Effect of tool rake angle on the material removal mechanism transition of single-crystal silicon: a molecular dynamics study

2021 ◽  
Author(s):  
Changlin Liu ◽  
Jianning Chu ◽  
Jianguo Zhang ◽  
Junjie Zhang ◽  
Xiao Chen ◽  
...  
Keyword(s):  
Molecular Dynamics ◽  
Single Crystal ◽  
Material Removal ◽  
Single Crystal Silicon ◽  
Rake Angle ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Crystal Silicon ◽  
Mechanism Transition

Research on Nano-Cutting Processes Based on Parallel Molecular Dynamics

2006 ◽  
Vol 532-533 ◽  
pp. 357-360
Author(s):  
Ying Chun Liang ◽  
De Gang Li ◽  
Qing Shun Bai ◽  
Yu Lan Tang
Keyword(s):  
Molecular Dynamics ◽  
Potential Energy ◽  
Single Crystal ◽  
Cutting Forces ◽  
Single Crystal Silicon ◽  
Rake Angle ◽  
Tool Geometry ◽  
Crystal Silicon ◽  
Parallel Molecular Dynamics ◽  
Cutting Processes

To investigate the effect of tool geometry on single-crystal silicon nano-cutting, parallel molecular dynamics (MD) simulations are carried out with different tool rake angles. In this study, a parallel arithmetic based on mechanism of spatial decomposition together with MD is applied to simulate nano-cutting processes of single-crystal silicon (100) plane by using a single-crystal diamond tool. The simulation results show that tool rake angle has great effects on cutting forces and subsurface stress, and the effect of tool rake angle variation on work-piece potential energy is not evident while cutting single-crystal Silicon (100) plane. Moreover, the analysis of cutting forces and potential energy show that there is not evident dislocation in the nano-cutting.

Fundamental study on material removal mechanism in single-crystal germanium

2021 ◽  
pp. 103773
Author(s):  
Ruiwen Geng ◽  
Xiaojing Yang ◽  
Qiming Xie ◽  
Jianguo Xiao ◽  
Wanqing Zhang ◽  
...  
Keyword(s):  
Single Crystal ◽  
Material Removal ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Fundamental Study
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