Development of a High-speed Eigenvalue-solver for Constant Plasma Monitoring on a Cell Cluster System

ABSTRACT:Not so long ago I interviewed a computer engineer in her home. Surrounded with toys and a napping baby—the interview time had been chosen carefully—she talked about how she worked as an independent contractor for a large electronics company. Connected by high-speed broadband, two telephone lines, and a cell phone, she felt fully integrated into the work, exchanging electronic files with her colleagues and having telephone conversations with customers two continents and umpteen time zones away. She told me she often worked late after the baby was in bed and during the baby's afternoon nap before she went to pick her older child up from school. Despite these odd working times, however, she was convinced that none of the company's customers and only some of her work colleagues knew that she worked at home. She was very contented with the arrangement.

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Electrical Characteristics Analysis of Bonded Cells for Shingled Modules

Journal of Nanoscience and Nanotechnology ◽

10.1166/jnn.2020.18763 ◽

2020 ◽

Vol 20 (11) ◽

pp. 6653-6658

Author(s):

Jeong Eun Park ◽

So Mang Park ◽

Won Seok Choi ◽

Jae Joon Jang ◽

Donggun Lim

Keyword(s):

Laser Cutting ◽

High Speed ◽

Green Laser ◽

Curing Temperature ◽

Process Conditions ◽

Laser Process ◽

Cut Cell ◽

Electrically Conductive Adhesive ◽

Characteristics Analysis ◽

A Cell

A shingled module fabricated using electrically conductive adhesive (ECA) can increase the light-receiving area and provide greater power than a conventional module fabricated using solder-coated copper ribbons. However, several issues such as damage from laser cutting and poor contact by the conductive paste may arise. In this study, a 15.675 × 3.1 cm2 c-Si cut cell was fabricated using a nanosecond green laser, and cell bonding was performed using ECA to fabricate shingled modules. If the laser process was performed with high speed and low power, there was insufficient depth for cut cell fabrication. This was because the laser only had a thermal effect on the surface. The cell was processed to a depth of approximately 46 μm by the laser, and it could be seen that the laser cutting proceeded smoothly when the laser process affected more than 25% of the wafer thickness. The cut cell was bonded by ECA, and the process conditions were changed. The highest efficiency of 20.27% was obtained for a cell bonded under the conditions of a curing time of 60 s and curing temperature of 150°C. As a result, the efficiency of the bonded cell was increased by approximately 2.67% compared to the efficiency of the conventional cut cell. This was because the shadow loss due to the busbar was reduced, increasing the active area of the module by eliminating the busbar from the illuminated area.

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2002 Rupture of cell membranes induced by high-speed deformation of a cell: Molecular dynamics simulation

The Proceedings of The Computational Mechanics Conference ◽

10.1299/jsmecmd.2010.23.3 ◽

2010 ◽

Vol 2010.23 (0) ◽

pp. 3-4

Author(s):

Kenichiro KOSHIYAMA ◽

Shigeo WADA

Keyword(s):

Molecular Dynamics ◽

Molecular Dynamics Simulation ◽

High Speed ◽

Cell Membranes ◽

Dynamics Simulation ◽

A Cell ◽

High Speed Deformation

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Introduction of Stevia rebaudiana Bertoni in in vitro culture

Abstract book of the 2nd International Scientific Conference "Plants and Microbes: the Future of Biotechnology" PLAMIC2020 ◽

10.28983/plamic2020.294 ◽

2020 ◽

Author(s):

S. Sh. Asadova

Keyword(s):

Cell Culture ◽

In Vitro Culture ◽

High Speed ◽

Stevia Rebaudiana ◽

Stevia Rebaudiana Bertoni ◽

A Cell ◽

Different Levels ◽

Adult Plants

A cell culture obtained from explants of adult plants and aseptic seedlings of the Stevia rebaudiana Bertoni variety with different levels of ploidy, characterized by high speed, proliferation and ability to morphogenesis.

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Viscoelastic epoxy foams by an aqueous emulsion foaming process

Journal of Cellular Plastics ◽

10.1177/0021955x19864016 ◽

2019 ◽

Vol 56 (1) ◽

pp. 105-118

Author(s):

Du Ngoc Uy Lan ◽

Muhammad Syazwan Fauzi ◽

Cao Xuan Viet ◽

Daniel Raps ◽

Volker Altstädt

Keyword(s):

Sodium Bicarbonate ◽

High Speed ◽

Water Molecules ◽

Aqueous Emulsion ◽

Blowing Agent ◽

Compression Set ◽

Foaming Process ◽

A Cell ◽

Viscoelastic Foams ◽

Emulsifying Ability

The research proposed an aqueous emulsion foaming process to produce a viscoelastic epoxy foam having a density of 0.33–0.36 g/cm3 from the polyamide–epoxy adduct, which uses a reverse ratio of epoxy and polyamide hardener. The process is simple, economical and uses no surfactant, thanks to the emulsifying ability of polyamide hardener. Firstly, the mixture of excess polyamide, epoxy and sodium bicarbonate was emulsified with distilled water using high-speed stirring to form dispersed epoxy droplets in water. Secondly, a solution of ammonium chloride was added, which reacted with sodium bicarbonate to produce carbon dioxide and ammonia gases dispersed in the epoxy emulsion. The expanding gases induced flocculation and partial coalescence of the epoxy droplets; sequentially water molecules were entrapped within them. Finally, a curing process was carried out to stabilise the foam morphology and structure. Two types of pore morphologies were observed: a large foam-pore generated from blowing-agent gases and a cell-wall pore formed from the vapourisation of entrapped water (as the void template). Porosity and pore morphologies depended on blowing-agent content, and the viscoelasticity was affected by the epoxy/polyamide ratio. The obtained viscoelastic foams showed a large number of interconnected cells and exhibited high compression set values.

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