Chemical vapor etching of copper using oxygen and 1,1,1,5,5,5-hexafluoro-2,4-pentanedione

When an energetic ion penetrates through an interface between a thin film (of species A) and a substrate (of species B), ion induced atomic mixing may result in an intermixed region (which contains A and B) near the interface. Most ion beam mixing experiments have been directed toward metal-silicon systems, silicide phases are generally obtained, and they are the same as those formed by thermal treatment.Recent emergence of silicide compound as contact material in silicon microelectronic devices is mainly due to the superiority of the silicide-silicon interface in terms of uniformity and thermal stability. It is of great interest to understand the kinetics of the interfacial reactions to provide insights into the nature of ion beam-solid interactions as well as to explore its practical applications in device technology.About 500 Å thick molybdenum was chemical vapor deposited in hydrogen ambient on (001) n-type silicon wafer with substrate temperature maintained at 650-700°C. Samples were supplied by D. M. Brown of General Electric Research & Development Laboratory, Schenectady, NY.

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STM studies of crystal growth

Proceedings, annual meeting, Electron Microscopy Society of America ◽

10.1017/s0424820100086179 ◽

1991 ◽

Vol 49 ◽

pp. 374-375

Author(s):

M. G. Lagally

Keyword(s):

Crystal Growth ◽

Molecular Beam ◽

Chemical Vapor ◽

Sputter Deposition ◽

Field Of View ◽

Scanning Tunneling ◽

Wide Field ◽

Tunneling Microscopy ◽

Wide Field Of View ◽

The One

It has been recognized since the earliest days of crystal growth that kinetic processes of all Kinds control the nature of the growth. As the technology of crystal growth has become ever more refined, with the advent of such atomistic processes as molecular beam epitaxy, chemical vapor deposition, sputter deposition, and plasma enhanced techniques for the creation of “crystals” as little as one or a few atomic layers thick, multilayer structures, and novel materials combinations, the need to understand the mechanisms controlling the growth process is becoming more critical. Unfortunately, available techniques have not lent themselves well to obtaining a truly microscopic picture of such processes. Because of its atomic resolution on the one hand, and the achievable wide field of view on the other (of the order of micrometers) scanning tunneling microscopy (STM) gives us this opportunity. In this talk, we briefly review the types of growth kinetics measurements that can be made using STM. The use of STM for studies of kinetics is one of the more recent applications of what is itself still a very young field.

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Reaction couples of ceramic thin films prepared by CVD

Proceedings, annual meeting, Electron Microscopy Society of America ◽

10.1017/s0424820100106053 ◽

1988 ◽

Vol 46 ◽

pp. 798-799

Author(s):

D.W. Susnitzky ◽

S.R. Summerfelt ◽

C.B. Carter

Keyword(s):

Thin Film ◽

Vapor Deposition ◽

Chemical Vapor ◽

Deposition Process ◽

Solid State Reactions ◽

Spatial Distributions ◽

Diffusion Couples ◽

Kinetics Studies ◽

Ceramic Thin Films ◽

Initial Stage

Solid-state reactions have traditionally been studied in the form of diffusion couples. This ‘bulk’ approach has been modified, for the specific case of the reaction between NiO and Al2O3, by growing NiAl2O4 (spinel) from electron-transparent Al2O3 TEM foils which had been exposed to NiO vapor at 1415°C. This latter ‘thin-film’ approach has been used to characterize the initial stage of spinel formation and to produce clean phase boundaries since further TEM preparation is not required after the reaction is completed. The present study demonstrates that chemical-vapor deposition (CVD) can be used to deposit NiO particles, with controlled size and spatial distributions, onto Al2O3 TEM specimens. Chemical reactions do not occur during the deposition process, since CVD is a relatively low-temperature technique, and thus the NiO-Al2O3 interface can be characterized. Moreover, a series of annealing treatments can be performed on the same sample which allows both Ni0-NiAl2O4 and NiAl2O4-Al2O3 interfaces to be characterized and which therefore makes this technique amenable to kinetics studies of thin-film reactions.

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A Novel TEM Technique for Characterizing As-Grown CVD Diamond Films

Proceedings, annual meeting, Electron Microscopy Society of America ◽

10.1017/s0424820100089093 ◽

1991 ◽

Vol 49 ◽

pp. 956-957 ◽

Cited By ~ 1

Author(s):

Z.L. Wang ◽

J. Bentley ◽

R.E. Clausing ◽

L. Heatherly ◽

L.L. Horton

Keyword(s):

Diamond Films ◽

Chemical Vapor ◽

Growth Direction ◽

Dark Field ◽

Growth Surface ◽

Specimen Preparation ◽

Transmission Electron ◽

Diffraction Patterns ◽

First Time ◽

Microstructural Studies

Microstructural studies by transmission electron microscopy (TEM) of diamond films grown by chemical vapor deposition (CVD) usually involve tedious specimen preparation. This process has been avoided with a technique that is described in this paper. For the first time, thick as-grown diamond films have been examined directly in a conventional TEM without thinning. With this technique, the important microstructures near the growth surface have been characterized. An as-grown diamond film was fractured on a plane containing the growth direction. It took about 5 min to prepare a sample. For TEM examination, the film was tilted about 30-45° (see Fig. 1). Microstructures of the diamond grains on the top edge of the growth face can be characterized directly by transmitted electron bright-field (BF) and dark-field (DF) images and diffraction patterns.

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