High-quality remote plasma enhanced atomic layer deposition of aluminum oxide thin films for nanoelectronics applications

2021 ◽  
pp. 108027
Author(s):  
Robin Khosla ◽  
Daniel Schwarz ◽  
Hannes S. Funk ◽  
Kateryna Guguieva ◽  
Jörg Schulze
2019 ◽  
Vol 40 (1) ◽  
pp. 012806 ◽  
Author(s):  
Hui Hao ◽  
Xiao Chen ◽  
Zhengcheng Li ◽  
Yang Shen ◽  
Hu Wang ◽  
...  

2019 ◽  
Vol 37 (4) ◽  
pp. 040901 ◽  
Author(s):  
Fatemeh S. M. Hashemi ◽  
LiAo Cao ◽  
Felix Mattelaer ◽  
Timo Sajavaara ◽  
J. Ruud van Ommen ◽  
...  

2020 ◽  
Vol 32 (5) ◽  
pp. 1925-1936 ◽  
Author(s):  
Jon G. Baker ◽  
Joel R. Schneider ◽  
James A. Raiford ◽  
Camila de Paula ◽  
Stacey F. Bent

2015 ◽  
Vol 1096 ◽  
pp. 93-97
Author(s):  
Bao Jun Yan ◽  
Shu Lin Liu ◽  
Lu Ping Yang

Oxide thin films such as aluminum oxide doped with zinc (AZO), and aluminum oxide (Al2O3) were prepared in the pores of microchannel plate (MCP) by atomic layer deposition (ALD), which is a precise control thin film thickness on substrate with high aspect ratio structure. In this paper, homogenous oxide thin films deposited on varied substrates were prepared by ALD technology under different conditions, and the morphology, element distribution and structure of deposited samples are systematically investigated by scanning electron microscopy (SEM), energy dispersive x-ray (EDX), and x-ray diffraction (XRD) respectively, The results show that ALD technique is a good method to grow homogenous thin films on MCP.


Sign in / Sign up

Export Citation Format

Share Document