Abstract
The ceramic thick-film technology allows the build-up of miniaturised and robust integrated multilayer-circuits and sensors by means of sequential screen-printing and firing of different functional materials. However, the manufacturing of integrated electronics does not succeed if the components are temperature sensitive or too large for the process in a sintering furnace. At present, large components like wind power rotors, axles or roller bearings are monitored by vulnerable hybrid sensor systems. In order to implement the advantages of integrated devices, like the direct surface contact and the high thermomechanical stability, functional ceramic-based materials are adapted or newly developed to accommodate the needs of laser sintering techniques of printed sensor layers on structural components. In a first approach, screen printed thick films on steel components are investigated. The defect-free densification of functional layers crucially depends on the particular material composition in combination with adapted laser treatment. A first generation of functional layers is presented, comprising isolating, conductive, and resistive electrical materials. The films are tested in demonstrator setups and show functional properties comparable to those of the furnace sintering technology. Future aspects of material optimization and the adaption to specific application requirements will be discussed.
Highly Conductive Ceramics with Multiple Types of Mobile Charge Carriers