Low-Temperature Atomic Layer Deposition of High Purity, Smooth, Low Resistivity Copper Films by Using Amidinate Precursor and Hydrogen Plasma
2015 ◽
Vol 27
(17)
◽
pp. 5988-5996
◽
Keyword(s):
Keyword(s):
2017 ◽
Vol 29
(15)
◽
pp. 6502-6510
◽
Keyword(s):
Keyword(s):
2014 ◽
Vol 32
(1)
◽
pp. 01A108
◽
2013 ◽
Vol 31
(1)
◽
pp. 01A124
◽
Keyword(s):
Keyword(s):
Keyword(s):
2019 ◽
Vol 45
(6)
◽
pp. 7407-7412
◽
Keyword(s):
2015 ◽
Vol 33
(4)
◽
pp. 041512
◽
Keyword(s):