scholarly journals Direct and High-Throughput Fabrication of Mie-Resonant Metasurfaces via Single-Pulse Laser Interference

ACS Nano ◽  
2020 ◽  
Vol 14 (5) ◽  
pp. 6138-6149 ◽  
Author(s):  
Jonas Berzinš ◽  
Simonas Indrišiūnas ◽  
Koen van Erve ◽  
Arvind Nagarajan ◽  
Stefan Fasold ◽  
...  
Keyword(s):  
Pulse Laser ◽  
High Throughput ◽  
Single Pulse ◽  
Laser Interference

scholarly journals Generation of Surface Energy Patterns by Single Pulse Laser Interference on Self-Assembled Monolayers

Langmuir ◽  
2008 ◽  
Vol 24 (22) ◽  
pp. 13155-13160 ◽  
Author(s):  
T. Geldhauser ◽  
P. Leiderer ◽  
J. Boneberg ◽  
S. Walheim ◽  
Th. Schimmel
Keyword(s):  
Surface Energy ◽  
Pulse Laser ◽  
Single Pulse ◽  
Self Assembled Monolayers ◽  
Laser Interference ◽  
Assembled Monolayers ◽  
Self Assembled

scholarly journals Micro- and Submicrostructuring Thin Polymer Films with Two and Three-Beam Single Pulse Laser Interference Lithography

Langmuir ◽  
2014 ◽  
Vol 30 (29) ◽  
pp. 8973-8979 ◽  
Author(s):  
Ignacio Martín-Fabiani ◽  
Stephen Riedel ◽  
Daniel R. Rueda ◽  
Jan Siegel ◽  
Johannes Boneberg ◽  
...  
Keyword(s):  
Pulse Laser ◽  
Polymer Films ◽  
Single Pulse ◽  
Interference Lithography ◽  
Laser Interference Lithography ◽  
Thin Polymer Films ◽  
Laser Interference ◽  
Thin Polymer

scholarly journals Thermal dynamic analysis of picosecond and nanosecond single pulse laser flash-heating of Al/NC nanoenergetic composites

2009 ◽  
Vol 58 (1) ◽  
pp. 655
Author(s):  
Peng Ya-Jing ◽  
Liu Yu-Qiang ◽  
Wang Ying-Hui ◽  
Zhang Shu-Ping ◽  
Yang Yan-Qiang
Keyword(s):  
Dynamic Analysis ◽  
Pulse Laser ◽  
Single Pulse ◽  
Laser Flash

Numerical Study on Bending Behavior of Copper Alloy Thin Plate by Single Pulse Laser

2014 ◽  
Vol 1003 ◽  
pp. 113-116
Author(s):  
Su Qin Jiang ◽  
Ai Hui Liu ◽  
Xue Ting Wang ◽  
Jian Hua Wu ◽  
Bo Kui Li
Keyword(s):  
Thin Plate ◽  
Pulse Laser ◽  
Copper Alloy ◽  
Numerical Study ◽  
Dynamic Change ◽  
Single Pulse ◽  
Coupling Model ◽  
Laser Forming ◽  
Bottom Surface ◽  
Mechanical Coupling

To study the bending characteristics of copper alloy thin plate by single pulse laser, the thermal mechanical coupling model of pulsed laser forming (PLF) was established; the dynamic change and steady distribution for the fields of temperature, stress& strain and displacement were analyzed. The results show n that during the pulse laser heating stage, the temperature gradient along the thickness direction is far less than that of the heat affected zone; due to the constraints of materials around the heating field, the compressive stress and negative strain are appeared, the cantilever end of sample produces warping deformations; in the cooling stage, the temperature of top and bottom surface material drops rapidly, the sample is with a negative bending and reduced deformation. This is related to the transferring of the stress change and the recovery of part of the elastic deformation in heating area.

Single-pulse laser-induced decomposition of trifluoromethylsilane

1991 ◽  
Vol 178 (2-3) ◽  
pp. 192-196 ◽  
Author(s):  
J. Pola ◽  
H. Beckers ◽  
H. Bürger
Keyword(s):  
Pulse Laser ◽  
Single Pulse ◽  
Induced Decomposition
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