scholarly journals Cyclic plastic response and damage in superaustenitic steel in high temperature cycling with dwells and in thermomechanical cycling

2019 ◽  
Vol 23 ◽  
pp. 275-280
Author(s):  
Jaroslav Polák ◽  
Roman Petráš
2017 ◽  
Vol 43 (6) ◽  
pp. 5080-5088 ◽  
Author(s):  
Hiroyuki Miyazakia ◽  
Shoji Iwakiri ◽  
Kiyoshi Hirao ◽  
Shinji Fukuda ◽  
Noriya Izu ◽  
...  

2019 ◽  
Vol 3 (1) ◽  
pp. 70-83
Author(s):  
Wei Wei Liu ◽  
Berdy Weng ◽  
Scott Chen

Purpose The Kirkendall void had been a well-known issue for long-term reliability of semiconductor interconnects; while even the KVs exist at the interfaces of Cu and Sn, it may still be able to pass the condition of unbias long-term reliability testing, especially for 2,000 cycles of temperature cycling test and 2,000 h of high temperature storage. A large number of KVs were observed after 200 cycles of temperature cycling test at the intermetallic Cu3Sn layer which locate between the intermetallic Cu6Sn5 and Cu layers. These kinds of voids will grow proportional with the aging time at the initial stage. This paper aims to compare various IMC thickness as a function of stress test, the Cu3Sn and Cu6Sn5 do affected seriously by heat, but Ni3Sn4 is not affected by heat or moisture. Design/methodology/approach The package is the design in the flip chip-chip scale package with bumping process and assembly. The package was put in reliability stress test that followed AEC-Q100 automotive criteria and recorded the IMC growing morphology. Findings The Cu6Sn5 intermetallic compound is the most sensitive to continuous heat which grows from 3 to 10 µm at high temperature storage 2,000 h testing, and the second is Cu3Sn IMC. Cu6Sn5 IMC will convert to Cu3Sn IMC at initial stage, and then Kirkendall void will be found at the interface of Cu and Cu3Sn IMC, which has quality concerning issue if the void’s density grows up. The first phase to form and grow into observable thickness for Ni and lead-free interface is Ni3Sn4 IMC, and the thickness has little relationship to the environmental stress, as no IMC thickness variation between TCT, uHAST and HTSL stress test. The more the Sn exists, the thicker Ni3Sn4 IMC will be derived from this experimental finding compare the Cu/Ni/SnAg cell and Ni/SnAg cell. Research limitations/implications The research found that FCCSP can pass automotive criteria that follow AEC-Q100, which give the confidence for upgrading the package type with higher efficiency and complexities of the pin design. Practical implications This result will impact to the future automotive package, how to choose the best package methodology and what is the way to do the package. The authors can understand the tolerance for the kind of flip chip package, and the bump structure is then applied for high-end technology. Originality/value The overall three kinds of bump structures, Cu/Ni/SnAg, Cu/SnAg and Ni/SnAg, were taken into consideration, and the IMC growing morphology had been recorded. Also, the IMC had changed during the environmental stress, and KV formation was reserved.


Author(s):  
Michael W. Usrey ◽  
Yiping Liu ◽  
Mark Anderson ◽  
Jon Lubbers ◽  
Brady Knowles ◽  
...  

Solar power is a sustainable resource which can reduce the power generated by fossil fuels, lowering greenhouse gas emissions and increasing energy independence. The U.S. Department of Energy’s SunShot Initiative has set goals to increase the efficiency of concentrating solar power (CSP) systems. One SunShot effort to help CSP systems exceed 50% efficiency is to make use of high-temperature heat transfer fluids (HTFs) and thermal energy storage (TES) fluids that can increase the temperature of the power cycle up to 1300°C. Sporian has successfully developed high-temperature operable pressure, temperature, thermal flux, strain, and flow sensors for gas path measurements in high-temperature turbine engines. These sensors are based on a combination of polymer derived ceramic (PDC) sensors, advanced high-temperature packaging, and integrated electronics. The overall objective is the beneficial application of these sensors to CSP systems. Through collaboration with CSP industry stakeholders, Sporian has established a full picture of operational, interface, and usage requirements for trough, tower, and dish CSP architectures. In general, sensors should have accurate measurement, good reliability, reasonable cost, and ease of replacement or repair. Sensors in contact with hot salt HTF and TES fluids will experience temperature cycling on a daily basis, and parts of the system may be drained routinely. Some of the major challenges to high-temperature CSP implementation include molten salt corrosion and flow erosion of the sensors. Potential high-temperature sensor types that have been identified as of interest for CSP HTF/TES applications include temperature, pressure, flow, and level sensors. Candidate solar salts include nitrate, carbonate, and chloride, with different application temperatures ranging from 550°C-900°C. Functional ceramics were soaked for 500 hours in molten nitrate, carbonate, and chloride salts, showing excellent corrosion resistance in chloride salts and good resistance in nitrate salts. The demonstration of functional ceramics in relevant HTFs laid the foundation for full prototype sensor and packaging demonstration. Sporian has developed a packaging approach for ceramic-based sensors in various harsh gaseous environments at temperatures up to 1400°C, but several aspects of that packaging are not compatible with corrosive and electrically conductive HTFs. In addition to consulting published literature, a 300 hour soak test in molten chloride salt allowed the authors to identify suitable structural metals and ceramics. Based on discussions with stakeholders, molten salt corrosion testing and room-temperature water flow testing, suitable for CSP sensor/packaging concepts were identified for future development, and initial prototypes have been built and tested.


2017 ◽  
Vol 2017 (HiTEN) ◽  
pp. 000031-000035 ◽  
Author(s):  
R. Bannatyne ◽  
D. Gifford ◽  
K. Klein ◽  
K. McCarville ◽  
C. Merritt ◽  
...  

Abstract This paper will describe the development and testing of a new ARM© Cortex©-M based microcontroller for high temperature electronic systems. High temperature and electrical overstresses can cause latch-up in CMOS devices that will interfere with normal device operation or destroy the device. For reliable operation in the downhole drilling environment it was necessary to immunize this device against latch-up using an innovation processing technique. HARDSIL® technology that allows reliable latch-up free operation at extreme temperatures will be described. Details on the qualification and testing of the product to ensure that it meets the challenging environment will also be discussed. This includes electrical testing and temperature cycling testing to ensure that the different package options for the silicon device are mechanically sound in a high temperature environment that exposes the silicon and packaging materials to thermal cycling. The ecosystem for the microcontroller will also be discussed – hardware and software development tools are required to optimize the use of the device in extreme temperature embedded systems. An ecosystem of components is also required to operate with the microcontroller in the high temperature harsh environment.


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