Facilitating low-temperature diffusion bonding between oxygen-free Al2O3 ceramic and pure Cu through inclusion of 0.8 La (wt.%) to Ti pre-metallized interlayer: Microstructural evolution, metallurgical reactions, and mechanical properties

2020 ◽  
Vol 21 ◽  
pp. 100738
Author(s):  
Chun-Ming Lin ◽  
Tseng-Pei Hsins
Keyword(s):  
Mechanical Properties ◽  
Low Temperature ◽  
Microstructural Evolution ◽  
Diffusion Bonding ◽  
Al2o3 Ceramic ◽  
Temperature Diffusion ◽  
Metallurgical Reactions ◽  
Pure Cu

Low-temperature diffusion brazing of actively metallized Al2O3 ceramic tube and 5A05 aluminum alloy

2015 ◽  
Vol 86 ◽  
pp. 328-337 ◽  
Author(s):  
Y. Wang ◽  
Z.W. Yang ◽  
L.X. Zhang ◽  
D.P. Wang ◽  
J.C. Feng
Keyword(s):  
Aluminum Alloy ◽  
Low Temperature ◽  
Al2o3 Ceramic ◽  
Ceramic Tube ◽  
Diffusion Brazing ◽  
Temperature Diffusion

scholarly journals A Low-Temperature Alumina/Copper Diffusion Bonding Process using La-Doped Titanium Interlayers

Coatings ◽  
2018 ◽  
Vol 8 (11) ◽  
pp. 401 ◽  
Author(s):  
Cherng-Yuh Su ◽  
Jia-Liang Huang ◽  
Po-Chun Chen ◽  
Hsin-Jung Yu ◽  
Dai-Liang Ma ◽  
...  
Keyword(s):  
Low Temperature ◽  
Diffusion Bonding ◽  
Bonding Temperature ◽  
Oxygen Affinity ◽  
Temperature Stability ◽  
High Strength ◽  
High Temperature Stability ◽  
Transmission Electron ◽  
Temperature Diffusion ◽  
La Doped

Ceramic-to-metal heterojunctions have been established to improve high-temperature stability for applications in aerospace and harsh environments. In this work, we employed low-temperature diffusion bonding to realize an alumina/Cu heterogeneous joint. Using a thin layer of lanthanum-doped titanium (La-doped Ti) to metallize the alumina surface, we achieved the bonding at a temperature range of 250–350 °C. We produced a uniform, thermally stable, and high-strength alumina/Cu joint after a hot-press process in vacuum. Signals from X-ray diffraction (XRD) suggested the successful diffusion of Ti and La into the alumina substrate, as Ti can easily substitute Al in alumina, and La has a better oxygen affinity than that of Al. The transmission electron microscopy and XRD results also showed the existence of CuxTiyO phases without CuxTiy or LaOx. In addition, the bonding strength of alumina/copper hot-pressed at 250, 300, and 350 °C were 7.5, 9.8 and 15.0 MPa, respectively. The process developed in this study successfully lowered the bonding temperature for the alumina/copper joint.

Ultrasonic Monitoring of a Low-Temperature Diffusion Bonding Process

2000 ◽  
Vol 28 (2) ◽  
pp. 88 ◽  
Author(s):  
DR Petersen ◽  
RE Link ◽  
Y Greenberg ◽  
D Itzhak ◽  
G Kohn
Keyword(s):  
Low Temperature ◽  
Diffusion Bonding ◽  
Bonding Process ◽  
Ultrasonic Monitoring ◽  
Temperature Diffusion

Low temperature diffusion bonding of stainless steel

2010 ◽  
Vol 63 (6) ◽  
pp. 853-857 ◽  
Author(s):  
P. S. Gawde ◽  
R. Kishore ◽  
A. L. Pappachan ◽  
G. B. Kale ◽  
G. K. Dey
Keyword(s):  
Stainless Steel ◽  
Low Temperature ◽  
Diffusion Bonding ◽  
Temperature Diffusion
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