Interfacial characteristic of multi-pass caliber-rolled Mg/Al compound castings

This study presents a new gas-liquid model to predict Electrical Submersible Pumps (ESP) head performance. The newly derived approach based on gas-liquid momentum equations along pump channels has improved the Sachdeva model [1, 2] in the petroleum industry and generalized the Minemura model [3] in the nuclear industry. The new two-phase model includes novel approaches for wall frictional losses for each phase using a gas-liquid stratified assumption and existing correlations, a new shock loss model incorporating rotational speeds, a new correlation for drag coefficient and interfacial characteristic length effects by fitting the model results with experimental data, and an algorithm to solve the model equations. The model can predict pressure and void fraction distributions along impellers and diffusers in addition to the pump head performance curve under different fluid properties, pump intake conditions, and rotational speeds.

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Wetting process and interfacial characteristic of Sn–3.0Ag–0.5Cu on different substrates at temperatures ranging from 503K to 673K

Applied Surface Science ◽

10.1016/j.apsusc.2010.12.131 ◽

2011 ◽

Vol 257 (11) ◽

pp. 4877-4884 ◽

Cited By ~ 27

Author(s):

Likun Zang ◽

Zhangfu Yuan ◽

Hongyan Xu ◽

Bingsheng Xu

Keyword(s):

Interfacial Characteristic ◽

Wetting Process

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Interfacial characteristic and microstructure of Fe-based amorphous coating on magnesium alloy

Surface and Coatings Technology ◽

10.1016/j.surfcoat.2021.127659 ◽

2021 ◽

Vol 425 ◽

pp. 127659

Author(s):

Haoran Zhang ◽

Shanlin Wang ◽

Xianglin Yang ◽

Shilei Hao ◽

Yuhua Chen ◽

...

Keyword(s):

Magnesium Alloy ◽

Amorphous Coating ◽

Interfacial Characteristic

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Wettability and Interfacial Characteristic of Sn-Ag-Cu Solder on Ni Substrates at Elevated Temperatures

Advanced Materials Research ◽

10.4028/www.scientific.net/amr.554-556.703 ◽

2012 ◽

Vol 554-556 ◽

pp. 703-708

Author(s):

Li Kun Zang ◽

Zhang Fu Yuan Yuan ◽

Hong Liang Yan ◽

Xin Xue Li

Keyword(s):

Integrated Circuits ◽

Elevated Temperatures ◽

Sessile Drop ◽

Triple Line ◽

Contact Angles ◽

Sessile Drop Method ◽

Reactive Wetting ◽

Ni Substrate ◽

Eds Analysis ◽

Interfacial Characteristic

Wettability and interfacial characteristic of the Sn-3.0Ag-0.5Cu/Ni system are investigated by sessile drop method at the temperature range of 503~673K. The reactive wetting processes demonstrate that: contact angles between the solder and Ni substrate decrease as exponential decay and the equilibrium contact angles decrease monotonously with the temperature increasing. Triple-line mobility is enhanced as the temperature increases. Interface of the Sn-3.0Ag-0.5Cu /Ni interface are identified by EPMA and EDS analysis as (Cu,Ni)6Sn5 adjacent to the solder and Ni3Sn4 adjacent to the Ni substrate, respectively. Cu is condensed at the interface, the composition of (Cu,Ni)6Sn5 is (23.16~23.46)Ni- (36.56~37.52) Cu-(39.02~40.27)Sn (atom %). The formation of the (Cu,Ni)6Sn5 IMC was known to greatly improve the reliability of the solder joints in integrated circuits.

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