been investigated. The results show that, increasing substrate temperature, rf power and B2H6flow can improve the conductivity of P-Si thin film. However, exceeding one value, they are not advantageous to improve the conductivity due to the decrystallization of films. Hence, appropriate process conditions are crucial for the preparation of high quality p layer. crystalline volume fraction (Xc) 26.2 %, mean grain size (d) 3.5nm and conductivity 0.374S/cm, p-nc-Si:H thin film was deposited.


2011 ◽  
Vol 257 (21) ◽  
pp. 8901-8905 ◽  
Author(s):  
E. Fathi ◽  
Y. Vygranenko ◽  
M. Vieira ◽  
A. Sazonov

2010 ◽  
Vol 29-32 ◽  
pp. 1883-1887
Author(s):  
Hai Bin Pan ◽  
Yuan Tian ◽  
Guang Gui Cheng ◽  
Li Qiang Guo

Boron-doped hydrogenated nanocrystalline silicon (nc-Si:H) thin films were deposited by plasma enhanced chemical vapor deposition (PECVD). Microstructures of these films were characterized and analyzed by Raman spectrum and atomic force microscopy (AFM). Thickness and resistivity of these films was measured by high-resolution profilometer and four-point probe respectively. The impact of annealing on boron-doped nc-Si:H thin films’ resistivity and the relationship between resistivity and microstructure were investigated. The results show that annealing and the annealing temperature have great impact on resistivity of nc-Si:H thin films as a result of microstructures changing after annealing. Resistivity of nc-Si:H thin films decreases after annealing, but it rises with the increasing annealing temperature in the range of 250°C to 400°C.


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