Formation and growth behavior of intermetallic compound phases in the interfacial reaction of solid Fe / liquid Zn at 450 °C

The reaction between Sn-Ag (-Co) solder and electroless Ni-P plating was investigated in order to clarify the effect of the addition of Co to Sn-Ag solder on the formation of intermetallic compound (IMC) at the interface and the joint strength at the interface. Sn-Ag-Co solder was specially prepared. The results show that there is little effect of the addition of Co to the Sn-Ag solder on the IMC formation and the thickness of the IMC at the interface. For the pull strength of the solder bump joint, the addition of Co to the solder didn’t strongly affect the pull strength of the solder joints, but it affected the fracture mode of the solder joints.

Download Full-text

Effect of Degassing Treatment on the Interfacial Reaction of Molten Aluminum and Solid Steel

Archives of Foundry Engineering ◽

10.1515/afe-2017-0080 ◽

2017 ◽

Vol 17 (2) ◽

pp. 227-239 ◽

Cited By ~ 2

Author(s):

T. Triyono ◽

N. Muhayat ◽

A. Supriyanto ◽

L. Lutiyatmi

Keyword(s):

Electron Microscope ◽

Intermetallic Compound ◽

Scanning Electron Microscope ◽

Interfacial Reaction ◽

Immersion Time ◽

Molten Aluminum ◽

Furnace Lining ◽

Brittle Phase ◽

Crucible Furnace ◽

Scanning Electron

AbstractThe gas porosity is one of the most serious problems in the casting of aluminum. There are several degassing methods that have been studied. During smelting of aluminum, the intermetallic compound (IMC) may be formed at the interface between molten aluminum and solid steel of crucible furnace lining. In this study, the effect of degassing treatment on the formations of IMC has been investigated. The rectangular substrate specimens were immersed in a molten aluminum bath. The holding times of the substrate immersions were in the range from 300 s to 1500 s. Two degassing treatments, argon degassing and hexachloroethane tablet degassing, were conducted to investigate their effect on the IMC formation. The IMC was examined under scanning electron microscope with EDX attachment. The thickness of the IMC layer increased with increasing immersion time for all treatments. Due to the high content of hydrogen, substrate specimens immersed in molten aluminum without degasser had IMC layer which was thicker than others. Argon degassing treatment was more effective than tablet degassing to reduce the IMC growth. Furthermore, the hard and brittle phase of IMC, FeAl3, was formed dominantly in specimens immersed for 900 s without degasser while in argon and tablet degasser specimens, it was formed partially.

Download Full-text

Secondary dendrite growth behavior of intermetallic compound phase during peritectic solidification

Journal of Alloys and Compounds ◽

10.1016/j.jallcom.2020.155002 ◽

2020 ◽

Vol 832 ◽

pp. 155002

Author(s):

Peng Peng

Keyword(s):

Intermetallic Compound ◽

Dendrite Growth ◽

Growth Behavior ◽

Peritectic Solidification

Download Full-text

Effect of Mixed Rare Earths on the Wetting Behavior and Interfacial Reaction between Sn-0.70Cu-0.05Ni Solder and Amorphous Fe84.3Si0.3B5.4 Alloy

MATEC Web of Conferences ◽

10.1051/matecconf/201820603005 ◽

2018 ◽

Vol 206 ◽

pp. 03005

Author(s):

Bin Hou ◽

Fengmei Liu ◽

Hongqin Wang ◽

Yupeng Zhang ◽

Jianglong Yi ◽

...

Keyword(s):

Intermetallic Compound ◽

Melting Temperature ◽

Solder Alloy ◽

Interfacial Reaction ◽

Rare Earths ◽

Wetting Behavior ◽

Amorphous Substrate ◽

Continuous State ◽

Amorphous Substrates ◽

Limited Change

In order to explore the effect of addition of mixed rare earths (MRE) on the wetting behavior and interfacial reaction between Sn-0.70Cu-0.05Ni solder and amorphous Fe84.3Si10.3B5.4 alloy, 0.25 wt.% percentage of the MRE, which are mainly elements La and Ce, were added into the solder. Results show it can refine the microstructure of the solder alloy, and there is limited change of melting temperature with the addition of MRE in the solder. The wettability of the solder on amorphous substrate is improved by adding 0.25 wt.% percentage of the MRE into Sn-0.70Cu-0.05Ni solder. Moreover, research results indicate that, with the increase of wetting temperature, the final equilibrium wetting angles of Sn-0.70Cu-0.05Ni and Sn-0.70Cu-0.05Ni-0.25MRE on amorphous substrate decrease gradually, indicating the better wettability at the higher wetting temperature. In addition, with the increase of temperature, the distribution of intermetallic compound (IMC) FeSn2 formed at the interface between the two solders and amorphous substrate is changed from discontinuous state to continuous state. The thickness of the interfacial IMC layer between solder and amorphous substrates reduced with the addition of MRE, indicating that the presence of 0.25 wt.% percentage of the MRE is effective in suppressing the growth of IMC layer.

Download Full-text