Three-dimensional simulation of the conformality of copper layers deposited by low-pressure chemical vapor deposition from CuI(tmvs)(hfac)

2000 ◽  
Vol 50 (1-4) ◽  
pp. 481-486 ◽  
Author(s):  
E Bär ◽  
J Lorenz ◽  
H Ryssel
Author(s):  
Meric Firat ◽  
Hariharsudan Sivaramakrishnan Radhakrishnan ◽  
Maria Recaman Payo ◽  
Filip Duerinckx ◽  
Rajiv Sharma ◽  
...  

2017 ◽  
Vol 19 (8) ◽  
pp. 1700193 ◽  
Author(s):  
Mattias Vervaele ◽  
Bert De Roo ◽  
Jolien Debehets ◽  
Marilyne Sousa ◽  
Luman Zhang ◽  
...  

1993 ◽  
Vol 5 (12) ◽  
pp. 1710-1714 ◽  
Author(s):  
R. A. Levy ◽  
J. M. Grow ◽  
G. S. Chakravarthy

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