Effect of dispersion and alignment of graphite fibers on thermal expansion induced fracture of graphite fiber/copper composite

2020 ◽  
Vol 25 ◽  
pp. 101450
Author(s):  
June-Young Lee ◽  
Youhan Sohn ◽  
Hye Sung Kim ◽  
Jun Hyun Han
2011 ◽  
Vol 694 ◽  
pp. 713-717
Author(s):  
Z. F. Fan ◽  
X.H. Chen ◽  
L.S. Xu ◽  
Y. Q. Liu ◽  
W. B. Zhong ◽  
...  

A unique method for preparation of multi-walled carbon nanotube (MWCNT)- reinforced copper composite is reported. It involves solution phase systhesis MWCNT-implanted cuprous oxide composite spheres, formation of MWCNT/ copper composite spheres after reduction in H2 atmosphere and preparation of the MWCNT/copper bulk with vacuum hot pressing. Scanning Eelectron Microscope image (SEM) of the fracture surfaces indicate MWCNTs are homogeneously dispersed in the composite and bonded to the matrix. In addition, the thermal expansion of the composites at various MWCNTs (0wt%, 1wt%, 5wt%) were investigated. The coefficient of the thermal expansion (CTE) was decreased with increase of the MWCNT content, which are all much lower than that of pure copper.


RSC Advances ◽  
2017 ◽  
Vol 7 (58) ◽  
pp. 36735-36743 ◽  
Author(s):  
Liyong Wang ◽  
Zhanjun Liu ◽  
Quangui Guo ◽  
Xiaohui Guo ◽  
Jianjun Gu

Hollow graphite fibers and carbon coating were applied to improve lithium storage and cycling performance of silicon nanoparticles.


2012 ◽  
Vol 33 ◽  
pp. 372-375 ◽  
Author(s):  
Zechao Tao ◽  
Quangui Guo ◽  
Xiaoqing Gao ◽  
Lang Liu

1995 ◽  
Vol 390 ◽  
Author(s):  
Chris H. Stoessel ◽  
C. Pan ◽  
J. C. Withers ◽  
D. Wallace ◽  
R. O. Loutfy

ABSTRACTHigh thermal conductivity heat sinks for thermal management in electronic packaging is enabling to a variety of advanced electronic applications. Heat sinks in industrial semiconductor application have thermal conductivities generally less than 180 W/mK, and frequently have large expansion mismatch with chips such as silicon and gallium arsenide. A unique technology of producing graphite fiber reinforced copper (Cf/Cu) composite has been developed that produced thermal conductivities up to 454 W/mK utilizing a K=640 W/mK fiber reinforcement (with a potential for 800 W/mK when utilizing a K = 1100 W/mK P130 fiber) and thermal expansion that can be matched to chip materials. The process consists of utilizing a hollow cathode sputtering process to deposit a bonding layer followed by copper on spread graphite fibers, which are then consolidated into composites with architectures to achieve desired thermal conductivity and thermal expansion. The copper thickness determines graphite fiber loading up to 80 %. In heat sink applications, where the electrical conductivity of the graphite fiber reinforced copper composite is a problem, processing has been developed for applying electrically insulating diamond film, which has high thermal conductivity and acts as a heat spreader.


1993 ◽  
Vol 318 ◽  
Author(s):  
N. S. Wheeler ◽  
D. S. Lashmore

ABSTRACTThere is a growing demand for advanced composites which can maintain their structural strength in high-temperature environments, particularly for aerospace applications. The use of graphite fiber/nickel metal matrix composites would be desirable if the deterioration of mechanical properties resulting from interdiffusion of carbon and nickel at temperatures in excess of 600°C could be avoided. The present research concerns an electrodeposited cobalt alloy coating containing 5-10.5 at-% tungsten, which was designed to serve as a diffusion barrier between graphite fibers and a nickel matrix. The resulting graphite/Co-W/Ni composite was tested under various time/temperature conditions, and the coating was shown to inhibit diffusion for up to 24 hr at 800°C. Annealed and unannealed coated fibers were analyzed by x-ray diffraction and by transmission electron microscopy The as-deposited coating was found to contain both h.c.p. and f.c.c. cobalt, whereas only f.c.c. was observed after annealing at 1100°C for 1.5 hours. WC was found at the coating/fiber interface.


2012 ◽  
Vol 602-604 ◽  
pp. 3-7
Author(s):  
Hao Ming Zhang ◽  
Xin Bo He ◽  
Xuan Hui Qu

Milled form of mesophase pitch-based graphite fibers were coated with a chromium layer using chemical vapor deposition technique, and Cr-coated graphite fiber/Cu composite with 50 vol.% fibers was fabricated by hot-pressing. The composite was characterized with scanning/transmission electron microscopies and by measuring thermal properties, including thermal conductivity and coefficient of thermal expansion (CTE). The results showed that the milled fibers were preferentially oriented in a plane perpendicular to the pressing direction, leading to anisotropic thermal properties of the composite. The Cr coating reacted with graphite fiber and formed to a continuous and uniform Cr3C2layer. This carbide layer established a good metallurgical interfacial bonding in the composite, which can improve the thermal properties effectively. The in-plane thermal conductivity and CTE of the composite reached to 392 W/mK and 6.5 ppm/K respectively, making the composite suitable for being electronic packaging materials.


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