RF MEMS DPDT Switch Using Novel Simulated Seesaw Design

This paper investigates an RF MEMS (Radio Frequency Micro Electro-Mechanical System) switch from DC to 5.8 GHz switching, for use in mobile communications systems and devices. The RF MEMS switch uses a novel seesaw design to create a Double-Pole Double-Throw (DPDT) Switch which increases the capabilities of the seesaw design structure. A low Switching supply voltage with high RF isolation was achieved during its development. After looking at other available seesaw designs, it was discovered that an improvement could be attained by adding additional contacts. An improved concept over existing Single-Pole Single-Throw (SPST) seesaw switches was achieved by using a DPDT switch with a set of upper and lower contacts at each side of the seesaw. To conform to the Microscale, from 1 μm – 100 μm, a length of 41μm was chosen to provide an adequate size for fabrication. Copper Bulk General (Cu) was chosen for the pivot material due to its good electrical conductivity and sufficient flexibility for elastic recovery. A working simulation was achieved without compromising the ‘Air-Gap’ between the contacts, which retains high isolation when the switch is open-circuited. The electrostatic supply voltage has been significantly reduced to a value which is closer to that used in mobile devices.

One-Step Synthesis of Thin Graphite Layers Supported CNTs in Porous Copper by CVD

A novel method is described to synthesize carbon nanotubes (CNTs) –thin graphite layer hybrid materials by a one-step catalytic chemical vapor deposition of acetylene on porous copper bulk. In porous copper, graphite thin layer grows uniformly on the surface of the pores while CNTs sprout out to form a network. As observed by scanning and transmission electron microscopy, the obtained CNTs exhibit bamboo-like multiple-walled structures.

Evaluation of the Mechanical Properties of Copper Thin Film and Copper Bulk at the Nano-Scale by Nanoindenter

This study used the nanoindenter to perform indentation tests on copper bulk and nano copper film in order to discuss the mechanical properties of pure copper at the nano scale. This study tested 7 levels of load, ranging from 20 to 200 μN (load increment at 30 μN) for the indentation tests on copper bulk and nano copper film specimens. Results showed that the load was roughly proportional to the residual depth, in the case of flat nano copper film, while the relationship between the load and the residual depth was not significant in the case of unsmooth copper bulk. Moreover, the hardness of both the copper bulk and the nano copper film would increase along with increasing load, while the Er value change trends of both the copper bulk and the nano copper film specimens differed with increasing load.

Fabrication of MWCNT-Reinforced Copper Composite and Thermal Expansion Behavor

A unique method for preparation of multi-walled carbon nanotube (MWCNT)- reinforced copper composite is reported. It involves solution phase systhesis MWCNT-implanted cuprous oxide composite spheres, formation of MWCNT/ copper composite spheres after reduction in H2 atmosphere and preparation of the MWCNT/copper bulk with vacuum hot pressing. Scanning Eelectron Microscope image (SEM) of the fracture surfaces indicate MWCNTs are homogeneously dispersed in the composite and bonded to the matrix. In addition, the thermal expansion of the composites at various MWCNTs (0wt%, 1wt%, 5wt%) were investigated. The coefficient of the thermal expansion (CTE) was decreased with increase of the MWCNT content, which are all much lower than that of pure copper.