scholarly journals Scanning Thermal Microscopy: Nano-localized Thermal Analysis and Mapping of Surface and Subsurface Thermal Properties

2016 ◽  
Vol 22 (S4) ◽  
pp. 2-3 ◽  
Author(s):  
M. J. Pereira ◽  
J. S. Amaral ◽  
N. J. O. Silva ◽  
V. S. Amaral
2016 ◽  
Vol 22 (6) ◽  
pp. 1270-1280 ◽  
Author(s):  
Maria J. Pereira ◽  
Joao S. Amaral ◽  
Nuno J. O. Silva ◽  
Vitor S. Amaral

AbstractDetermining and acting on thermo-physical properties at the nanoscale is essential for understanding/managing heat distribution in micro/nanostructured materials and miniaturized devices. Adequate thermal nano-characterization techniques are required to address thermal issues compromising device performance. Scanning thermal microscopy (SThM) is a probing and acting technique based on atomic force microscopy using a nano-probe designed to act as a thermometer and resistive heater, achieving high spatial resolution. Enabling direct observation and mapping of thermal properties such as thermal conductivity, SThM is becoming a powerful tool with a critical role in several fields, from material science to device thermal management. We present an overview of the different thermal probes, followed by the contribution of SThM in three currently significant research topics. First, in thermal conductivity contrast studies of graphene monolayers deposited on different substrates, SThM proves itself a reliable technique to clarify the intriguing thermal properties of graphene, which is considered an important contributor to improve the performance of downscaled devices and materials. Second, SThM’s ability to perform sub-surface imaging is highlighted by thermal conductivity contrast analysis of polymeric composites. Finally, an approach to induce and study local structural transitions in ferromagnetic shape memory alloy Ni–Mn–Ga thin films using localized nano-thermal analysis is presented.


Nanomaterials ◽  
2021 ◽  
Vol 11 (2) ◽  
pp. 491
Author(s):  
Christoph Metzke ◽  
Fabian Kühnel ◽  
Jonas Weber ◽  
Günther Benstetter

New micro- and nanoscale devices require electrically isolating materials with specific thermal properties. One option to characterize these thermal properties is the atomic force microscopy (AFM)-based scanning thermal microscopy (SThM) technique. It enables qualitative mapping of local thermal conductivities of ultrathin films. To fully understand and correctly interpret the results of practical SThM measurements, it is essential to have detailed knowledge about the heat transfer process between the probe and the sample. However, little can be found in the literature so far. Therefore, this work focuses on theoretical SThM studies of ultrathin films with anisotropic thermal properties such as hexagonal boron nitride (h-BN) and compares the results with a bulk silicon (Si) sample. Energy fluxes from the probe to the sample between 0.6 µW and 126.8 µW are found for different cases with a tip radius of approximately 300 nm. A present thermal interface resistance (TIR) between bulk Si and ultrathin h-BN on top can fully suppress a further heat penetration. The time until heat propagation within the sample is stationary is found to be below 1 µs, which may justify higher tip velocities in practical SThM investigations of up to 20 µms−1. It is also demonstrated that there is almost no influence of convection and radiation, whereas a possible TIR between probe and sample must be considered.


Holzforschung ◽  
2008 ◽  
Vol 62 (1) ◽  
pp. 91-98 ◽  
Author(s):  
Johannes Konnerth ◽  
David Harper ◽  
Seung-Hwan Lee ◽  
Timothy G. Rials ◽  
Wolfgang Gindl

Abstract Cross sections of wood adhesive bonds were studied by scanning thermal microscopy (SThM) with the aim of scrutinizing the distribution of adhesive in the bond line region. The distribution of thermal conductivity, as well as temperature in the bond line area, was measured on the surface by means of a nanofabricated thermal probe offering high spatial and thermal resolution. Both the thermal conductivity and the surface temperature measurements were found suitable to differentiate between materials in the bond region, i.e., adhesive, cell walls and embedding epoxy. Of the two SThM modes available, the surface temperature mode provided images with superior optical contrast. The results clearly demonstrate that the polyurethane adhesive did not cause changes of thermal properties in wood cell walls with adhesive contact. By contrast, cell walls adjacent to a phenol-resorcinol-formaldehyde adhesive showed distinctly changed thermal properties, which is attributed to the presence of adhesive in the wood cell wall.


2002 ◽  
Vol 41 (Part 1, No. 11B) ◽  
pp. 7239-7241 ◽  
Author(s):  
Wen-Mei Lin ◽  
Reinhard Koehler ◽  
Gunnar Suchaneck ◽  
Gerald Gerlach

2011 ◽  
Vol 248 (2) ◽  
pp. 370-374 ◽  
Author(s):  
Grzegorz Wielgoszewski ◽  
Przemysław Sulecki ◽  
Teodor Gotszalk ◽  
Paweł Janus ◽  
Piotr Grabiec ◽  
...  

2018 ◽  
Vol 3 (5) ◽  
pp. 505-516 ◽  
Author(s):  
Yifan Li ◽  
Nitin Mehra ◽  
Tuo Ji ◽  
Jiahua Zhu

Quantitative assessment of thermal properties by scanning thermal microscopy (SThM) is a demanded technology, but still not yet available due to the presence of unpredictable thermal contact resistance (TCR) at the tip/substrate interface.


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