Ultrasonic assisted photocatalytic process for degradation of ciprofloxacin using TiO2-Pd nanocomposite immobilized on pumice stone

Author(s):  
Parisa Yekan Motlagh ◽  
Sema Akay ◽  
Berkant Kayan ◽  
Alireza Khataee
2013 ◽  
Vol 12 (11) ◽  
pp. 2137-2147 ◽  
Author(s):  
Mohammad Noori Sepehr ◽  
Mohammad Reza Samarghandi ◽  
Mansur Zarrabi ◽  
Abdeltif Amrane ◽  
Mohammad Mahdi Soori

2014 ◽  
Vol 11 (5) ◽  
pp. 361-367 ◽  
Author(s):  
Mahgol Tajbakhsh ◽  
Yousef Ranjbar ◽  
Abdolhosein Masuodi ◽  
Parizad Rezaee ◽  
Mahmood Tajbakhsh ◽  
...  

2021 ◽  
Vol 11 (1) ◽  
Author(s):  
Azam Marjani ◽  
Reza Khan Mohammadi

AbstractHg(II) has been identified to be one of the extremely toxic heavy metals because of its hazardous effects and this fact that it is even more hazardous to animals than other pollutants such as Ag, Au, Cd, Ni, Pb, Co, Cu, and Zn. Accordingly, for the first time, tetrasulfide-functionalized fibrous silica KCC-1 (TS-KCC-1) spheres were synthesized by a facile, conventional ultrasonic-assisted, sol–gel-hydrothermal preparation approach to adsorb Hg(II) from aqueous solution. Tetrasulfide groups (–S–S–S–S–) were chosen as binding sites due to the strong and effective interaction of mercury ions (Hg(II)) with sulfur atoms. Hg(II) uptake onto TS-KCC-1 in a batch system has been carried out. Isotherm and kinetic results showed a very agreed agreement with Langmuir and pseudo-first-order models, respectively, with a Langmuir maximum uptake capacity of 132.55 mg g–1 (volume of the solution = 20.0 mL; adsorbent dose = 5.0 mg; pH = 5.0; temperature: 198 K; contact time = 40 min; shaking speed = 180 rpm). TS-KCC-1was shown to be a promising functional nanoporous material for the uptake of Hg(II) cations from aqueous media. To the best of our knowledge, there has been no report on the uptake of toxic Hg(II) cations by tetrasulfide-functionalized KCC-1 prepared by a conventional ultrasonic-assisted sol–gel-hydrothermal synthesis method.


2021 ◽  
Vol 6 ◽  
pp. 100098
Author(s):  
Ming Zhang ◽  
Dandan Jin ◽  
Liu Zhang ◽  
Xumei Cui ◽  
Zhi Zhang ◽  
...  

2021 ◽  
Vol 11 (1) ◽  
Author(s):  
Jianguo Cui ◽  
Keke Zhang ◽  
Di Zhao ◽  
Yibo Pan

AbstractThrough ultrasonic wave assisted Sn2.5Ag0.7Cu0.1RExNi/Cu (x = 0, 0.05, 0.1) soldering test and − 40 to 125 °C thermal shock test, the microstructure and shear properties of Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal cycling were studied by the SEM, EDS and XRD. The results show that the Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints with high quality and high reliability can be obtained by ultrasonic assistance. When the ultrasonic vibration power is 88 W, the ultrasonic-assisted Sn2.5Ag0.7Cu0.1RE0.05Ni/Cu solder joints exhibits the optimized performance. During the thermal cycling process, the shear strength of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints had a linear relationship with the thickness of interfacial intermetallic compound (IMC). Under the thermal cycling, the interfacial IMC layer of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints consisted of (Cu,Ni)6Sn5 and Cu3Sn. The thickness of interfacial IMC of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints was linearly related to the square root of equivalent time. The growth of interfacial IMC of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints had an incubation period, and the growth of IMC was slow within 300 cycles. And after 300 cycles, the IMC grew rapidly, the granular IMC began to merge, and the thickness and roughness of IMC increased obviously, which led to a sharp decrease in the shear strength of the solder joints. The 0.05 wt% Ni could inhibit the excessive growth of IMC, improve the shear strength of solder joints and improve the reliability of solder joints. The fracture mechanism of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints changed from the ductile–brittle mixed fracture in the solder/IMC transition zone to the brittle fracture in the interfacial IMC.


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