Low-loss NiZnCo ferrite composites with tunable magneto-dielectric performances for high-frequency applications

The microwave properties of some of the low cost materials which can be used in high frequency applications with low transmission losses are investigated in this paper. One of the most accurate microwave characterization techniques, Split Post Dielectric Resonator technique (SPDR) is used for the experimental investigation. The dielectric constants of the 3 materials scrutinized at room temperature and at 10K are 3.65, 2.42, 3.61 and 3.58, 2.48, 3.59 respectively. The corresponding loss tangent values are 0.00370, 0.0015, 0.0042 and 0.0025, 0.0009, 0.0025. The high frequency transmission losses are comparable with many of the conventional materials used in low temperature electronics and hence these materials could be implemented in such applications.

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Advanced Low Df Dry film Build-up Material on Glass panel for 5G application

International Symposium on Microelectronics ◽

10.4071/2380-4505-2020.1.000201 ◽

2020 ◽

Vol 2020 (1) ◽

pp. 000201-000205

Author(s):

Takenori Kakutani ◽

Zhong Guan ◽

Yuya Suzuki ◽

Muhammad Ali ◽

Serhat Erdogan ◽

...

Keyword(s):

High Frequency ◽

Transmission Loss ◽

Core Material ◽

Wave Band ◽

Organic Substrates ◽

Frequency Filter ◽

Transmission Characteristics ◽

Glass Panel ◽

Low Loss ◽

Dry Film

Abstract This paper describes the demonstration of a low loss substrate (laminated glass) for high-frequency transmission using a dry film build-up material with low loss tangent (Df). This paper also evaluates filter characteristics and dielectric characteristics of the substrate in the mm-Wave band. The advanced low loss dry film build-up material was newly developed, and applicable to high frequency transmission. This material has a Df of 0.0025 at 10 GHz and also exhibits excellent adhesion and electrical reliability required for advanced dielectric materials. In addition, glass was used as a core material in this paper because of its excellent signal transmission characteristics compared to silicon wafers or organic substrates. To demonstrate the benefit of low loss materials for high frequency transmission, passive components for high frequency filter substrates were fabricated using - 6-inch square thin (0.2mm) glass panel with various build-up materials (Material A with a Df of 0.0025, and Material B with a Df 0.0042 at 10 GHz) laminated. Copper wiring patterns on the dielectric layers were fabricated by a semi-additive process (SAP). Circuit patterns with low pass filters and band pass filters were also fabricated. First, transmission characteristics and characteristic impedances were measured to check the electrical performance. The measured lowest transmission loss of < 1.43 dB at 39 GHz were achieved when Material A was applied as the build-up material. Second, biased-highly accelerated stress test (bHAST) was conducted to evaluate the reliability performance of the substrates with two build-up materials, Material A and a conventional material. The test condition was based on the JEDEC level 2 standard. The substrate with Material A retained good insulation properties over 300 hours of bHAST treatment, demonstrating its excellent insulating performance. In summary, Material A has been shown in this paper to exhibit reduced transmission loss in high-frequency filter substrates at millimeter wave frequencies.

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Photosensitive Polyimide having low loss tangent for RF application

International Symposium on Microelectronics ◽

10.4071/2380-4505-2018.1.000476 ◽

2018 ◽

Vol 2018 (1) ◽

pp. 000476-000482 ◽

Cited By ~ 2

Author(s):

Masao Tomikawa ◽

Hitoshi Araki ◽

Yohei Kiuchi ◽

Akira Shimada

Keyword(s):

Molecular Structure ◽

Dielectric Constant ◽

Dielectric Properties ◽

Dielectric Loss ◽

High Frequency ◽

Low Dielectric Constant ◽

Low Loss ◽

Elongation At Break ◽

Low Dielectric ◽

The Poor

Abstract Progress of 5G telecommunication and mm radar for autopilot, high frequency operation is required. Insulator materials having low loss at high frequency is desired for the applications. We designed the low dielectric constant, and low dielectric loss materials examined molecular structure of the polyimide and found that permittivity 2.6 at 20GHz, dielectric loss 0.002. Furthermore, in consideration of mechanical properties such as the toughness and adhesion to copper from a point of practical use. Dielectric properties largely turned worse when giving photosensitivity. To overcome the poor dielectric properties, we designed the photosensitive system. After all, we successfully obtained 3.5 of dielectric constant and 0.004 of dielectric loss, and 100% of elongation at break. In addition, we offered a B stage sheet as well as varnish. These materials are applicable to re-distribution layer of FO-WLP, Interposer and other RF applications for microelectronics.

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Low-loss Cd-substituted Mg ferrites with matching impedance for high-frequency-range antennas

Journal of Magnesium and Alloys ◽

10.1016/j.jma.2020.09.007 ◽

2020 ◽

Author(s):

Gongwen Gan ◽

Dainan Zhang ◽

Jie Li ◽

Gang Wang ◽

Xin Huang ◽

...

Keyword(s):

High Frequency ◽

High Frequency Range ◽

Frequency Range ◽

Low Loss

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