Secondary dendrite growth behavior of intermetallic compound phase during peritectic solidification

Journal of Alloys and Compounds ◽

10.1016/j.jallcom.2020.155002 ◽

2020 ◽

Vol 832 ◽

pp. 155002

Author(s):

Peng Peng

Keyword(s):

Intermetallic Compound ◽

Dendrite Growth ◽

Growth Behavior ◽

Peritectic Solidification

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Investigation of the interfacial reactions and growth behavior of interfacial intermetallic compound between Sn37Pb solder and Au/Ni/Kovar substrate

Materials Research Express ◽

10.1088/2053-1591/ab155f ◽

2019 ◽

Vol 6 (7) ◽

pp. 076306 ◽

Author(s):

Nifa Bao ◽

Xiaowu Hu ◽

Qinglin Li

Keyword(s):

Intermetallic Compound ◽

Growth Behavior ◽

Interfacial Reactions ◽

Interfacial Intermetallic Compound ◽

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Formation and growth behavior of intermetallic compound phases in the interfacial reaction of solid Fe / liquid Zn at 450 °C

Journal of Alloys and Compounds ◽

10.1016/j.jallcom.2021.161562 ◽

2021 ◽

pp. 161562

Author(s):

Kwangsik Han ◽

Inho Lee ◽

Ikuo Ohnuma ◽

Ryosuke Kainuma

Keyword(s):

Intermetallic Compound ◽

Interfacial Reaction ◽

Growth Behavior

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Primary dendrite growth of Co3Sn2 intermetallic compound in rapidly solidified ternary Co35Cu35Sn30 alloy

Applied Physics A ◽

10.1007/s00339-018-1884-y ◽

2018 ◽

Vol 124 (7) ◽

Author(s):

J. M. Liu ◽

W. Zhai ◽

F. P. Dai ◽

P. X. Yan ◽

B. Wei

Keyword(s):

Intermetallic Compound ◽

Primary Dendrite ◽

Dendrite Growth ◽

Rapidly Solidified

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Interface reaction and intermetallic compound growth behavior of Sn-Ag-Cu lead-free solder joints on different substrates in electronic packaging

Journal of Materials Science ◽

10.1007/s10853-018-2907-y ◽

2018 ◽

Vol 54 (2) ◽

pp. 1741-1768 ◽

Author(s):

Ming-yue Xiong ◽

Liang Zhang

Keyword(s):

Intermetallic Compound ◽

Electronic Packaging ◽

Solder Joints ◽

Interface Reaction ◽

Growth Behavior ◽

Lead Free ◽

Lead Free Solder ◽

Intermetallic Compound Growth ◽

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The study of the growth behavior of Cu6Sn5 intermetallic compound in Cu/Sn/Cu interconnection system during the ultrasonic-assisted transient liquid phase soldering

2017 18th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2017.8046396 ◽

2017 ◽

Author(s):

Jihou Liu ◽

Hongyun Zhao ◽

ZhouLin Li ◽

Xiaoguo Song

Keyword(s):

Liquid Phase ◽

Intermetallic Compound ◽

Transient Liquid Phase ◽

Growth Behavior ◽

Ultrasonic Assisted

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Effects of post-reflow cooling rate and thermal aging on growth behavior of interfacial intermetallic compound between SAC305 solder and Cu substrate

Applied Physics A ◽

10.1007/s00339-016-9893-1 ◽

2016 ◽

Vol 122 (4) ◽

Author(s):

Xiaowu Hu ◽

Tao Xu ◽

Xiongxin Jiang ◽

Yulong Li ◽

Yi Liu ◽

...

Keyword(s):

Intermetallic Compound ◽

Cooling Rate ◽

Thermal Aging ◽

Growth Behavior ◽

Sac305 Solder ◽

Cu Substrate ◽

Interfacial Intermetallic Compound

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Dendrite growth and Vickers microhardness of Co7Mo6 intermetallic compound under large undercooling condition

Acta Physica Sinica ◽

10.7498/aps.67.20172156 ◽

2018 ◽

Vol 67 (4) ◽

pp. 046402

Author(s):

Sha Sha ◽

Wang Wei-Li ◽

Wu Yu-Hao ◽

Wei Bing-Bo

Keyword(s):

Intermetallic Compound ◽

Vickers Microhardness ◽

Dendrite Growth ◽

Large Undercooling

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THE INTERFACIAL REACTION AND INTERMETALLIC COMPOUND GROWTH BEHAVIOR OF BGA STRUCTURE Sn-3.0Ag-0.5Cu/Cu SOLDER JOINT AT LOW REFLOW TEMPERATURES

ACTA METALLURGICA SINICA ◽

10.3724/sp.j.1037.2012.00636 ◽

2013 ◽

Vol 49 (3) ◽

pp. 341 ◽

Author(s):

Minbo ZHOU ◽

Xiao MA ◽

Xinping ZHANG

Keyword(s):

Intermetallic Compound ◽

Solder Joint ◽

Interfacial Reaction ◽

Growth Behavior ◽

Intermetallic Compound Growth

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Intermetallic compound formation and growth behavior at the interface between indium and Au/Ni(V) metallization

Materials Characterization ◽

10.1016/j.matchar.2021.111673 ◽

2021 ◽

pp. 111673

Author(s):

Li-Chi Huang ◽

Yan-Ping Zhang ◽

Chih-Ming Chen ◽

Liang-Yih Hung ◽

Yu-Po Wang

Keyword(s):

Intermetallic Compound ◽

Growth Behavior ◽

Compound Formation ◽

Intermetallic Compound Formation

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Research on Interfacial Reaction and Growth Behavior of Intermetallic Compound of Dip-Soldered Sn/Ni System

Transactions of the Indian Institute of Metals ◽

10.1007/s12666-018-1515-5 ◽

2018 ◽

Vol 72 (3) ◽

pp. 651-661

Author(s):

Yu Qiu ◽

Yijie Luo ◽

Xiaowu Hu ◽

Yulong Li ◽

Xiongxin Jiang

Keyword(s):

Intermetallic Compound ◽

Interfacial Reaction ◽

Growth Behavior

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