Mist Chemical Vapor Deposition of Single-Phase Metastable Rhombohedral Indium Tin Oxide Epitaxial Thin Films with High Electrical Conductivity and Transparency on Various α-Al2O3 Substrates

2018 ◽  
Vol 18 (7) ◽  
pp. 4022-4028 ◽  
Author(s):  
Hiroyuki Nishinaka ◽  
Masahiro Yoshimoto
1991 ◽  
Vol 70 (7) ◽  
pp. 3848-3851 ◽  
Author(s):  
Toshiro Maruyama ◽  
Kunihiro Fukui

2009 ◽  
Vol 12 (5) ◽  
pp. D42 ◽  
Author(s):  
Takeshi Kondo ◽  
Yutaka Sawada ◽  
Hiroshi. Funakubo ◽  
Kensuke Akiyama ◽  
Takanori Kiguchi ◽  
...  

2003 ◽  
Vol 426 (1-2) ◽  
pp. 124-131 ◽  
Author(s):  
Young-Soon Kim ◽  
Young-Chul Park ◽  
S.G. Ansari ◽  
Byung-Soo Lee ◽  
Hyung-Shik Shin

2000 ◽  
Vol 15 (8) ◽  
pp. 1702-1708
Author(s):  
Ruichao Zhang ◽  
Ren Xu

A novel two-step metalorganic chemical vapor deposition process was used in this study to prepare Sr1−xBaxNb2O6 (SBN) thin films. Two thin layers of single-phase SrNb2O6 and BaNb2O6 were deposited alternately on a silicon substrate, and the solid solution of SBN was obtained by high-temperature annealing. The stoichiometry control of the SrNb2O6 and the BaNb2O6 thin films was achieved through deposition process control, according to the evaporation characteristics of double metal alkoxide. The evaporation behavior of double metal alkoxide precursors SrNb2(1-OC4H9)12 and BaNb2(1-OC4H9)12 was studied, and the results were compared with the evaporation of single alkoxide Nb(1-OC4H9)5.


2004 ◽  
Vol 449-452 ◽  
pp. 997-1000 ◽  
Author(s):  
Gwang Pyo Choi ◽  
Yong Joo Park ◽  
Whyo Sup Noh ◽  
Jin Seong Park

Tin oxide thin films were deposited at 375 °C on α-alumina substrate by metal-organic chemical vapor deposition (MOCVD) process. A number of hillocks on the film were formed after air annealing at 500 °C for 30 min and few things in N2 annealing. The oxygen content and the binding energy after air annealing came to close the stoichiometric SnO2. The cauliflower hillocks of the film seem to be formed by the continuous migration of crystallites from a cauliflower grain on the substrate to release the stress due to the increase of oxygen content and volume.


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