Investigation of the interfacial reactions and growth behavior of interfacial intermetallic compound between Sn37Pb solder and Au/Ni/Kovar substrate

2019 ◽  
Vol 6 (7) ◽  
pp. 076306 ◽  
Author(s):  
Nifa Bao ◽  
Xiaowu Hu ◽  
Qinglin Li
Keyword(s):  
Intermetallic Compound ◽  
Growth Behavior ◽  
Interfacial Reactions ◽  
Interfacial Intermetallic Compound ◽  
Sn37pb Solder

Effect of supersaturation of Cu on reaction and intermetallic compound formation between Sn–Cu solder and thin film metallization

2003 ◽  
Vol 18 (9) ◽  
pp. 2109-2114 ◽  
Author(s):  
J. S. Ha ◽  
T. S. Oh ◽  
K. N. Tu
Keyword(s):  
Thin Film ◽  
Intermetallic Compound ◽  
Solubility Limit ◽  
Molten Solder ◽  
Interfacial Reactions ◽  
Interfacial Stability ◽  
Compound Formation ◽  
Cu Content ◽  
Intermetallic Compound Formation ◽  
Interfacial Intermetallic Compound

Interfacial reactions and intermetallic compound formation of the eutectic Sn–0.7Cu and hypereutectic Sn–3Cu on thin film metallization of Al/Ni/Cu, Al/Cu, and Al/Ni were investigated. While the Ni layer of Al/Ni/Cu was almost consumed by Sn–0.7Cu after one reflow at 240 °C, most of it was preserved with Sn–3Cu even after ten reflows. Since the Cu content in Sn–0.7Cu is below the solubility limit of Cu in Sn at 240 °C, the Cu layer of Al/Ni/Cu was dissolved completely into Sn–0.7Cu, and the Ni was exposed to the molten solder to form intermetallics. As Cu content in Sn–3Cu is more than the solubility limit, intermetallics formed between the solder and the Cu layer, but not the Ni layer, of Al/Ni/Cu. The supersaturation of Cu in Sn–3Cu was found to be beneficial in reducing the interfacial intermetallic compound formation and in improving the interfacial stability.

Microstructure and Growth Behavior of the Intermetallic Compound for Sn-1.0Ag-0.5Cu-NiB/Cu Solder Joint Interface

2013 ◽  
Vol 652-654 ◽  
pp. 1106-1110 ◽  
Author(s):  
Jun Feng Qu ◽  
Jun Xu ◽  
Qiang Hu ◽  
Fu Wen Zhang
Keyword(s):  
Grain Size ◽  
Intermetallic Compound ◽  
Solder Joint ◽  
Aging Time ◽  
Growth Behavior ◽  
Interfacial Reactions ◽  
Experimental Results ◽  
Joint Interface ◽  
Alloy Systems

This research investigates the microstructure and growth behavior of the intermetallic compound(IMC) of Sn-1.0Ag-0.5Cu,Sn-1.0Ag-0.5Cu-0.05Ni and Sn-1.0Ag-0.5Cu-0.05N-0.02B/Cu solder joint interface. The interfacial reactions between Cu and the solders at 250±1°C were examined. Experimental results indicated that the IMCs of the above alloy systems on the soldering interface were Cu6Sn5and (Cux, Ni1-x)6Sn5, respectively. The grain size of primary Sn decreased observably with the micro addition of B and a large number of fine reinforcement particles were found in the solder. With the aging time increasing, the (Cux, Ni1-x)6Sn5micrograph of the Sn-1.0Ag-0.5Cu-0.05N-0.02B solder joint interface was changed from sawtooth-like to shape-layer, but the thickness of IMCs increased unobservably.

Effect of Ni concentration on solderability, microstructure and hardness of SAC0705-xNi solder joints on Cu and graphene-coated Cu substrates

2019 ◽  
Vol 33 (01) ◽  
pp. 1850425 ◽  
Author(s):  
Hongming Cai ◽  
Yang Liu ◽  
Shengli Li ◽  
Hao Zhang ◽  
Fenglian Sun ◽  
...  
Keyword(s):  
Intermetallic Compound ◽  
Diffusion Barrier ◽  
Graphene Layer ◽  
Solder Joints ◽  
Cu Substrate ◽  
Ni Content ◽  
Increasing Trend ◽  
Cu Substrates ◽  
Interfacial Intermetallic Compound ◽  
Positive Effect

In this paper, solderability, microstructure and hardness of SAC0705-xNi solder joints on Cu and graphene-coated Cu (G-Cu) substrates were studied. As Ni content increases in the solder, the solderability improves gradually on both the Cu and G-Cu substrates. The solderability of SAC0705-xNi is better on G-Cu substrate than that on Cu substrate. The increasing Ni content in the solder has a positive effect on the microstructure refinement of both the kinds of substrates. Such effect is more significant on G-Cu substrate than that on Cu substrate. With the increase of Ni content, the thickness of the interfacial intermetallic compound (IMC) shows an increasing trend first and then decreasing trend on the two kinds of substrates. Since the graphene layer works as a diffusion barrier, the IMC on G-Cu is thinner than that on Cu substrate. The addition of Ni leads to the strengthening of the microstructure and thus increases the hardness of the solder bulks.

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