Rapid formation of intermetallic joints through ultrasonic-assisted die bonding with Sn–0.7Cu solder for high temperature packaging application

Scripta Materialia ◽

10.1016/j.scriptamat.2015.07.036 ◽

2016 ◽

Vol 110 ◽

pp. 19-23 ◽

Author(s):

Hongjun Ji ◽

Yunfei Qiao ◽

Mingyu Li

Keyword(s):

High Temperature ◽

Rapid Formation ◽

Ultrasonic Assisted ◽

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Ultrasonic-assisted soldering of Sn-based alloys during die bonding for high-temperature application

2015 16th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2015.7236650 ◽

2015 ◽

Author(s):

Hongjun Ji ◽

Yunfei Qiao ◽

Mingyu Li

Keyword(s):

High Temperature ◽

High Temperature Application ◽

Ultrasonic Assisted ◽

Temperature Application ◽

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Ultrasonic-assisted soldering of Sn/Ni composite solder during die bonding for high-temperature application

2016 17th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2016.7583139 ◽

2016 ◽

Author(s):

Hongjun Ji ◽

Minggang Li ◽

Mingyu Li

Keyword(s):

High Temperature ◽

Composite Solder ◽

High Temperature Application ◽

Ultrasonic Assisted ◽

Temperature Application ◽

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Rapid formation of intermetallic joints with Sn/metal composite alloys by ultrasonic-assisted soldering for high-temperature chip attachment

2017 18th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2017.8046660 ◽

2017 ◽

Author(s):

Shu Ma ◽

Hongjun Ji ◽

Junbo Zhou ◽

Huajun Lu ◽

Meng Liang ◽

...

Keyword(s):

High Temperature ◽

Metal Composite ◽

Rapid Formation ◽

Ultrasonic Assisted ◽

Chip Attachment

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Ultrasonic-assisted nano Ag-Al alloy sintering to enable high-temperature electronic interconnections

2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc32862.2020.00311 ◽

2020 ◽

Author(s):

Canyu Liu ◽

Allan Liu ◽

Yi Zhong ◽

Stuart Robertson ◽

Zhaoxia Zhou ◽

...

Keyword(s):

High Temperature ◽

Al Alloy ◽

Ultrasonic Assisted ◽

High Temperature Electronic

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High-Temperature Superconductors: Rapid Formation of High-Temperature BiBased Superconductors

Materials and Processing Report ◽

10.1080/08871949.1990.11752400 ◽

1990 ◽

Vol 5 (9) ◽

pp. 7-8

Author(s):

Ho-Gi Kim

Keyword(s):

High Temperature ◽

High Temperature Superconductors ◽

Rapid Formation

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A High-Temperature Die-Bonding Structure Fabricated at Low Temperature for Light-Emitting Diodes

IEEE Electron Device Letters ◽

10.1109/led.2015.2451018 ◽

2015 ◽

Vol 36 (8) ◽

pp. 835-837 ◽

Author(s):

Li-Chin Cheng ◽

Chih-Ming Chen ◽

Ming-Guan Chen ◽

Chi-Chang Hu ◽

Hsin-Yi Jiang ◽

...

Keyword(s):

High Temperature ◽

Low Temperature ◽

Light Emitting Diodes ◽

Light Emitting ◽

Bonding Structure ◽

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Rapid formation of Ni3Sn4 joints for die attachment of SiC-based high temperature power devices using ultrasound-induced transient liquid phase bonding process

Ultrasonics Sonochemistry ◽

10.1016/j.ultsonch.2016.12.026 ◽

2017 ◽

Vol 36 ◽

pp. 420-426 ◽

Author(s):

Z.L. Li ◽

H.J. Dong ◽

X.G. Song ◽

H.Y. Zhao ◽

J.C. Feng ◽

...

Keyword(s):

High Temperature ◽

Liquid Phase ◽

Transient Liquid Phase ◽

Bonding Process ◽

Transient Liquid Phase Bonding ◽

Power Devices ◽

Die Attachment ◽

Rapid Formation

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Ultrasonic-Assisted Soldering of Sn-Based Solder Alloys to Form Intermetallic Interconnects for High Temperature Application

2016 IEEE 66th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2016.144 ◽

2016 ◽

Author(s):

Hongjun Ji ◽

Mingyu Li ◽

Yunfei Qiao

Keyword(s):

High Temperature ◽

Solder Alloys ◽

High Temperature Application ◽

Ultrasonic Assisted ◽

Temperature Application

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Mechanism of Ultrasonic-Assisted Sintering of Cu@Ag NPs Paste in air for High-Temperature Power Device Packaging

2018 IEEE 68th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2018.00195 ◽

2018 ◽

Author(s):

Hongjun Ji ◽

Mingyu Li

Keyword(s):

High Temperature ◽

Power Device ◽

Ag Nps ◽

Ultrasonic Assisted

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Evolution of shear strength and microstructure of die bonding technologies for high temperature applications during thermal aging

2010 12th Electronics Packaging Technology Conference ◽

10.1109/eptc.2010.5702721 ◽

2010 ◽

Author(s):

S. Egelkraut ◽

L. Frey ◽

M. Knoerr ◽

A. Schletz

Keyword(s):

Shear Strength ◽

High Temperature ◽

Thermal Aging ◽

Die Bonding ◽

Temperature Applications

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