Stress evaluation of Through-Silicon Vias using micro-infrared photoelasticity and finite element analysis

2015 ◽  
Vol 74 ◽  
pp. 87-93 ◽  
Author(s):  
Fei Su ◽  
Tianbao Lan ◽  
Xiaoxu Pan
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Element Analysis ◽  
Through Silicon Vias ◽  
Stress Evaluation ◽  
Silicon Vias

scholarly journals Stress evaluation of maxillary central incisor restored with different post materials: A finite element analysis

2020 ◽  
Vol 4 (1) ◽  
pp. 022-027
Author(s):  
Agarwal Samarth Kumar ◽  
Mittal Reena ◽  
Singhal Romil ◽  
Hasan Sarah ◽  
Chaukiyal Kanchan
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Central Incisor ◽  
Element Analysis ◽  
Stress Evaluation ◽  
Maxillary Central Incisor

Impact of Grain Structure and Material Properties on Via Extrusion in 3D Interconnects

2015 ◽  
Vol 12 (3) ◽  
pp. 118-122 ◽  
Author(s):  
Tengfei Jiang ◽  
Chenglin Wu ◽  
Jay Im ◽  
Rui Huang ◽  
Paul S. Ho
Keyword(s):  
Mechanical Properties ◽  
Finite Element Analysis ◽  
Grain Size ◽  
Finite Element ◽  
Analytical Model ◽  
Material Properties ◽  
Grain Structure ◽  
Element Analysis ◽  
Silicon Vias ◽  
The Relationship

In this article, the effects of Cu microstructure on the mechanical properties and extrusion of through-silicon vias (TSVs) were studied based on two types of TSVs with different microstructure. A direct correlation was found between the grain size and the mechanical properties of the vias. Both an analytical model and finite element analysis (FEA) were used to establish the relationship between the mechanical properties and via extrusion. The effect of via/Si interface on extrusion was also studied by FEA. The results suggest small and uniform grains in the Cu vias, as well as stronger interfaces between the via and Si led to smaller via extrusion, and are thus preferable for reduced via extrusion failure and improved TSV reliability.

scholarly journals Inspection of the residual stress on welds using laser ultrasonic supported with finite element analysis

2019 ◽  
Vol 6 ◽  
pp. 3
Author(s):  
Chong Ye ◽  
I. Charles Ume ◽  
Yuanlai Zhou ◽  
Vishnu V.B. Reddy
Keyword(s):  
Residual Stress ◽  
Finite Element Analysis ◽  
Finite Element ◽  
Rayleigh Wave ◽  
Acoustic Waves ◽  
Velocity Variation ◽  
Element Analysis ◽  
Stress Evaluation ◽  
Longitudinal Residual Stress ◽  
Velocity Variations

Ultrasonic evaluation for residual stress measurement has been an effective method owing to its easy implementation, low cost and intrinsically being nondestructive. The velocity variations of acoustic waves in materials can be related to the stress state in the deformed medium by the acoustoelastic effects. In this study, a laser/EMAT ultrasonic method is proposed to evaluate the surface/subsurface longitudinal residual stress distribution generated by gas metal arc welding (GMAW). The velocity variation ΔV/V of Rayleigh wave, which is a surface wave, will be experimentally measured. Q-Switched Nd:YAG laser is used to generate a broadband ultrasonic wave. An electromagnetic acoustic transducer (EMAT) is attached to the welding plate for Rayleigh wave pick up. As the ultrasound receiver, the EMAT is used to measure time of flight (ToF) of the Rayleigh waves traveling along a specific path parallel to the direction of the welding seam. ToF measurements are obtained by changing Rayleigh wave path to welding zone center distance from 0 to 45 mm. A 3D thermomechanical-coupled finite element model is then developed to validate the capability of the proposed technique for welding-induced residual stress evaluation. The distributions of the normalized velocity variations from ToF experiments are compared with the distribution of the normalized longitudinal residual stresses from finite element analysis (FEA). It has been shown that there is a good correlation between these two distributions. The proposed technique provides a potential nondestructive avenue for surface/subsurface residual stress evaluation for welding parts.

Strain Gradient Finite Element Analysis of Size Dependence of Thermal Stresses in Through-Silicon Vias (TSVs)

2011 ◽  
Vol 199-200 ◽  
pp. 1920-1923
Author(s):  
Wu Gui Jiang ◽  
Cheng Xu ◽  
Jian Fei Yu ◽  
Jian Shan Wang
Keyword(s):  
Finite Element ◽  
Strain Gradient ◽  
Size Dependence ◽  
Thermal Stresses ◽  
Radius Ratio ◽  
Constitutive Law ◽  
Element Analysis ◽  
Through Silicon Vias ◽  
Size Scale ◽  
Silicon Vias

Through-Silicon Vias (TSVs) technology, which is widely used in three-dimensional (3D) Microsystems packaging, has been investigated by using a strain gradient finite element method (FEM). A thermomechanical strain gradient constitutive law was embedded into the commercial software ABAQUS to consider the size dependence of thermal stresses in TSVs. Our numerical results show that when both thicknesses of SiO2 dielectric layer and Si substrate are kept to a constant, for a given via depth/radius ratio, the Mises stress decreases with the decrease in the radius above 100 nm, and then it increases markedly with the further decrease in the via radius below 100 nm, which is not consistent with the results obtained by the conventional FEM. It is also shown that as the whole size of the TSV structures is scaled down proportionally, for a given via depth/radius ratio, the peak Mises stresses are almost size scale- independent above 100 nm and exhibit a strong size scale effect below 100 nm.

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