scholarly journals Surface modification of a BN/ETDS composite with aniline trimer for high thermal conductivity and excellent mechanical properties

RSC Advances ◽  
2018 ◽  
Vol 8 (40) ◽  
pp. 22846-22852 ◽  
Author(s):  
Seokgyu Ryu ◽  
Taeseob Oh ◽  
Jooheon Kim
Keyword(s):  
Mechanical Properties ◽  
Thermal Conductivity ◽  
Surface Modification ◽  
Boron Nitride ◽  
Polymer Composites ◽  
Conductive Polymer ◽  
High Thermal Conductivity ◽  
Conductive Polymer Composites ◽  
Thermally Conductive

Boron nitride (BN) particles surface-treated with different amounts of aniline trimer (AT) were used to prepare thermally conductive polymer composites with epoxy-terminated dimethylsiloxane (ETDS).

scholarly journals The combination of Al2O3 and BN for enhancing the thermal conductivity of PA12 composites prepared by selective laser sintering

RSC Advances ◽  
2021 ◽  
Vol 11 (4) ◽  
pp. 1984-1991
Author(s):  
Yue Yuan ◽  
Wei Wu ◽  
Huanbo Hu ◽  
Dongmei Liu ◽  
Hui Shen ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Thermal Conductivity ◽  
Polymer Composites ◽  
Selective Laser Sintering ◽  
Conductive Polymer ◽  
High Thermal Conductivity ◽  
Complex Structures ◽  
Conductive Polymer Composites ◽  
Hybrid Fillers ◽  
Thermally Conductive

The introduction of hybrid fillers in SLS technology is an effective method for the manufacture of thermally conductive polymer composites with high thermal conductivity, complex structures and good mechanical properties.

Construction of 3D aluminum flake framework by sponge template to prepare thermally conductive polymer composites

2021 ◽  
Author(s):  
Baojie Wei ◽  
xi cheng ◽  
Shuangqiao Yang
Keyword(s):  
Thermal Conductivity ◽  
Polymer Composites ◽  
Thermal Management ◽  
Conductive Polymer ◽  
Ceramic Materials ◽  
Electrical Systems ◽  
Conductive Polymer Composites ◽  
Management Application ◽  
Thermally Conductive ◽  
Aluminum Flake

Ceramic-based polymer composites with high thermal conductivity and electrically insulation has been wildly used in modern electrical systems for thermal management application. Compared with ceramic materials, metals usually exhibit better...

scholarly journals Thermal Conductance of Epoxy/Alumina Interfaces

2021 ◽  
Vol 2133 (1) ◽  
pp. 012002
Author(s):  
Wei Yang ◽  
Yun Chen ◽  
Yipeng Zhang ◽  
Yongsheng Fu ◽  
Kun Zheng ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Polymer Composites ◽  
Polymer Matrix ◽  
Time Domain ◽  
Conductive Polymer ◽  
Thermal Conductance ◽  
Interfacial Thermal Conductance ◽  
Piranha Solution ◽  
Conductive Polymer Composites ◽  
Thermally Conductive

Abstract The interfacial thermal conductance (ITC) between filler and polymer matrix is considered as one of the important factors that limits the thermal conductivity of thermally conductive polymer composites. The effect of two different surface treatments (piranha solution and plasma) on ITC of epoxy/alumina was investigated using Time-domain thermoreflectance method (TDTR). The TDTR results show that compared with non-treated samples, the ITC of samples treated by piranha solution and plasma increased 2.9 times and 3.4 times, respectively. This study provides guidance for improving the thermal conductivity of thermally conductive polymer composites.

scholarly journals Recent Advances in Preparation, Mechanisms, and Applications of Thermally Conductive Polymer Composites: A Review

2020 ◽  
Vol 4 (4) ◽  
pp. 180
Author(s):  
Hao Zhang ◽  
Xiaowen Zhang ◽  
Zhou Fang ◽  
Yao Huang ◽  
Hong Xu ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Polymer Composites ◽  
Thermal Conduction ◽  
Heat Dissipation ◽  
Conductive Polymer ◽  
Electronic Equipment ◽  
Functional Surface ◽  
Element Analysis ◽  
Conductive Polymer Composites ◽  
Thermally Conductive

At present, the rapid accumulation of heat and the heat dissipation of electronic equipment and related components are important reasons that restrict the miniaturization, high integration, and high power of electronic equipment. It seriously affects the performance and life of electronic devices. Hence, improving the thermal conductivity of polymer composites (TCPCs) is the key to solving this problem. Compared with manufacturing intrinsic thermally conductive polymer composites, the method of filling the polymer matrix with thermally conductive fillers can better-enhance the thermal conductivity (λ) of the composites. This review starts from the thermal conduction mechanism and describes the factors affecting the λ of polymer composites, including filler type, filler morphology and distribution, and the functional surface treatment of fillers. Next, we introduce the preparation methods of filled thermally conductive polymer composites with different filler types. In addition, some commonly used thermal-conductivity theoretical models have been introduced to better-analyze the thermophysical properties of polymer composites. We discuss the simulation of λ and the thermal conduction process of polymer composites based on molecular dynamics and finite element analysis methods. Meanwhile, we briefly introduce the application of polymer composites in thermal management. Finally, we outline the challenges and prospects of TCPCs.

scholarly journals Breaking Through Bottlenecks for Thermally Conductive Polymer Composites: A Perspective for Intrinsic Thermal Conductivity, Interfacial Thermal Resistance and Theoretics

2021 ◽  
Vol 13 (1) ◽  
Author(s):  
Junwei Gu ◽  
Kunpeng Ruan
Keyword(s):  
Thermal Conductivity ◽  
Thermal Resistance ◽  
Polymer Composites ◽  
Thermal Conduction ◽  
Conductive Polymers ◽  
Rapid Development ◽  
Conductive Polymer ◽  
Interfacial Thermal Resistance ◽  
Conductive Polymer Composites ◽  
Thermally Conductive

AbstractRapid development of energy, electrical and electronic technologies has put forward higher requirements for the thermal conductivities of polymers and their composites. However, the thermal conductivity coefficient (λ) values of prepared thermally conductive polymer composites are still difficult to achieve expectations, which has become the bottleneck in the fields of thermally conductive polymer composites. Aimed at that, based on the accumulation of the previous research works by related researchers and our research group, this paper proposes three possible directions for breaking through the bottlenecks: (1) preparing and synthesizing intrinsically thermally conductive polymers, (2) reducing the interfacial thermal resistance in thermally conductive polymer composites, and (3) establishing suitable thermal conduction models and studying inner thermal conduction mechanism to guide experimental optimization. Also, the future development trends of the three above-mentioned directions are foreseen, hoping to provide certain basis and guidance for the preparation, researches and development of thermally conductive polymers and their composites.

Manipulating thermal conductivity of polyimide composites by hybridizing micro- and nano-sized aluminum nitride for potential aerospace usage

2019 ◽  
Vol 33 (8) ◽  
pp. 1017-1029 ◽  
Author(s):  
Honglin Luo ◽  
Jikui Liu ◽  
Zhiwei Yang ◽  
Quanchao Zhang ◽  
Haiyong Ao ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Thermal Conductivity ◽  
Aluminum Nitride ◽  
Conductive Polymer ◽  
Total Content ◽  
Thermally Conductive ◽  
Polyimide Composites ◽  
First Time ◽  
Dielectric And Mechanical Properties ◽  
Simple Economic

Electrically insulating yet thermally conductive polymer-based composites are highly sought after in aerospace field. In this work, for the first time, electrically insulating but thermally conductive polyimide (PI) composites are fabricated by simultaneously incorporating micro- and nano-sized aluminum nitride (AlN) particles via a simple, economic, and scalable method of ball milling and subsequent hot-pressing process. The thermal conductivity, dielectric, and mechanical properties of the PI composites depend on the ratio of micro-sized AlN (m-AlN) to nano-sized AlN (n-AlN) and the total content of AlN in the PI composites. The thermal conductivity of the PI composites with 40 wt% m-AlN and 20 wt% n-AlN is 1.5 ± 0.05 W·m−1·K−1, which is 10 times higher than that of bare PI. The PI composites hold a great potential in aerospace industries.

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