Numerical investigation on material removal mechanism in elliptical vibration cutting of single-crystal silicon

2021 ◽  
Vol 134 ◽  
pp. 106019
Author(s):  
Changlin Liu ◽  
Jianguo Zhang ◽  
Junjie Zhang ◽  
Jianning Chu ◽  
Xiao Chen ◽  
...  
Keyword(s):  
Single Crystal ◽  
Numerical Investigation ◽  
Material Removal ◽  
Single Crystal Silicon ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Crystal Silicon ◽  
Elliptical Vibration Cutting ◽  
Vibration Cutting ◽  
Elliptical Vibration

A simulation investigation on elliptical vibration cutting of single-crystal silicon

2020 ◽  
Vol 108 (7-8) ◽  
pp. 2231-2243 ◽  
Author(s):  
Changlin Liu ◽  
Jianguo Zhang ◽  
Junjie Zhang ◽  
Xiao Chen ◽  
Junfeng Xiao ◽  
...  
Keyword(s):  
Single Crystal ◽  
Single Crystal Silicon ◽  
Crystal Silicon ◽  
Elliptical Vibration Cutting ◽  
Vibration Cutting ◽  
Elliptical Vibration

Fundamental study on material removal mechanism in single-crystal germanium

2021 ◽  
pp. 103773
Author(s):  
Ruiwen Geng ◽  
Xiaojing Yang ◽  
Qiming Xie ◽  
Jianguo Xiao ◽  
Wanqing Zhang ◽  
...  
Keyword(s):  
Single Crystal ◽  
Material Removal ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Fundamental Study

Experimental Investigation on Brittle-Ductile Transition in Electroplated Diamond Wire Saw Machining Single Crystal Silicon

2010 ◽  
Vol 431-432 ◽  
pp. 265-268 ◽  
Author(s):  
Yu Fei Gao ◽  
Pei Qi Ge
Keyword(s):  
Single Crystal ◽  
Material Removal ◽  
Single Crystal Silicon ◽  
Crystal Silicon ◽  
Diamond Wire ◽  
Brittle Ductile Transition ◽  
Wire Saw ◽  
Diamond Wire Saw ◽  
R Value ◽  
Material Removal Mode

Based on reciprocating electroplated diamond wire saw (REDWS) slicing experiments, a study on REDWS machining brittle-ductile transition of single crystal silicon was introduced. The machined surfaces and chips were observed by using Scanning Electron Microscope (SEM), and some experimental evidences of the change of material removal mode had been obtained. The experimental results indicate there is a close relationship between material removal mode and the ratio r value of ingot feed speed and wire speed, through controlling and adjusting the r value, the material removal mode can be complete brittle, partial ductile and near-ductile removal.

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