scholarly journals An automated and unbiased grain segmentation method based on directional reflectance microscopy

2021 ◽  
Vol 174 ◽  
pp. 110978
Author(s):  
Mallory Wittwer ◽  
Bernard Gaskey ◽  
Matteo Seita
Keyword(s):  
Segmentation Method ◽  
Reflectance Microscopy ◽  
Directional Reflectance

scholarly journals Measuring crystal orientation from etched surfaces via directional reflectance microscopy

2020 ◽  
Vol 55 (25) ◽  
pp. 11669-11678
Author(s):  
Xiaogang Wang ◽  
Shubo Gao ◽  
Ekta Jain ◽  
Bernard Gaskey ◽  
Matteo Seita
Keyword(s):  
Crystal Orientation ◽  
Reflectance Microscopy ◽  
Directional Reflectance

Segmentation In Medical Resonance images to extract the cancerous nodule for early diagnosis on cancer

2012 ◽  
Vol 3 (2) ◽  
pp. 253-255
Author(s):  
Raman Brar
Keyword(s):  
Human Lung ◽  
Research Work ◽  
Vital Role ◽  
Watershed Algorithm ◽  
Segmentation Method ◽  
Resonance Imaging ◽  
Segmentation Methods ◽  
Segmentation Accuracy ◽  
Background Segmentation ◽  
Lung Mri

Image segmentation plays a vital role in several medical imaging programs by assisting the delineation of physiological structures along with other parts. The objective of this research work is to segmentize human lung MRI (Medical resonance Imaging) images for early detection of cancer.Watershed Transform Technique is implemented as the Segmentation method in this work. Some comparative experiments using both directly applied watershed algorithm and after marking foreground and computed background segmentation methods show the improved lung segmentation accuracy in some image cases.

Infra-Red Reflectance Microscopy (IRRM) for Daisy Chain Flip Chip Device Failure Analysis

2004 ◽  
Author(s):  
Carlo Grilletto ◽  
Steve Hsiung ◽  
Andrew Komrowski ◽  
John Soopikian ◽  
Daniel J.D. Sullivan ◽  
...  
Keyword(s):  
Failure Analysis ◽  
Flip Chip ◽  
State Of The Art ◽  
Failure Mechanisms ◽  
Simple Metal ◽  
X Ray ◽  
Infra Red ◽  
Cause Of Failure ◽  
Reflectance Microscopy ◽  
Ir Emission

Abstract This paper describes a method to "non-destructively" inspect the bump side of an assembled flip-chip test die. The method is used in conjunction with a simple metal-connecting "modified daisy chain" die and makes use of the fact that polished silicon is transparent to infra-red (IR) light. The paper describes the technique, scope of detection and examples of failure mechanisms successfully identified. It includes an example of a shorting anomaly that was not detectable with the state of the art X-ray equipment, but was detected by an IR emission microscope. The anomalies, in many cases, have shown to be the cause of failure. Once this has been accomplished, then a reasonable deprocessing plan can be instituted to proceed with the failure analysis.

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