Three-dimensional simulation of the conformality of copper layers deposited by low-pressure chemical vapor deposition from CuI(tmvs)(hfac)
2000 ◽
Vol 50
(1-4)
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pp. 481-486
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2002 ◽
Vol 12
(4)
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pp. 69-74
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Keyword(s):
Keyword(s):
2017 ◽
Vol 19
(8)
◽
pp. 1700193
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Keyword(s):
Keyword(s):
1999 ◽
Vol 146
(8)
◽
pp. 2901-2905
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