Nano Ag sintering on Cu substrate assisted by self-assembled monolayers for high-temperature electronics packaging
Canyu Liu
◽
Allan Liu
◽
Yutai Su
◽
Zhaoxia Zhou
◽
Changqing Liu
2008 ◽
Vol 313-314
◽
pp. 324-327
◽
Seungwook Kwon
◽
Jungsuk Choi
◽
Haiwon Lee
◽
Jaegeun Noh
1998 ◽
Vol 95
(6)
◽
pp. 1339-1342
◽
R. Michalitsch
◽
A. El Kassmi
◽
P. Lang
◽
A. Yassar
◽
F. Garnier
2003 ◽
Vol 104
◽
pp. 459-462
◽
R. Klauser
◽
M. Zharnikov
◽
I.-H. Hong
◽
S.-C. Wang
◽
A. Gölzhäuser
◽
...
Martin Gruebele
◽
Max Platkov
2009 ◽
Vol 25
(1)
◽
pp. 83-86
◽
Guo-Qiang TAN
◽
Hai-Yang BO
◽
Hong-Yan MIAO
◽
Ao XIA
◽
Zhong-Liang HE
2013 ◽
Vol 30
(4)
◽
pp. 486
Jiandong YANG
◽
Duliu WANG
◽
Xiaoquan LU
C. D. Frisbie
◽
J. R. Martin
◽
R. R. Duff
◽
Wrighton Jr.
◽
M. S.
I. Bae
◽
H. Huang
◽
E. Yeager
◽
D. A. Scherson
J. P. Folkers
◽
P. E. Laibinis
◽
G. M. Whitesides