Long term stability of gate-oxides on n- and p-type silicon carbide studied by charge injection techniques

1997 ◽  
Vol 46 (1-3) ◽  
pp. 263-266 ◽  
Author(s):  
E.G. Stein von Kamienski ◽  
C. Leonhard ◽  
F. Portheine ◽  
A. Gölz ◽  
H. Kurz
2017 ◽  
Vol 1 (3) ◽  
pp. 626-635 ◽  
Author(s):  
Nathalie Marinakis ◽  
Markus Willgert ◽  
Edwin C. Constable ◽  
Catherine E. Housecroft

The balance between optimal photoconversion efficiency and long-term stability in p-type DSCs with a cyclometallated ruthenium dye is presented, with mixtures of acetonitrile and propionitrile being the best solvent with an I3−/I− redox couple.


2015 ◽  
Vol 17 (44) ◽  
pp. 29854-29858 ◽  
Author(s):  
J. Krez ◽  
B. Balke ◽  
S. Ouardi ◽  
S. Selle ◽  
T. Höche ◽  
...  

The long-term stability of n- and p-type thermoelectric half-Heusler materials is investigated. The dendritic microstructure is temperature resistant and maintained the low thermal conductivity values (κ < 4 W m−1 K−1) even after 500 heating and cooling cycles.


2015 ◽  
Vol 3 (12) ◽  
pp. 1217-1224 ◽  
Author(s):  
Elisabeth Rausch ◽  
Benjamin Balke ◽  
Siham Ouardi ◽  
Claudia Felser

2000 ◽  
Vol 640 ◽  
Author(s):  
S.-K. Lee ◽  
C.-M. Zetterling ◽  
M. Östling

ABSTRACTIn the present work, we investigated sputtered titanium tungsten (TiW) contacts for Ohmic contacts to both n- and p-type 4H-SiC with long-term stability under high temperature (500°C).. Epitaxial layers with a doping concentration of 1.3×1019 and 6×1018 cm−3 were used. After high temperature annealing (>950°C) sputtered TiW contacts showed Ohmic behavior with good uniform distribution of the specific contact resistance. We obtained an average specific contact resistance (pc) of 4×10−5 Ωcm2 and 1.2 ∼ 1.7×10−4 Ωcm2 for p- and n-type, respectively from linear TLM measurement. We also found some variation of the specific contact resistance and the sheet resistance from our TLM measurement for p-type contacts. We will discuss this behavior with the measurement of SIMS. Long-term stability with a top-cap layer is also discussed


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