Amorphous carbon based materials as the interconnect dielectric in ULSI chips

2001 ◽  
Vol 10 (2) ◽  
pp. 234-239 ◽  
Author(s):  
A. Grill
2013 ◽  
Vol 538 ◽  
pp. 78-84 ◽  
Author(s):  
Sigitas Tamulevičius ◽  
Šarūnas Meškinis ◽  
Kęstutis Šlapikas ◽  
Andrius Vasiliauskas ◽  
Rimantas Gudaitis ◽  
...  

2021 ◽  
Vol 5 ◽  
pp. 100105
Author(s):  
Wolfgang Tillmann ◽  
Nelson Filipe Lopes Dias ◽  
Dominic Stangier ◽  
Serguei Matveev ◽  
Carl-Arne Thomann ◽  
...  

2021 ◽  
Vol 119 (14) ◽  
pp. 143505
Author(s):  
Qiaoling Tian ◽  
Xiaoning Zhao ◽  
Xiaohan Zhang ◽  
Huai Lin ◽  
Di Wang ◽  
...  

2004 ◽  
Vol 03 (04n05) ◽  
pp. 571-578 ◽  
Author(s):  
S. ZHANG ◽  
X. L. BUI ◽  
Y. FU ◽  
H. DU

Metallic Al was doped into amorphous carbon (a-C) to form a matrix of a-C(Al) of very low residual stress and high toughness at the expense of some hardness. Nanocrystallites of TiC (nc-TiC) of a few nanometers in size were embedded in this matrix to bring back the hardness. The nanocomposite coating of nc-TiC/a-C(Al) was deposited via co-sputtering of graphite, Ti , and Al targets. Although the nanocomposite coating exhibited a moderately high hardness (about 20 GPa), it possessed extremely high toughness (about 55% of plasticity during indentation deformation) and low residual stress (less than 0.4 GPa), smooth (Ra=5.5 nm ), and hydrophobic surface (contact angle with water reaches 100°).


2016 ◽  
Vol 37 (11) ◽  
pp. 1430-1433 ◽  
Author(s):  
Xiaoning Zhao ◽  
Zhongqiang Wang ◽  
Haiyang Xu ◽  
Yu Xie ◽  
Hanlu Ma ◽  
...  

Materials ◽  
2014 ◽  
Vol 7 (8) ◽  
pp. 5643-5663 ◽  
Author(s):  
Hui-Lin Hsu ◽  
Keith Leong ◽  
I-Ju Teng ◽  
Michael Halamicek ◽  
Jenh-Yih Juang ◽  
...  

Sign in / Sign up

Export Citation Format

Share Document